• 한국추진공학회지
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• 제2권2호
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• pp.88-98
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• 1998

충격반응 스펙트럼 시험을 수행하기 위한 가진기의 파형이 웨이브레트들을 이온하여 시험규격에서 규정한 충격반응 스펙트럼을 만족하도록 합성된다. 웨이브레트의 매개변수는 중간주파수, 진폭, 반파의 개수, 지연시간 그리고 극성이다. 시험규격에서 규정한 충격반응 스펙트럼과 정합이 되도록 각 웨이브레트의 진폭은 반복하여 조절된다. 이렇게 합성된 파형은 가진기를 이용한 충격반응 스펙트럼 시험의 참조 가속도 파형으로 간주된다. 본 연구에서는 충격 지속시간을 길게 하여 첨두치가 작은 파형을 제안한다. 몇 가지 사례를 통하여 이 방법의 유용성이 확인되었다.

• 한국자동차공학회논문집
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• 제19권6호
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• pp.90-96
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• 2011

In this study, the characteristic of fractured portion and shape on solder joints were investigated according to the thermal shock test for Automotive Application Component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as Lead-free solder. The value of pull and shear strength was decreased in principle after 432 cycles thermal shock test. In addition, fracture mode was verified by using EDS and SEM to observe fractured shape on the solder joints before and after thermal shock. In before thermal shock test, the fracture mode revealed typically solder layer's fracture mode. In after thermal shock test, we identified multiple fracture mode of the ductile and brittle fracture. Even though same composition of solder was used to experimental for estimating. the fracture mode varied on the fracture portion's height and the directional angles of shear strength. In conclusion, we identified that mechanical strength was affected on the solder layer's fracture mode.

• 한국항공우주학회지
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• 제38권11호
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• pp.1130-1135
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• 2010

착륙장치는 완충장치를 이용하여 항공기 착륙 시의 충격을 흡수하는 역할을 한다. 다양한 종류의 완충장치가 존재하나, 완충효율 측면에서 가장 우수한 것은 유공압 방식이다. 착륙장치의 완충 성능은 반드시 낙하시험을 통해 입증하여야 하며, 이는 미 군사규격, 미연방 항공규정 등에서 공통적으로 요구하는 있는 사항이다. 이 논문에서는 낙하시험을 위한 설비 구성, 시험 절차 및 결과분석 방법을 실제 낙하시험 사례와 함께 제시한다.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2001년도 춘계학술대회논문집
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• pp.490-495
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• 2001

This paper deals with an analysis and countermeasure for improving the shock performance of laptop computers. The shock analysis is carried out by using the commercial program of LS-DYNA3D. Also the analysis is verified by the measurements from modal tests and shock tests. The available countermeasures are investigated theoretically and experimentally to find the effective methods of reducing the shock acceleration on hard disk driver during one side fall test. The hard disk drive is the most sensitive part in a laptop computer. This research shows the effects of the spring constant of rubber pad, the reinforcement of mechanical parts and the location of a hard disk driver, on the shock reduction.

• Structural Engineering and Mechanics
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• 제28권3호
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• pp.335-352
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• 2008

Continuous operation of test and measurement is a new operating technique in the petroleum exploitation, which combines perforation with test and measurement effectively. In order to measure the original pressure of stratum layer exactly and prevent testing instrument from being impaired or damaged, a suitable shock absorber is urgently necessary to research. Based on the attempt on the FEM analysis and experiment research, a new shock absorber is designed and discussed in this paper. 3D finite element model is established and simulated accurately by LS-DYNA, the effect and the dynamic character of the shock absorber impact by half sinusoidal pulse force under the main lobe frequency are discussed both on theoretics and experiment. It is shown that the new designed shock absorber system has good capability of shock absorption for the impact load.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2019년도 춘계 학술논문 발표대회
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• pp.151-152
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• 2019

This study length variation test, shock test were conducted to evaluate the performance of synthetic resin form. Results of both thermal length variation test and shock test satisfied the KS standards. for length variation test, the result of the horizontal and vertical valuse were -0.1% in average.

