Plasma Enhanced-Low Temperature Silicon Oxide Bonding with Self-Alignment Effect between Hydrophilic Surfaces for Multi-Chip Packaging (친수성 표면의 자가정렬 효과와 플라즈마를 이용한 MCP 용 저온 실리콘 Oxide 접합 방법)
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- Proceedings of the Korean Society of Precision Engineering Conference
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- 2009.10a
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- pp.687-688
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- 2009