• Journal of the Korean Wood Science and Technology
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• v.48 no.6
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• pp.791-806
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• 2020

In this study, a block shear strength test was conducted to compare and analyze the strength and failure mode on the glued laminated timber, CLT, and Ply-lam CLT, which are mainly used for the construction of wood construction as engineering wood. Through this, the Ply-lam CLT manufacturing conditions for optimum production, such as the type of lamina, plywood, adhesive, and layer composition, were investigated. The results are as follow. Through block shear strength test, it showed high strength in the order of glued laminated timber, Ply-lam CLT and CLT. In particular, the shear strength of Ply-lam CLT, which is made of a composite structure of larch plywood and larch lamina, passed 7.1 N/㎟, which is a Korean industrial standards for block shear strength of structural glued laminated timber. In addition, in this study, there was no different in shear strength according to the adhesive type used for glulam, CLT, and Ply-lam CLT adhesion. However, in the case of Ply-lam CLT, the difference in shear strength of Ply-lam CLT was shown according to the type of lamina and plywood. The results showed high strength in the order of Larix kaempferi > Mixed light hardwood ≒ Pinus densiflora, sieb, et, Zucc plywood. The optimal configuration of Ply-lam CLT is when larch plywood and larch lamina are used, and it is decided that the adhesive can be used by selecting PRF and PUR according to the application. The results of block shear strength failure mode by type of wood based materials were analyzed. The failure mode showed shear parallel-to-grain for glulam, rolling shear for CLT, and shear parallel-to-grain and rolling for ply-lam CLT. This is closely related to shear strength results and is decided to indicate higher shear strength in Ply-lam CLT than in CLT due to rolling shear.

• Journal of Adhesion and Interface
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• v.17 no.4
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• pp.136-140
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• 2016

In this study, a series of dimer acid-based polyamides with different diamines were synthesized by condensation polymerization and the polyamides were characterized by Fourier transform infrared spectroscopy (FT-IR). Effects of diamine structures on mechanical and thermal properties of polyamides were investigated. The tensile strength and lap shear adhesion strength of aromatic-based polyamide (DAP) were higher than those of aliphatic-based polyamide (DAH). In DSC thermogram, DAP has a high $T_g$ and $T_m$ compared with DAH. DAP's and DAH's softening point were $112-115^{\circ}C$ and $98-121^{\circ}C$, respectively.

• Advances in aircraft and spacecraft science
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• v.1 no.1
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• pp.1-14
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• 2014

Physico-chemical changes of the plasma modified titanium alloy [Ti-6Al-4V] surface were studied with respect to their crystallographic changes by X-Ray Diffraction (XRD) and Scanning Electron Microscope (SEM).The plasma-treatment of surface was carried out to enhance adhesion of high performance nano reinforced epoxy adhesive, a phenomenon that was manifested in subsequent experimental results. The enhancement of adhesion as a consequence of improved spreading and wetting on metal surface was studied by contact angle (sessile drop method) and surface energy determination, which shows a distinct increase in polar component of surface energy. The synergism in bond strength was established by analyzing the lap-shear strength of titanium laminate. The extent of enhancement in thermal stability of the dispersed nanosilica particles reinforced epoxy adhesive was studied by Thermo Gravimetric Analysis (TGA), which shows an increase in onset of degradation and high amount of residuals at the high temperature range under study. The fractured surfaces of the joint were examined by Scanning electron microscope (SEM).

• Korean Journal of Metals and Materials
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• v.47 no.3
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• pp.202-208
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• 2009

The effects of aging time on the microstructure and shear strength of the Low Temperature Co-fired Ceramic (LTCC)/Ag pad/Electroless Nickel Immersion Gold (ENIG)/BGA solder joints were investigated through isothermal aging at $150^{\circ}C$ for 1000 h with conventional Sn-37Pb and Sn-3Ag-0.5Cu. $Ni_3Sn_4$ intermetallic compound (IMC) layers was formed at the interface between Sn-37Pb solder and LTCC substrate as-reflowed state, while $(Ni,Cu)_3Sn_4$ IMC layer was formed between Sn-3Ag-0.5Cu solder and LTCC substrate. Additional $(Cu,Ni)_6Sn_5$ layer was found at the interface between the $(Ni,Cu)_3Sn_4$ layer and Sn-3Ag-0.5Cu solder after aging at $150^{\circ}C$ for 500 h. Thickness of the IMC layers increased and coarsened with increasing aging time. Shear strength of both solder joints increased with increasing aging time. Failure mode of BGA solder joints with LTCC substrate after shear testing revealed that shear strength of the joints depended on the adhesion between Ag metallization and LTCC. Fracture mechanism of Sn-37Pb solder joint was a mixture of ductile and pad lift, while that of Sn-3Ag-0.5Cu solder joint was a mixture of ductile and brittle $(Ni,Cu)_3Sn_4$ IMC fracture morphology. Failure mechanisms of LTCC/Ag pad/ENIG/BGA solder joints were also interpreted by finite element analyses.

