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http://dx.doi.org/10.7317/pk.2015.39.3.514

Adhesion Properties on the Molecular Weight and Various Substrates of Multi-layered Structural Acrylic Adhesive  

Kim, Dong-Bok (Center for Photofunctional Energy Materials, Dept. of Polymer Science and Engineering, Dankook University)
Publication Information
Polymer(Korea) / v.39, no.3, 2015 , pp. 514-521 More about this Journal
Abstract
In this study, we would like to describe peel strength and dynamic shear property on various substrates of multi-layered structural double-sided adhesive tape with or without adhesive (AD) prepared by UV curing for an automobile, construction, and display junction. According to adapt the adhesive, the peel and dynamic shear strength of adhesion tape prepared with acrylic foam or various plastic substrates increased with increasing molecular weight, however, decreased over 650000 molecular weight. The adhesion property shows high value at the thin AD layer with decreasing temperature. The interface property shows highest at MW 615000 (AD-4), and the interface junction below MW 615000 resulted to divide from acrylic foam and adhesive layer. From this study, the multi-layered structural double-sided adhesive tapes seem to be a useful for industrial area such as a low surface energy plastic material and curved substrate.
Keywords
multi-layer; UV curing; double-sided adhesive tape; molecular weight; substrate;
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Times Cited By KSCI : 3  (Citation Analysis)
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1 H. J. Choi, I. S. Park, and L. Jang, Korean Patent 100852887 (2008).
2 I. H. Cho, Korean Patent 1020080109275 (2008).
3 D. Satas, Handbook of Pressure Sensitive Adhesive Technology, 2nd edition, Van Nostrand Reinhold, New York, 1989.
4 I. W. Levine, U.S. Patent 1,537 (1926).
5 I. Bened, Pressure-Sensitive Adhesive and Applications, 2nd edition, Marcel Dekker, New York, 2004.
6 S. S. Baek, S. J. Jang, J. H. Lee, D. H. Kho, S. H. Lee, and S. H. Hwang, Polym. Korea, 38, 199 (2014).   DOI   ScienceOn
7 S. J. Lee, J. Y. So, C. Park, T. G. Ban, and L. S. Park, J. Appl. Sci., 10, 1104 (2010).   DOI
8 J. W. Park, S. W. Lee, H. J. Kim, D. B. Won, D. B. Kim, K. S. Lee, H. S. Woo, and, E. A. Kim, J. Adhes. Interf., 12, 81 (2011).
9 D. B. Kim, Polym. Korea, 37, 184 (2013).   DOI   ScienceOn
10 S. M. Ellerstein, S. A. Lee, and T. K. Palit. Radiation Curing in Polymer Science and Technology, J. P. Fouassier and J. F. Rabek, Editors, Elsevier, Applied Science, London, UK, Vol. 4 (1993).
11 B. Goss, Int. J. Adhes. Adhes., 22, 405 (2002).   DOI   ScienceOn
12 H. S. Do, D. J. Kim, and H. J. Kim, J. Adhes. Interf., 4, 41 (2003).
13 Y. W. Song, H. S. Do, H. S. Joo, D. H. Lim, S. Kim, and H. J. Kim, J. Adhes. Sci. Technol., 20, 1357 (2006).   DOI   ScienceOn
14 V. Kale and M. Moukwa, J. Electrostat., 38, 239 (1996).   DOI   ScienceOn
15 G. Leftheriotis and S. Papaefthimiou, Solid State Ionics, 136, 655 (2000).
16 J. Piglowski and M. Kozlowski, Rheol. Acta, 24, 519 (1985).   DOI
17 Z. Czech, Int. J. Adhes. Adhes., 24, 503 (2004).   DOI   ScienceOn
18 D. B. Kim, Polym. Korea, 38, 397 (2014).   DOI   ScienceOn
19 F. Sosson, A. Chateauminois, and C. Creton, J. Polym. Sci., Part B: Polym. Phys., 43, 3316 (2005).   DOI