• Journal of the Korean Society of Propulsion Engineers
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• v.3 no.1
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• pp.86-94
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• 1999

Measured shock wave effects were investigated by changing shock strength and position with particular emphasis on the stability limits of hydrogen-air jet flames. For this purpose, a supersonic nonpremixed, jet-like flame was stabilized along the axis of a Mach 2.5 wind tunnel, and wedges were mounted on the sidewall in order to interact oblique shock waves with the flame. This experiment was the first reacting flow experiment interacting with shock waves. Schilieren visualization pictures, wall static pressures, and flame stability limits were measured and compared to corresponding flames without shock-flame interaction. Substantial improvements in the flame stability limits were achieved by properly interacting the shock waves with the flameholding recirculation zone. The reason for the significant improvement in flame stability limits is believed to be the adverse pressure gradient caused by the shock, which can elongate the recirculation zone.

• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.4
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• pp.462-470
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• 2015

In this study, we analyze the impacts of the trapezoidal fin shape of a double-gate FinFET on the electrical characteristics of circuits. The trapezoidal nature of a fin body is generated by varying the angle of the sidewall of the FinFET. A technology computer-aided-design (TCAD) simulation shows that the on-state current increases, and the capacitance becomes larger, as the bottom fin width increases. Several circuit performance metrics for both digital and analog circuits, such as the fan-out 4 (FO4) delay, ring oscillator (RO) frequency, and cut-off frequency, are evaluated with mixed-mode simulations using the 3D TCAD tool. The trapezoidal nature of the FinFET results in different effects on the driving current and gate capacitance. As a result, the propagation delay of an inverter decreases as the angle increases because of the higher on-current, and the FO4 speed and RO frequency increase as the angle increases but decrease for wider angles because of the higher impact on the capacitance rather than the driving strength. Finally, the simulation reveals that the trapezoidal angle range from $10^{\circ}$ to $20^{\circ}$ is a good tradeoff between larger on-current and higher capacitance for an optimum trapezoidal FinFET shape.

• Proceedings of the Korean Geotechical Society Conference
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• 2004.03b
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• pp.407-414
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• 2004

Interfacial properties between rock mass and shotcrete play a significant role in the transmission of loads from the ground to shotcrete. These properties have a major effect on the behaviours of rock mass and shotcrete. They, however, have merely been assumed in most of numerical analyses, and little care has been taken in identifying them. This paper aimed to identify interfacial properties including cohesion, tension, friction angle, shear stiffness, and normal stiffness, through direct shear tests as well as interface normal compression tests for shotcrete/rock cores obtained from a tunnel sidewall. Mechanical properties such as compression strength and elastic modulus were also measured to compare them with the time-dependent variation of interfacial properties. Based on experiments, interfacial properties between rock and shotcrete showed a significant time-dependent variation similar to those of its mechanical properties. In addition, the time-dependent behaviours of interfacial properties can be well regressed through exponential and logarithmic functions of time.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.6
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• pp.451-455
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• 1999

The highest etch rate of Pt film was obtained at 10% $Cl_2$/90% Ar gas mixing ratio in our previous investigation. However, the problems such as the etch residues(fence) remained on the pattern sidewall, low selectivity to oxide as mask and low etch slope were presented. In this paper, the etching by additive $O_2$ gas to 10% $Cl_2$/90% Ar gas base was examined. As a result, the fence-free pattern and higher etch slope as about 60$^{\circ}$was observed and the selectivity to oxide increased to 2.4 without decreasing of the etch rate $1500{\AA}$/min. XPS surface analysis proved that a only little $O_2$ gas removes the Pt-CI compounds as residues on the etched surface.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.5
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• pp.353-357
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• 2010

Recently, silicon etching have received much attention for display industry, nano imprint technology, silicon photonics, and MEMS application. After the etching process, removing of etch mask and residue of sidewall is very important. The investigation of the etched mask removing was carried out by using the ashing, HF dipping and acid cleaning process. Experiment shows that oxygen component of reactive gas and photoresist react with silicon and converting them into the mask fence. It is very difficult to remove by using ashing or acid cleaning process because mask fence consisted of Si and O compounds. However, dilute HF dipping is very effective process for SiOx layer removing. Finally, we found optimized condition for etched mask removing.

