• 제목/요약/키워드: SiOF Thin Film

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A1-1%Si 박막배선에서 엘렉트로마이그레이션 현상에 미치는 절연보호막 효과 (Dielectric passivation effects on the electromigration phenomena in Al-1%Si thin film interconnections)

  • 김경수;김진영
    • 한국진공학회지
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    • 제10권1호
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    • pp.27-30
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    • 2001
  • 절연보호막 처리된 Al-1%Si 박막배선에서 DC와 PDC 조건하에서의 Electromigration 현상에 관하여 조사하였다. $SiO_2$와 PSG/$SiO_2$ 절연보호막 층을 갖는 박막배선은 표준 사진식각 공정으로 제작되었고, 테스트라인 길이는 100, 400, 800, 1200, 1600 $\mu\textrm{m}$이다. Al-l%Si 박막배선에 고정된 전류밀도 $1.19\times10^7\textrm{A/cm}^2$의 DC와 duty factor가 0.5인 1Hz의 주파수에 고정된 전류밀도 $1.19\times10^7\textrm{A/cm}^2$의 PDC를 인가하였다. Electromigration 테스트에서 PSG/$SiO_2$ 절연보호막 시편의 Electromigration 저항성이 $SiO_2$ 절연보호막 시편보다 우수함을 알 수 있었다. PDC 에서 박막 배선의 수명이 DC 보다 2-4배 정도 길게 나타났으며, 박막 배선의 길이가 증가 할 수록 수명이 감소하다가 임계길이 이상에서 포화되는 경향을 보인다. Electromigration에 의한 결함 형태로는 전기적 개방을 야기시키는 보이드와 전기적 단락을 야기시키는 힐록이 지배적이다.

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PZT 박막제조시 하부전극과 buffer층에 따른 박막특성에 관한 연구 (Characteristics of PZT thin films with varying the bottom-electrodes and buffer layer)

  • 이희수;오근호
    • 한국결정성장학회지
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    • 제6권2호
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    • pp.177-184
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    • 1996
  • 본연구에서는 금속타겟을 이용한 반응성 스퍼터링법을 이용하여 PZT 박막의 전극 및 계면 특성의 개선을 위해, $Pt/SiO_{2}/Si$$Ir/SiO_{2}/Si$기판을 각각 사용하였으며, buffer layer로는 $PbTiO_{3}$을 이용하였다. Pt하부전극을 이용하여 PZT 박막제조시 randomly oriented PZT 박막이 얻어졌으나, buffer layer를 이용한 경우 (100)으로 배향된 결정성이 좋은 PZT 박막을 얻을 수 있었다. Ir하부전극을 이용한 경우, buffer layer증착에 따른 PZT 박막의 상형성이 다소 증진되었으며, Pt하부전극의 경우에 비해 잔류분극의 증가와 항전계의 감소를 관찰할 수 있었다. PZT 박막제조시 buffer layer의 이용에 따라 유전율이 증가함을 알 수 있었으며, 또한 Ir하부전극의 경우가 Pt하부전극의 경우보다 더 좋은 유전특성이 얻어졌다.

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a-Si 막의 Band-gap과 Deposition-rate간의 비선형 거동을 통한 플라즈마 영역의 경계 규명 (Differentiating Plasma Regions Through the non-Linear Relationship between the Band-gap and the Deposition-rate of a-Si Thin Films)

  • 박성렬;김희원;김상덕;김종환;김범성;이돈희
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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    • pp.72.1-72.1
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    • 2010
  • Thin film a-Si solar cells deposited by PECVD have many advantages compared to the traditional crystalline Si solar cells. They do not require expensive Si wafer, the process temperature is relatively low, possibility of scaling up for mass production, etc. In order to produce thin film solar cells, understanding the relationship between the material characteristics and deposition conditions is important. It has been reported by many groups that the band gap of the a-Si material and the deposition rate has an linear relationship, when RF power is used to control both. However, when the process pressure is changed in order to control the deposition rate and the band gap, a diversion from the well known linear relationship occurs. Here, we explain this diversion by the deposition condition crossing different plasma regions in the Paschen curve with a simple model. This model will become a guide to which condition a-Si thin films must be fabricated in order to get a high quality film.

