• Title/Summary/Keyword: Shear fracture

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Effect of Crystallographic Orientation on Fracture Mechanism of Ni-Base Superalloy

  • Han, Chang-Suk;Lim, Sang-Yeon
    • Korean Journal of Materials Research
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    • v.25 no.11
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    • pp.630-635
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    • 2015
  • The fatigue strength of a nickel-base superalloy was studied. Stress-controlled fatigue tests were carried out at $700^{\circ}C$ and 5 Hz using triangular wave forms. In this study, two kinds of testing procedures were adopted. One is the conventional tension-zero fatigue test(R = 0). The other was a procedure in which the maximum stress was held at 1000 MPa and the minimum stress was diverse from zero to 1000 MPa at 24 and $700^{\circ}C$. The results of the fatigue tests at $700^{\circ}C$ indicate that the fracture mechanism changed according to both the mean stress and the stress range. At a higher stress range, ${\gamma}^{\prime}$ precipitates are sheared by a/2<110> dislocation pairs coupled by APB. Therefore, in a large stress range, the deformation occurred by shearing of ${\gamma}^{\prime}$ by a/2<110> dislocations, which brought about crystallographic shear fracture. As the stress range was decreased, the fracture mode gradually changed from crystallographic shear fracture to gradual growth of fatigue cracks. At an intermediate stress range, as it became more difficult for a/2<110> dislocation pairs to shear ${\gamma}^{\prime}$ particles, cracks started to propagate in the matrix, avoiding the harder ${\gamma}^{\prime}$ particles. High mean stress induced creep deformation, that is, ${\gamma}^{\prime}$ particles were sheared by {111}<112> slip systems, which led to the formation of stacking faults in the precipitates. Thus, the change in fracture mechanism brought about the inversion of the S-N curves.

Reliability of Sn-Ag-Cu Solder Joint on ENEPIG Surface Finish: 1. Effects of thickness and roughness of electroless Ni-P deposit (ENEPIG 표면처리에서의 Sn-Ag-Cu 솔더조인트 신뢰성: 1. 무전해 Ni-P도금의 두께와 표면거칠기의 영향)

  • Huh, Seok-Hwan;Lee, Ji-Hye;Ham, Suk-Jin
    • Journal of the Microelectronics and Packaging Society
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    • v.21 no.3
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    • pp.43-50
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    • 2014
  • By the trends of electronic package to be smaller, thinner and more integrative, the reliability of interconnection between Si chip and printed circuit board is required. This paper reports on a study of high speed shear energy of Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder joints with different the thicknesses of electroless Ni-P deposit. A high speed shear testing of solder joints was conducted to find a relationship between the thickness of Ni-P deposit and the brittle fracture in electroless Ni-P deposit/SAC405 solder. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the fractured pad surface with and without $HNO_3$ vapor treatment. The high speed shear energy of SAC405 solder joint with $1{\mu}m$ Ni-P deposit was found to be lower without $HNO_3$ vapor, compared to those of over $3{\mu}m$ Ni-P deposit. This could be due to the edge of solder resist in $1{\mu}m$ Ni-P deposit, which provides a fracture location for the weakened shear energy of solder joints and brittle fracture in high speed shear test. With $HNO_3$ vapor, the brittle fracture mode in high speed shear test decreased with increasing the thickness of Ni-P deposit. Then the roughness (Ra) of Ni-P deposits decreased with increasing its thickness. Thus, this gives the evidence that the decrease in roughness of Ni-P deposit for Eelectroless Ni/ Electroless Pd/ Immersion Au (ENEPIG) surface play a critical role for improving the robustness of SAC405 solder joint.

Punching Fracture Simulations of Circular Unstiffened Steel Plates using Three-dimensional Fracture Surface (3차원 파단 변형률 평면을 이용한 비보강 원판의 펀칭 파단 시뮬레이션)