• Proceedings of the IEEK Conference
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• 2001.06b
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• pp.25-28
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• 2001

In this paper, we have investigated the effects of gas flow rate, rf power, process pressure and Ar addition on reactive ion etching of InP, InGaAs and InAlAs using Sic14 and Cl$_2$ gases. The etch rates were measured by using a surface profiler. The etched profiles, sidewall roughness, and surface morphology were observed by scanning electron microscopy and by atomic force microscopy. The selective etching of InGaAs to InP and InAlAs was studied by varying the etching parameters. It was found that Cl$_2$ gas is more efficient for the selective etching of InGaAs to InAlAs than SiCl$_4$ gas. The etch selectivity of InGaAs to InAlAs is strongly dependent on the rf power and the process pressure.

• Journal of the Korean Society of Visualization
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• v.6 no.2
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• pp.14-19
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• 2008

In this paper, the recirculation flow motion and mixing characteristics driven by air bubble flow in a rectangular water tank is studied. The Time-resolved PIV technique is adopted for the quantitative visualization and analysis. 532 nm Diode CW laser is used for illumination and orange fluorescent particle images are acquired by a PCO 10bit high-speed camera. To obtain clean particle images, 545 nm long pass optical filter and an image intensifier are employed and the flow rates of compressed air is changed from 2 l/min to 4 l/min at 0.5 MPa. The recirculation and mixing flow field is further investigated by the POD analysis technique. It is observed that the large scale counterclockwise rotation and main vortex is generated in the upper half depth from the free surface and one quarter width from the sidewall. When the flow rates are increased, the main vortex core is moved to the side and bottom wall direction.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.963-966
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• 2000

Plasma display panel (PDP) is a type of flat panel display utilizing the light emission that is produced by gas discharge. Barrier Ribs of PDP separating each sub-pixel prevents optical and electrical crosstalk from adjacent sub-pixels. Mold for forming barrier ribs has been newly researched to overcome the disadvantages of conventional manufacturing process such as screen printing, sand-blasting and photosensitive glass methods. Mold for PDP barrier ribs have stripes of micro grooves transferring stripes of glass-material wall. In this paper. Stripes of grooves of which width 48 um, depth 124um, pitch 274um was acquired by machining the material of WC with dicing saw blade. Maximum roughness of the bottom and sidewall of the grooves was respectively 120 nm, 287 nm. Maximum tilt angle caused by difference between upper-most width and lower-most width was 2$^{\circ}$. Maximum Radius of curvature of bottom was 7.75 ${\mu}{\textrm}{m}$. This results meets the specification for barrier ribs of 50 inch XGA PDP. Forming the glass paste will be followed by using mold in the near future.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.8
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• pp.54-61
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• 2003

The first stage rotating blade of industrial gas turbine is one of the components that is normally run in exposed state at the highest temperature of the combustion gas stream. For this reason superior materials and advanced cooling technology are required to allow higher heat resisting characteristics of the component. The 1st stage blade of a selected commercial gas turbine blade made of directionally solidified Ni-based superalloy has a row of cooling holes on its trailing edge. In most cases, minor cracks have been found at some of the root cooling holes after one cycle operation (24,000 hrs) or even shorter operation time because of the high temperature gradient and the frequently alternating thermal stress. In the repair process, unfortunately, it is usually very difficult to get rid of the damage due to the fact that cracks are initiated at the root cooling hole and propagated deep into the hole. In this study, the feasibility of removing the sidewall cracks in the hole by utilizing EDM drilling has been investigated. Also the criteria of surface integrity for EDM drilling were established to achieve high quality repair as well as machining accuracy.

• Journal of Ocean Engineering and Technology
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• v.34 no.4
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• pp.245-252
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• 2020

Wave run-up is an important phenomenon that should be considered in ocean structure design. In this study, the wave run-up of a surface-piercing circular cylinder was calculated in the time domain using the three-dimensional linear and fully nonlinear numerical wave tank (NWT) techniques. The NWT was based on the boundary element method and the mixed Eulerian and Lagrangian method. Stokes second-order waves were applied to evaluate the effect of the nonlinear waves on wave run-up, and an artificial damping zone was adopted to reduce the amount of reflected and re-reflected waves from the sidewall of the NWT. Parametric studies were conducted to determine the effect of wavelength, wave steepness, and the draft of the cylinder on the wave run-up of the cylinder. The maximum wave run-up value occurred at 0°, which was in front of the cylinder, and the minimum value occurred near the circumferential angle of 135°. As the diffraction parameter increased, the wave run-up increased up to 1.7 times the wave height. Furthermore, the wave run-up was 4% higher than the linear wave when the wave steepness was 1/35. In particular, the crest height of the wave run-up increased by 8%.