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Fabrication and Characterization of Ni-Cr Alloy Thin Films for Application to Precision Thin Film Resistors

  • Lee, Boong-Joo;Shin, Paik-Kyun
    • Journal of Electrical Engineering and Technology
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    • 제2권4호
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    • pp.525-531
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    • 2007
  • Ni(75 wt.%)-Cr(20 wt.%)-Al(3 wt.%)-Mn(4 wt.%)-Si(1 wt.%) alloy thin films were prepared using the DC magnetron sputtering process by varying the sputtering conditions such as power, pressure, substrate temperature, and post-deposition annealing temperature in order to fabricate a precision thin film resistor. For all the thin film resistors, sheet resistance, temperature coefficient of resistance (TCR), and crystallinity were analyzed and the effects of sputtering conditions on their properties were also investigated. The oxygen content and TCR of Ni-Cr-Al-Mn-Si resistors were decreased by increasing the sputtering pressure. Their sheet resistance, TCR, and crystallinity were enhanced by elevating the substrate temperature. In addition, the annealing of the resistor thin films in air at a temperature higher than $300^{\circ}C$ lead to a remarkable rise in their sheet resistance and TCR. This may be attributed to the improved formation of NiO layer on the surface of the resistor thin film at an elevated temperature.

펄스 레이저 증착법에 의해 제작된 ZnO-Si-ZnO 다층 박막의 특성 연구 (Characteristics Investigation of ZnO-Si-ZnO Multi-layer Thin Films Fabricated by Pulsed Laser Deposition)

  • 강홍성;강정석;심은섭;방성식;이상렬
    • 한국전기전자재료학회논문지
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    • 제16권1호
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    • pp.65-69
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    • 2003
  • ZnO-Si-ZnO multi-layer thin films have been deposited by pulsed laser deposition (PLD). And then, the films have been annealed at 300$^{\circ}C$ in oxygen ambient pressure. Peak positions of ultraviolet (UV) and visible region were changed by addition of Si layer. Mobility of the films was improved slightly than ZnO thin film without Si layer. The structural property changed by inserting intermediate Si layer in ZnO thin film. The optical properties and structural properties of ZnO-Si-ZnO multi-layer thin films were characterized by PL(Photoluminescence) and XRB(X-ray diffraction) method, respectively. Electrical properties were measured by van der Pauw Hall measurements

PLT(28) 박막의 제작과 전기적 특성에 관한 연구 (Preparation and Electrical properties of the PLT(28) Thin Film)

  • 강성준;정양희
    • 한국정보통신학회:학술대회논문집
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    • 한국해양정보통신학회 2002년도 추계종합학술대회
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    • pp.784-787
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    • 2002
  • Sol-gel 법으로 PLT(28) 박막을 제작하여, 박막의 구조적 및 전기적 특성을 조사하였다. XRD와 AFM 관찰결과, $650^{\circ}C$에서 annealing 된 박막은 완전한 perovskite 구조를 가지며 표면거칠기도 22$\AA$ 으로 양호한 값을 나타내었다. Pt/TiO$_{x}$SiO2/Si 기판위에 PLT(28) 박막을 증착시켜 planar 형태의 캐패시터를 제작하여 전기적 특성을 조사하였다. 그 결과, PLT(28) 박막은 상유전상을 가지며,10kHz에서 비유전률과 유전손실은 761 과 0.024 이었다. 또, 5V에서 전하축적 밀도와 누설전류밀도는 각각 134fC/$\mu$m2 과 1.01 $\mu$A/cm2 이었다. 이로부터, PLT(28) 박막이 차세대 DRAM 용 캐패시터 절연막으로 사용될 수 있는 유망한 재료라고 생각된다.다.

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그라파이트 기판을 이용한 유연 박막 실리콘 태양전지 특성 향상 (Performance Improvement of Flexible Thin Film Si Solar Cells using Graphite Substrate)

  • 임경열;조준식;장효식
    • 한국재료학회지
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    • 제29권5호
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    • pp.317-321
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    • 2019
  • We investigated the characteristics of nano crystalline silicon(nc-Si) thin-film solar cells on graphite substrates. Amorphous silicon(a-Si) thin-film solar cells on graphite plates show low conversion efficiency due to high surface roughness, and many recombination by dangling bonds. In previous studies, we deposited barrier films by plasma enhanced chemical vapor deposition(PECVD) on graphite plate to reduce surface roughness and achieved ~7.8 % cell efficiency. In this study, we fabricated nc-Si thin film solar cell on graphite in order to increase the efficiency of solar cells. We achieved 8.45 % efficiency on graphite plate and applied this to nc-Si on graphite sheet for flexible solar cell applications. The characterization of the cell is performed with external quantum efficiency(EQE) and current density-voltage measurements(J-V). As a result, we obtain ~8.42 % cell efficiency in a flexible solar cell fabricated on a graphite sheet, which performance is similar to that of cells fabricated on graphite plates.