  • Park, Sung-Ju;Lee, Kangsu;Choung, Joonmo
    • Journal of Ocean Engineering and Technology
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    • v.30 no.6
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    • pp.474-483
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    • 2016
  • Accidental events such as collisions, groundings, and hydrocarbon explosions in marine structures can cause catastrophic damage. Thus, it is extremely important to predict the extent of such damage, which determines the total amount of oil spills and the residual hull girder strength. Punching fracture tests were conducted by Choung (2009b), where various sizes of indenters and circular unstiffened steel plates with different thicknesses were used to quasi-statically realize damage extents. A three-dimensional fracture strain surface was developed based on a reference (Choung et al., 2015b), where the average stress triaxiality and average normalized Lode angle were used as the parameters governing the fracture of ductile steels. In this study, new numerical analyses were performed using very fine axisymmetric elements in combination with an Abaqus user-subroutine to implement the three-dimensional fracture strain surface. Conventional numerical analyses were also conducted for the tests to identify the best fit fracture strain values by changing the fracture strains. Based on the phenomenon of the average normalized Lode angle starting out positive and then becoming slightly negative, it was inferred that the shear stress primarily dominates in determining the fractures locations, with a partial contribution from the compressive stress. It should be stated that the three-dimensional fracture surface effectively predicted at least the shear stress-dominant fracture behavior of a mild steel.

Microscopic Examination of Fracture Particles on the Surface of Ir-192 Sealed Source and Ultrasonic Cleaning (Ir-192 밀봉선원의 표면오염 방지)

  • Kuk, Il Hiun;Park, Chun Deuk;Koo, Ja Ho
    • Journal of Radiation Industry
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    • v.9 no.2
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    • pp.91-102
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    • 2015
  • The iridium disc, generally used in industrial radiography, is examined to find the fracture morphology and fine particles remaining on the shear blank surface. Randomly selected 1,200 discs were observed under a scanning electron microscope tilted more than $45^{\circ}$. Fracture surfaces are classified into three groups: (1) surface fall-out, (2) fracture on the edge and (3) multi-step brittle fracture, which shows the mutual relationship between the fracture morphology and remaining particles. Fracture particles were removed by cleaning the discs in a ultrasonic bath with acetone and collected at the bottom. Removed number of the particles were counted for each different group of fracture surfaces. Followings are conclusions: (1) About 80.5% of discs (966/1,200), have sound plastic shear surfaces with particles remained. (2) About 2% discs accompany surface fall-out's having large particles tens of ${\mu}m$, which is stable not to be pulled out even after the considerably long time of ultrasonic cleaning. (3) About 5% discs contain the fractures on the edge and the particles are removed thoroughly within 30 minutes. (4) 234 discs out of 1,200 discs have multi-step fracture surfaces whose particles never removed in a short period of time but come out very slowly. Such a disc having multiple-step fracture is attributed to the promate cause to the 'leaker'. It is noted here that the discs having mutiple-step fractures should be treated separately with special care, and it is need to study how to treat them.

Seismic design of connections between steel outrigger beams and reinforced concrete walls

  • Deason, Jeremy T.;Tunc, Gokhan;Shahrooz, Bahram M.
    • Steel and Composite Structures
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    • v.1 no.3
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    • pp.329-340
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    • 2001
  • Cyclic response of "shear" connections between steel outrigger beams and reinforced concrete core walls is presented in this paper. The connections investigated in this paper consisted of a shear tab welded onto a plate that was connected to the core walls through multiple headed studs. The experimental data from six specimens point to a capacity larger than the design value. However, the mode of failure was through pullout of the embedded plate, or fracture of the weld between the studs and plate. Such brittle modes of failure need to be avoided through proper design. A capacity design method based on dissipating the input energy through yielding and fracture of the shear tab was developed. This approach requires a good understanding of the expected capacity of headed studs under combined gravity shear and cyclic axial load (tension and compression). A model was developed and verified against test results from six specimens. A specimen designed based on the proposed design methodology performed very well, and the connection did not fail until shear tab fractured after extensive yielding. The proposed design method is recommended for design of outrigger beam-wall connections.

