• 센서학회지
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• 제23권2호
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• pp.73-81
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• 2014

Silicon PIN diode radiation sensors and CMOS readout circuits were designed and fabricated in this study. The PIN diodes were fabricated using a 380-${\mu}m$-thick 4-inch n+ Si (111) wafer containing a $2-k{\Omega}{\cdot}cm$ n- thin epitaxial layer. CMOS readout circuits employed the driving and signal processes in a radiation sensor were mixed with digital logic and analog input circuits. The primary functions of readout circuits are amplification of sensor signals and the generation of the alarm signals when radiation events occur. The radiation sensors and CMOS readout circuits were fabricated in the Institute of Semiconductor Fusion Technology (ISFT) semiconductor fabrication facilities located in Kyungpook National University. The performance of the readout circuit combined with the Si PIN diode sensor was demonstrated.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 하계학술대회 논문집 D
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• pp.2522-2525
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• 2001

Si PIN diodes are subject to be damaged from the exposure of fast neutron by displacement of Si lattice structure. The defects are effective recombination centers for carriers which migrate through the base region of the PIN diode when forward voltage is applied. It causes an increase in current and a decrease in resistivity of the diode. This paper presents the development of a neutron sensor based on displacement damage effect. PIN diodes having various structures were made bymicro-fabrication process, and neutron beam test was performed to identify neutron damage effect to the diode. From a result of the test, it was shown that the forward voltage drop of the diode, at a constant current, has good linearity for neutron dosage. Also it was found that the newton dosage can be measured by the pin diode neutron dosimeter with constant current power.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제52권12호
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• pp.545-552
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• 2003

When a Si PIN diode is exposed to fast neutrons, it results in displacement damage to the Si lattice structure of the diode. Defects induced from structural dislocation become effective recombination centers for carriers which pass through the base of a PIN diode. Hence, increasing the resistivity of the diode decreases the current for the applied forward voltage. This paper involves the development of a neutron sensor based on the phenomena of the displacement effect damaged by neutron exposure. The neutron effect on the semiconductor was analyzed. Several PIN diode arrays with various thickness and cross-section area of the intrinsic layer(I layer) were fabricated. Under irradiation tests with a neutron beam, the manufactured diodes have a good linearity to neutron dose and show that the increase of thickness of I layer and the decrease of cross-section of PIN diodes improve the sensitivity. Newly developed PIN diodes with thicker I layer and various cross section, were retested and then showed the best neutron sensitivity at the condition that the I layer thickness was similar to a side length. On the basis of two test results, final discrete PIN diodes with a rectangular shape were manufactured and the characteristics as neutron detectors were analyzed through the neutron beam test using on-line electronic dosimetry system. Developed PIN diode shows a good linearity as dosimetry in the range of 0 to 1,000cGy(Tissue) and its neutron sensitivity is 13mV/cGy at constant current of 5mA, that is three times higher than that of commercially available neutron detectors. And the device shows little dependency on the orientation of the neutron beam and a considerable stability in annealing test for a long period.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2000년도 추계학술대회 논문집 학회본부 D
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• pp.754-757
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• 2000

Si PIN diodes are subject to be damaged from the exposure of fast neutron by displacement of Si lattice structure. The defects are effective recombination centers for carriers which migrate through the base region of the PIN diode when forward voltage is applied. It causes an increase in current and a decrease in resistivity of the diode. This paper presents the development of a neutron sensor based on displacement damage effect. PIN diodes having various structures were made by micro-fabrication process, and neutron beam test was performed to identify neutron damage effect to the diode. From a result of the test, it was shown that the forward voltage drop of the diode, at a constant current, has good linearity for neutron dosage. Also it was found that the newton dosage can be measured by the pin diode neutron dosimeter with constant current power.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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• pp.1319-1322
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• 2007

Planar PIN photodiode is compatible with LTPS process, and its fabrication requires no additional manufacturing process. In this study we design the optimum dimension of PIN diodes with two nitride layers to improve the efficiency of PIN diodes. The PIN photo sensor shows very good sensitivity to ambient light illuminance.