Dielectric Passivation and Geometry Effects on the Electromigration Characteristics in Al-1%Si Thin Film Interconnections

  • Kim, Jin-Young
    • Journal of Korean Vacuum Science & Technology
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    • 제5권1호
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    • pp.11-18
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    • 2001
  • Dielectric passivation effects on the EM(electromigration) have been a great interest with recent ULSI and multilevel structure tends in thin film interconnections of a microelectronic device. SiO$_2$, PSG(phosphosilicate glass), and Si$_3$N$_4$ passivation materials effects on the EM resistance were investigated by utilizing widely used Al-1%Si thin film interconnections. A standard photolithography process was applied for the fabrication of 0.7㎛ thick 3㎛ wide, and 200㎛ ~1600㎛ long Al-1%Si EM test patterns. SiO$_2$, PSG, and Si$_3$N$_4$ dielectric passivation with the thickness of 300 nm were singly deposited onto the Al-1%Si thin film interconnections by using an APCVD(atmospheric pressure chemical vapor deposition) and a PECVD(plasma enhanced chemical vapor deposition) in order to investigate the passivation materials effects on the EM characteristics. EM tests were performed at the direct current densities of 3.2 $\times$ 10$\^$6/∼4.5 $\times$ 10$\^$6/ A/cm$^2$ and at the temperatures of 180 $\^{C}$, 210$\^{C}$, 240$\^{C}$, and 270$\^{C}$ for measuring the activation energies(Q) and for accelerated test conditions. Activation energies were calculated from the measured MTF(mean-time-to-failure) values. The calculated activation energies for the electromigration were 0.44 eV, 0.45 eV, and 0.50 eV, and 0.66 eV for the case of nonpassivated-, Si$_3$N$_4$passivated-, PSG passivated-, and SiO$_2$ passivated Al-1%Si thin film interconnections, respectively. Thus SiO$_2$ passivation showed the best characteristics on the EM resistance followed by the order of PSG, Si$_3$N$_4$ and nonpassivation. It is believed that the passivation sequences as well as the passivation materials also influence on the EM characteristics in multilevel passivation structures.

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Sol-gel 법에 의한 초발수 $SiO_2$ 박막의 제조 및 특성 (Fabrication and properties of superhydrophobic $SiO_2$ thin film by sol-gel method)

  • 김진호;황종희;임태영;김세훈
    • 한국결정성장학회지
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    • 제19권6호
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    • pp.277-281
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    • 2009
  • 초발수 $SiO_2$ 박막을 sol-gel법에 의해 유리 기판 위에 성공적으로 제조하였다. 높은 표면 조도를 갖는 $SiO_2$ 박막을 제조하기 위하여 tetraethoxysilane(TEOS) 용액에 $SiO_2$ 나노 입자들을 첨가하였다. $iO_2$ 입자를 첨가하지 않은 용액을 이용하여 제조한 코팅막은 RMS roughness가 1.27 nm의 매우 평평한 표면 구조를 나타낸 반면, $SiO_2$ 나노 입자들을 1.0, 2.0, 3.0 wt% 첨가한 용액을 이용하여 제조한 $SiO_2$ 박막의 RMS roughness는 44.10 nm, 69.58 nm, 80.66 nm로 측정되었다. 제조된 $SiO_2$ 박막의 표면을 소수성 표면으로 바꾸기 위하여 FAS 용액을 이용하여 발수 처리를 하였다. FAS 처리 이후 거친 표면구조를 갖는 $SiO_2$ 박막의 표면은 친수성에서 소수성으로 바뀌었고 특히, 80.66 nm의 RMS roughness를 갖는 박막은 $163^{\circ}$의 물 접촉각을 갖는 초발수 표면을 나타내었다.

2차 미분 Auger 스펙트럼을 이용한 ONO 초박막의 결합상태에 관한 연구 (A Study on the Chemical State in the ONO Superthin Film by Second Derivative Auger Spectra)

  • 이상은;윤성필;김선주;서광열
    • 한국전기전자재료학회논문지
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    • 제11권10호
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    • pp.778-783
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    • 1998
  • Film characteristics of thin ONO dielectric layers for MONOS(metal-oxide-nitride-oxide-semiconductor) EEPROM was investigated by TEM, AES and AFM. Seocnd derivative spectra of Auger Si LVV overlapping peak provide useful information fot chemical state analysis of superthin film. The ONO film with dimension of tunnel oxide 23$\AA$, nitride 33$\AA$, and blocking oxide 40$\AA$ was fabricated. During deposition of the LPCVD nitride film on tunnel oxide, this thin oxide was nitrized. When the blocking oxide was deposited on the nitride film, the oxygen not only oxidized the nitride surface, but diffused through the nitride. The results of ONO film analysis exhibits that it is made up of $SiO_2$ (blocking oxide)/O-rich SiON(interface)/N-rich SiON(nitride)/ O-rich SiON(tunnel oxide)

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