• Journal of the Korean Society of Propulsion Engineers
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• v.2 no.2
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• pp.88-98
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• 1998

A waveform for shock response spectrum test on a shaker is synthesized using wavelets such that a specified shock response spectrum of a test profile is achieved. The parameters of a wavelet are center frequency, amplitude, number of half cycles, delay and polarity. The amplitude of each wavelet component is iteratively adjusted so a specified shock response spectrum is matched. The waveform so synthesized is regarded as a reference acceleration waveform for a shaker shock response spectrum test. The author proposes the use of a long duration and low peak waveform. The usefulness of this approach is illustrated with some examples.

• Transactions of the Korean Society of Automotive Engineers
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• v.19 no.6
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• pp.90-96
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• 2011

In this study, the characteristic of fractured portion and shape on solder joints were investigated according to the thermal shock test for Automotive Application Component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as Lead-free solder. The value of pull and shear strength was decreased in principle after 432 cycles thermal shock test. In addition, fracture mode was verified by using EDS and SEM to observe fractured shape on the solder joints before and after thermal shock. In before thermal shock test, the fracture mode revealed typically solder layer's fracture mode. In after thermal shock test, we identified multiple fracture mode of the ductile and brittle fracture. Even though same composition of solder was used to experimental for estimating. the fracture mode varied on the fracture portion's height and the directional angles of shear strength. In conclusion, we identified that mechanical strength was affected on the solder layer's fracture mode.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.38 no.11
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• pp.1130-1135
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• 2010

The main function of a landing gear is to absorb the impact energy during touchdown. Most landing gear use an oleo-pneumatic shock absorber which essentially consists of an oil damper and a gas spring. The performance of a shock absorber can be estimated by analysis but it should be verified by drop test, which is required by MIL Spec. and FAR. In the drop test, various data such as ground loads, shock absorber pressure, stroke and mass travel are analyzed to validate the shock absorbing efficiency and the mathematical model for analysis. This paper presents the introduction of drop test facility, the test procedure and data evaluation method with real drop test example.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2001.05a
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• pp.490-495
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• 2001

This paper deals with an analysis and countermeasure for improving the shock performance of laptop computers. The shock analysis is carried out by using the commercial program of LS-DYNA3D. Also the analysis is verified by the measurements from modal tests and shock tests. The available countermeasures are investigated theoretically and experimentally to find the effective methods of reducing the shock acceleration on hard disk driver during one side fall test. The hard disk drive is the most sensitive part in a laptop computer. This research shows the effects of the spring constant of rubber pad, the reinforcement of mechanical parts and the location of a hard disk driver, on the shock reduction.

• Structural Engineering and Mechanics
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• v.28 no.3
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• pp.335-352
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• 2008

Continuous operation of test and measurement is a new operating technique in the petroleum exploitation, which combines perforation with test and measurement effectively. In order to measure the original pressure of stratum layer exactly and prevent testing instrument from being impaired or damaged, a suitable shock absorber is urgently necessary to research. Based on the attempt on the FEM analysis and experiment research, a new shock absorber is designed and discussed in this paper. 3D finite element model is established and simulated accurately by LS-DYNA, the effect and the dynamic character of the shock absorber impact by half sinusoidal pulse force under the main lobe frequency are discussed both on theoretics and experiment. It is shown that the new designed shock absorber system has good capability of shock absorption for the impact load.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2019.05a
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• pp.151-152
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• 2019

This study length variation test, shock test were conducted to evaluate the performance of synthetic resin form. Results of both thermal length variation test and shock test satisfied the KS standards. for length variation test, the result of the horizontal and vertical valuse were -0.1% in average.

• Journal of the Korean Ceramic Society
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• v.36 no.10
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• pp.1062-1068
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• 1999

The flexural strength distribution of alumina ceramics was observed using ball-on-3 ball test after thermal shock into the distilled water of 25$^{\circ}C$ Crack distribution was also observed by dye-penetration after thermal shock test. Fracture probability of alumina ceramics by ball-on-3 ball test was studied and compared with that by 3-point bending test. The crack distance from the center of thespecimen showed the stronger effect on the flexural strength by ball-on-3 ball test than the crack density.

• Journal of the Society of Naval Architects of Korea
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• v.57 no.6
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• pp.322-330
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• 2020

This study deals with underwater explosion (UNDEX) characteristics of various non-explosive underwater shock sources for the development of non-explosive underwater shock testing devices. UNDEX can neutralize ships' structure and the equipment onboard causing serious damage to combat and survivability. The shock proof performance of naval ships has been for a long time studied through simulations, but full-scale Live Fire Test and Evaluation (LFT&E) using real explosives have been limited due to the high risk and cost. For this reason, many researches have been tried to develop full scale ship shock tests without using actual explosives. In this study, experiments were conducted to find the characteristics of the underwater shock waves from actual explosive and non-explosive shock sources such as the airbag inflators and Vaporizing Foil Actuator (VFA). In order to derive the empirical equation for the maximum pressure value of the underwater shock wave generated by the non-explosive impact source, repeated experiments were conducted according to the number and distance. In addition, a Shock Response Spectrum (SRS) technique, which is a frequency-based function, was used to compare the response of floating bodies generated by underwater shock waves from each explosion source. In order to compare the magnitude of the underwater shock waves generated by each explosion source, Keel Shock Factor (KSF), which is a measure for estimating the amount of shock experienced by a naval ship from an underwater explosionan, was used.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.8
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• pp.611-616
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• 2010

This study investigated the characteristics of fracture behavior and mode on solder joints before and after thermal shock test for automotive application component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as lead-free solder. The shear strength was decreased with thermal cycle number, after 432 cycles of thermal shock test. In addition, fracture mode was verified to ductile, brittle fracture and base materials fracture such as different kind fractured mode using SEM and EDS. Before the thermal shock, the fractured mode was found to typical ductile fracture in solder layer. After thermal shock test, especially, Ag was found on fractured portion as roughest surface. Moreover, it occurred delamination between a PCB and a Cu land. Before thermal shock test, most of fractured mode in solder layer has dimples by ductile fracture. However, after thermal shock test, the fractured mode became a combination of ductile and brittle fracture, and it also could find that the fracture behavior varied including delamination between substrate and Cu land.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.45-52
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• 2011

It is known that test methods to evaluate solder joint reliability are die shock test, die shear test, 3points bending test, and thermal shock test. The present study investigated the effects of failure mode on 3 types (as-reflowed, $85^{\circ}C$/85%RH treatment, and $150^{\circ}C$/10hr aging) of solder joints for flip-chip BGA package by using various test methods. The test methods and configurations are reported in detail, i.e. die shock, die shear, 3points bending, and thermal shock test. We focus on the failure mode of solder joints under various tests. The test results indicate that die shock and die shear test method can reveal brittle fracture in flip-chip ball grid array (FCBGA) packages with higher sensitivity.