• 한국세라믹학회지
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• 제36권10호
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• pp.1062-1068
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• 1999

상온 25$^{\circ}C$의 증류수에 단일 열충격을 시행한 후 ball-on-3 ball test로 강도를 측정하고 강도의 변화를 관찰하였다. 시편은 상용 알루미나 시편을 사용하였고, disc 형태의 시편에 대하여 열충격 후의 균열의 모양과 강도 시험 후의 균열의 모양을 잉크 침투법에 의해 관찰하였다. 통계적인 파괴 확률방법을 제시하였으며, thermal shock Weibull plot을 이용하여 3점 꺾임 강도와 비교하였다. ball-on-3 ball test 강도에 미치는 인자에 대해 통계학적인 접근을 통해 관찰한 결과, 시편중심에서 균열까지의 거리가 균열 밀도보다 더 큰 영향을 미치고 있음을 알 수 있었다.

• 대한조선학회논문집
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• 제57권6호
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• pp.322-330
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• 2020

This study deals with underwater explosion (UNDEX) characteristics of various non-explosive underwater shock sources for the development of non-explosive underwater shock testing devices. UNDEX can neutralize ships' structure and the equipment onboard causing serious damage to combat and survivability. The shock proof performance of naval ships has been for a long time studied through simulations, but full-scale Live Fire Test and Evaluation (LFT&E) using real explosives have been limited due to the high risk and cost. For this reason, many researches have been tried to develop full scale ship shock tests without using actual explosives. In this study, experiments were conducted to find the characteristics of the underwater shock waves from actual explosive and non-explosive shock sources such as the airbag inflators and Vaporizing Foil Actuator (VFA). In order to derive the empirical equation for the maximum pressure value of the underwater shock wave generated by the non-explosive impact source, repeated experiments were conducted according to the number and distance. In addition, a Shock Response Spectrum (SRS) technique, which is a frequency-based function, was used to compare the response of floating bodies generated by underwater shock waves from each explosion source. In order to compare the magnitude of the underwater shock waves generated by each explosion source, Keel Shock Factor (KSF), which is a measure for estimating the amount of shock experienced by a naval ship from an underwater explosionan, was used.

• 한국전기전자재료학회논문지
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• 제23권8호
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• pp.611-616
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• 2010

This study investigated the characteristics of fracture behavior and mode on solder joints before and after thermal shock test for automotive application component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as lead-free solder. The shear strength was decreased with thermal cycle number, after 432 cycles of thermal shock test. In addition, fracture mode was verified to ductile, brittle fracture and base materials fracture such as different kind fractured mode using SEM and EDS. Before the thermal shock, the fractured mode was found to typical ductile fracture in solder layer. After thermal shock test, especially, Ag was found on fractured portion as roughest surface. Moreover, it occurred delamination between a PCB and a Cu land. Before thermal shock test, most of fractured mode in solder layer has dimples by ductile fracture. However, after thermal shock test, the fractured mode became a combination of ductile and brittle fracture, and it also could find that the fracture behavior varied including delamination between substrate and Cu land.

• 마이크로전자및패키징학회지
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• 제18권3호
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• pp.45-52
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• 2011

Flip Chip Ball Grid Array (FCBGA) 패키지의 솔더조인트 신뢰성을 평가하기 위한 방법으로는 다이 충격법, 다이 전단법, 3점 굽힘법, 열충격법 등이 활용된다. 본 연구에서는 솔더 접합부의 주요 고장메카니즘인 취성파괴를 확인하기 위한 방법으로 리플로우 상태, $85^{\circ}C$/85%RH 처리, $150^{\circ}C$/10hr 에이징의 처리한 후, 4가지 평가법으로 평가를 진행하여 파단모드를 분석하였다. 본 연구결과에서는 다이 충격법과 다이 전단법의 Good joint rate (GJR, %)는 리플로우 상태와 $85^{\circ}C$/85%RH처리에서 각각 89~91%와 100% 였으며, $150^{\circ}C$/10hr 에이징에서는 66%와 90%를 나타내었다. 3점 굽힘법과 열충격법의 GJR(%)는 3종류 샘플에서 모두 100%를 나타내어 변별력이 없었다. C4 솔더접합부의 신뢰성 평가법에 따른 GJR(%)의 변별력을 확인할 수 있는 방법은 die shock 과 die shear test였다.