• Journal of Power Electronics
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• 제13권4호
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• pp.584-591
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• 2013

In this paper, a hybrid booster power module with Si IGBT and Silicon Carbide (SiC) Schottky Barrier Diode (SBDs) is presented. The switching characteristics of the hybrid booster module are compared with commercial Silicon IGBT/Si PIN diode based modules. We applied the booster power module into a non-isolated on board vehicle charger with a simple buck-booster topology. The performances of the on-vehicle charger are analyzed and measured with different power modules. The test data is measured in the same system, at the same points of operation, using the conventional Si and hybrid Si/SiC power modules. The measured power conversion efficiency of the proposed on-vehicle charger is 96.4 % with the SiC SBD based hybrid booster module. The conversion efficiency gain of 1.4 % is realizable by replacing the Si-based booster module with the Si IGBT/SiC SBD hybrid boost module in the 6.6 kW on-vehicle chargers.

• 한국정보통신학회논문지
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• 제18권7호
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• pp.1777-1783
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• 2014

본 연구에서는 전자장비 내방사화 기술의 새로운 효율적 접근방법인 전원제어형 방호장치에서 핵심 기능을 수행하는 고속 반도체 센서를 개발하고 그 특성을 분석하였다. 먼저, 펄스방사선에 의한 다이오드 내부에서의 생성 전하를 계산한 후 TCAD로 모델링하여 $42{\mu}m$ 진성층의 실리콘 에피텍시 웨이퍼 기반의 고속 신호탐지용 PIN 다이오드 센서를 다양한 구조로 설계하였다. PAL의 Test LINAC의 전자빔 변환 감마방사선 4.88E8 rad(Si)/sec에 대한 실측시험에서 소자의 면적에 비례하는 광감도와 응답속도 증가 결과를 얻었으며 포화특성과 소자의 균일성을 기준으로 2mm직경의 센서를 최적으로 판단되었다. 선정 센서를 대상으로 한 펄스감마선 고출력 범위(2.47E8 rad(Si)/sec~6.21E8 rad(Si)/sec)로 선량률 가변시험에서는 개발한 소자가 시험장치의 고 선량률 영역에서 전원제어 신호처리에 충분한 60mA 이상의 광전류 피크값과 함께 350 ns 이하의 고속 응답특성을 가지는 선형적 센서임을 확인하였다.

• 반도체디스플레이기술학회지
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• 제6권2호
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• pp.49-52
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• 2007

Characteristics of an active pixel switch readout circuit were studied by SPICE simulation. A simple readout circuit consists of an operation amplifier, a diode, and a down-counter was suggested, and its successful operation was verified by showing that the differences in the detected signal intensity are accordingly converted to modulation of the voltage pulses generated by the comparator. A scheme to use these pulses to generate the original image was also put forward.

• Journal of Information Display
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• 제12권2호
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• pp.109-113
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• 2011

This paper summarizes the recent fabrication and characterizations of flexible high-speed radio frequency (RF) transistors, PIN-diode single-pole single-throw switches, as well as flexible inductors and capacitors, based on single-crystalline Si nanomembranes transferred on polyethylene terephthalate substrates. Flexible thin-film transistors (TFTs) on plastic substrates have reached RF operation speed with a record cut-off/maximum oscillation frequency ($f_T/f_{max}$) values of 3.8/12 GHz. PIN diode switches exhibit excellent ON/OFF behaviors at high RF frequencies. Flexible inductors and capacitors compatible with high-speed TFT fabrication show resonance frequencies ($f_{res}$) up to 9.1 and 13.5 GHz, respectively. Robust mechanical characteristics were also demonstrated with these high-frequency passives components.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 D
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• pp.2187-2188
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• 2006

본 연구의 목적은 Pspice를 이용하여 SI Thyristor의 구조적인 특징과 스위칭 동작을 설명하면서도 비교적 간략화된 등가모델을 개발하는 것에 있다. 이러한 목표로 등가모델은 SI Thyristor의 구조적 형태에 기반을 두어 BJT 소자를 이용한다. 또 게이트 구조와 스위칭 매커니즘을 고려한 MOSFET, Steady state Turn on 상태에서 dominant 모델인 PIN Diode로 구성되어 있다. 개발된 등가모델을 스너버회로와 함께 스위칭 과도응답을 시뮬레이션하였으며 그 결과는 실제 실험결과와 비교하여 검증하였다. 비교적 간단하게 고안된 회로를 통해 Turn On/off 동작에서 스위칭 특성을 예측할 수 있으므로 펄스파워용 스위치로서 SI Thyristor의 시동특성을 해석하는 데 본 등가모델을 활용할 수 있을 것으로 전망한다.