Evaluation of the Impact Shear Strength of Thermal Aged Lead-Free Solder Ball Joints (열시효 처리된 무연 솔더 볼 연결부의 충격 전단강도 평가)

  • Chung, Chin Sung;Kim, Ho Kyung
    • Journal of the Korean Society of Safety
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    • v.30 no.6
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    • pp.7-11
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    • 2015
  • The present study investigates the impact shear strength of thermal aged Sn-3Ag-0.5Cu lead-free solder joints at impact speeds ranging from 0.5 m/s to 2.5 m/s. The specimens were thermal aged for 24, 100, 250 and 1000 hours at $100^{\circ}C$. The experimental results demonstrate that the shear strength of the solder joint decreases with an increase in the load speed and aging time. The shear strength of the solder joint aged averagely decreased by 43% with an increase in the strain rate. For the as-reflowed specimens, the mode II stress intensity factor ($K_{II}$) of interfacial IMC between Sn-3.0Ag-0.5Cu and a copper substrate also was found to decrease from $1.63MPa.m^{0.5}$ to $0.97MPa.m^{0.5}$ in the speed range tested here. The degradations in the shear strength and fracture toughness of the aged solder joints are mainly caused by the growth of IMC layers at the solder/substrate interface.

Effect of Shearing Speed on High Speed Shear Properties of Sn1.0Ag0.5Cu Solder Bump on Various UBM's (다양한 UBM층상의 Sn0Ag0.5Cu 솔더 범프의 고속 전단특성에 미치는 전단속도의 영향)

  • Lee, Wang-Gu;Jung, Jae Pil
    • Korean Journal of Metals and Materials
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    • v.49 no.3
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    • pp.237-242
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    • 2011
  • The effect of shearing speed on the shear force and energy of Sn-0Ag-0.5Cu solder ball was investigated. Various UBM (under bump metallurgy)'s on Cu pads were used such as ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold; Ni/Pd/Au), ENIG (Electroless Nickel, Immersion Gold; Ni/Au), OSP (Organic Solderability Preservative). To fabricate a shear test specimen, a solder ball, $300{\mu}m$ in diameter, was soldered on a pad of FR4 PCB (printed circuit board) by a reflow soldering machine at $245^{\circ}C$. The solder bump on the PCB was shear tested by changing the shearing speed from 0.01 m/s to 3.0 m/s. As experimental results, the shear force increased with a shearing speed of up to 0.6 m/s for the ENIG and the OSP pads, and up to 0 m/s for the ENEPIG pad. The shear energy increased with a shearing speed up to 0.3 m/s for the ENIG and the OSP pads, and up to 0.6 m/s for the ENEPIG pad. With a high shear speed of over 0 m/s, the ENEPIG showed a higher shear force and energy than those of the ENIG and OSP. The fracture surfaces of the shear tested specimens were analyzed, and the fracture modes were found to have closer relationship with the shear energy than the shear force.

A comparison of the shear bond strength between porcelain repair systems and fractured surface of porcelain-fused-to-metal restorations (도재파절 양상에 따른 수종의 도재 수복용 레진의 결합력에 관한 실험적 연구)

  • Choi, Jeung Won;Han, Dong Hoo;Jeong, Chang Mo
    • The Journal of Korean Academy of Prosthodontics
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    • v.28 no.2
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    • pp.147-163
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    • 1990
  • Although dental porcelain demonstrates lasting esthetic results, it suffers from inherent brittle fractures. Various techniques and materials for intraoral porcelain repair has been suggested. This study investigated the in vitro shear strength of three porcelain repair systems according to aspects of the porcelain fractures. The purpose of this study was to evaluate the shear bond strength of three porcelain repair systems(All-bond, Clearfil, Scotchprime) according to fractured surface of porcelain - fused - to - metal restorations. For this study specimens were divided into five groups : group 1 represented fracture occurred at body porcelain layer, group 2 represented fracture occurred at opaque porcelain layer, group 3 represented fracture including 1/3 of metal exposure, group 4 represented fracture including 2/3 of metal exposure, and group 5 represented all metal surface was exposed. Specimens were stored in double deionized water(24Hr, $37^{\circ}C$) and thermocycling was performed(24Hr, 1080cycles), and subjected to a shear force parallel to the repair resin and porcelain interface by use of an University Testing Machine. The results of this study were obtained as follows : 1. In group 1 and 2, bond strength was relatively high, and bond strength showing reducing tendency as exposure of metal was increased. 2. In group 1, bond strength was relatively high, and no significant differences in porcelain repair system. 3. In group 2, 3 and 4, All-bond and Clearfil provided significantly higher bond strength than scotchprime. 4. In group 5, bond strength was the lowest among all groups and especially in case if Scotchprime. 5. Cohesive failure was observed in group 1 and 2, adhesive failure was observed in group 5, and cohesive / adhesive failures were observed in group 3 and 4.

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