• Polymer(Korea)
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• v.39 no.3
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• pp.514-521
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• 2015

In this study, we would like to describe peel strength and dynamic shear property on various substrates of multi-layered structural double-sided adhesive tape with or without adhesive (AD) prepared by UV curing for an automobile, construction, and display junction. According to adapt the adhesive, the peel and dynamic shear strength of adhesion tape prepared with acrylic foam or various plastic substrates increased with increasing molecular weight, however, decreased over 650000 molecular weight. The adhesion property shows high value at the thin AD layer with decreasing temperature. The interface property shows highest at MW 615000 (AD-4), and the interface junction below MW 615000 resulted to divide from acrylic foam and adhesive layer. From this study, the multi-layered structural double-sided adhesive tapes seem to be a useful for industrial area such as a low surface energy plastic material and curved substrate.

• Journal of Adhesion and Interface
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• v.6 no.2
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• pp.13-20
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• 2005

Interfacial shear strength (IFSS) of environmentally friendly natural fiber reinforced polymer composites plays a very important role in controlling the overall mechanical performance. The IFSS of various Ramie and Kenaf fibers/epoxy composites was evaluated using the combination of micromechanical test and nondestructive acoustic emission (AE) to find out optimal conditions for desirable final performance. Dynamic contact angle was measured for Ramie and Kenaf fibers and correlated the wettability properties with interfacial adhesion. Mechanical properties of Ramie and Kenaf fibers were investigated using single-fiber tensile test and analyzed statistically by both uni-and bimodal Weibull distributions. An influence of clamping effect on a real elongation for both Ramie and Kenaf fibers were evaluated as well. Two different microfailure modes, axial debonding and fibril fracture coming from fiber bundles and single fiber composites (SFC) were observed under tension and compression.

• Journal of Adhesion and Interface
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• v.14 no.2
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• pp.75-81
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• 2013

Epoxy matrix based composites were fabricated by adding SiC nano fillers. The interfacial properties of composites were varied with different shapes of SiC nano fillers. To investigate the shape effects on the interfacial properties, beta and whisker type SiC nano fillers were used for this evaluation. The dispersion states of nano SiC-epoxy nanocomposites were evaluated by capacitance measurements. FE-SEM was used to observe the fracture surface of different structures of SiC-epoxy nanocomposites and to investigate for reinforcement effect. Interfacial properties between carbon fiber and SiC-epoxy nanocomposites were also evaluated by ILSS (interlaminar shear strength) and IFSS (interfacial shear strength) tests. The interfacial adhesion of beta type nanocomposites was better than whisker type.

• Polymer(Korea)
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• v.24 no.3
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• pp.326-332
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• 2000

The effects of sizing agent on the final mechanical properties of the glass fiber/unsaturated polyester composites were investigated by contact angle measurements at room temperature. In this work, glass fibers were coated by poly(vinyl alcohol), polyester, and epoxy type sizing agent and each property was compared. Contact angles of the sized glass fiber were measured by the wicking method based on Washburn equation using deionized water and diiodomethane as testing liquids. As an experimental result, the surface free energy calculated from contact angle showed the highest value in case of the glass fiber coated by epoxy sizing agent. From measurements of interlaminar shear strength (ILSS) and fracture toughness ( $K_{IC}$ ) of the composites, it was found that the sizing treatment on fibers could improve the fiber/matrix interfacial adhesion, resulting in growing the final mechanical properties. This was due to the enhanced surface free energy of glass fibers in a composite system.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.11a
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• pp.49-52
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• 2005

In the development of a propellant tank using liquid oxygen and liquid hydrogen, the improvement of microcrack resistance of carbon/epoxy composites is necessary for the application of a composite material to tank structures. In this research, two types of carbon/epoxy composites with different matrix systems were tested to measure interlaminar shear strength (ILSS), one of the material properties to evaluate fiber-matrix interface adhesion indirectly. Short beam specimens were tested inside an environmental chamber at room temperature(RT) and at cryogenic temperature( - 150 $^{\circ}C$) respectively. Results showed that the matrix system with large amount of bisphenol-A and CTBN modified rubber had good performance at cryogenic temperature.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.49-53
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• 2002

The Sn-Cu eutectic solder bump formation ($140{\mu}{\textrm}{m}$ diameter, $250{\mu}{\textrm}{m}$ pitch) by electroplating was studied for flip chip package fabrication. The effect of current density and plating time on Sn-Cu deposit was investigated. The morphology and composition of plated solder surface was examined by scanning electron microscopy. The plating thickness increased with increasing time. The plating rate increased generally according to current density. After the characteristics of Sn-Cu plating were investigated, Sn-Cu solder bumps were fabricated on optimal condition of 5A/dm$^2$, 2hrs. Ball shear test after reflow was performed to measure adhesion strength between solder bump and UBM (Under Bump Metallization). The shear strength of Sn-Cu bump after reflow was higher than that of before reflow.