Browse > Article
http://dx.doi.org/10.17702/jai.2013.14.2.075

Improvement of Mechanical and Interfacial Properties of Carbon Fiber/Epoxy Composites by Adding Nano SiC Fillers  

Kwon, Dong-Jun (Department of Materials Engineering and Conversion Technology, Engineering Research Institute, Gyeongsang National University)
Wang, Zuo-Jia (Department of Materials Engineering and Conversion Technology, Engineering Research Institute, Gyeongsang National University)
Kim, Je-Jun (Advanced Composites Materials R&D Center)
Jang, Key-Wook (Advanced Composites Materials R&D Center)
Park, Joung-Man (Department of Materials Engineering and Conversion Technology, Engineering Research Institute, Gyeongsang National University)
Publication Information
Journal of Adhesion and Interface / v.14, no.2, 2013 , pp. 75-81 More about this Journal
Abstract
Epoxy matrix based composites were fabricated by adding SiC nano fillers. The interfacial properties of composites were varied with different shapes of SiC nano fillers. To investigate the shape effects on the interfacial properties, beta and whisker type SiC nano fillers were used for this evaluation. The dispersion states of nano SiC-epoxy nanocomposites were evaluated by capacitance measurements. FE-SEM was used to observe the fracture surface of different structures of SiC-epoxy nanocomposites and to investigate for reinforcement effect. Interfacial properties between carbon fiber and SiC-epoxy nanocomposites were also evaluated by ILSS (interlaminar shear strength) and IFSS (interfacial shear strength) tests. The interfacial adhesion of beta type nanocomposites was better than whisker type.
Keywords
SiC nano filler; Nanocomposites; ILSS; IFSS; stress transfer;
Citations & Related Records
연도 인용수 순위
  • Reference
1 H. Alamri and I. M. Low, Mater. Des., 42, 214 (2012).   DOI   ScienceOn
2 M. Vlastimil, L. Yafei, J. Long, L. Huang, G. S. Martynkova, and V. Toma, Tribol. Int., 43, 144 (2010).   DOI   ScienceOn
3 J. Magnant, L. Maille, R. Pailler, and J. C. Ichard, J. European Ceram. Soc., 32, 4497 (2012).   DOI   ScienceOn
4 J. Xiaolong, L. Gang, L. Baiyang, L. Yuming, G. Yang, and X. Yang, Compos. Part A, 48, 101 (2013).   DOI   ScienceOn
5 J. M. Park, Z. J. Wang, J. H. Jang, N. J. R. Gnidakoung, W. I. Lee, J. G. Park, and K. L. DeVries, Compos. Part A, 40, 1722 (2009).   DOI   ScienceOn
6 S. J. Park and Y. S. Jang, J. Colloid Interface Sci., 237, 91 (2001).   DOI   ScienceOn
7 M. H. Choi, B. H. Jeon, and I. J. Chung, Polymer, 41, 3243 (2000).   DOI   ScienceOn
8 S. S. Kim, D. C. Park, and D. G. Lee, Compos. Struct., 66, 359 (2004).   DOI   ScienceOn
9 Z. J. Wang, N. J. R. Gnidakoung, M. S. Kim, J. M. Park, and M. G. Um, J. Adhesion and Interface, 10, 162 (2009).
10 L. C. S. Nunes, F. W. R. Dias, and H. S. da Costa Mattos, Polym. Test, 30, 791(2011).   DOI   ScienceOn
11 R. Rajkiran and D. R. Paul, Polymer, 52, 5595 (2011).   DOI   ScienceOn
12 J. Gangchang, Q. Shengru, D. Shuangming, H. Dong, and L. Mei, Mater. Sci. Eng. A, 483, 123 (2008).
13 T. Schuller, W. Beckert, B. Lauke, C. Ageorges, and K. Friedrich, Compos. Part A, 31, 661(2000).   DOI   ScienceOn
14 D. T. Horn, Basic Electronics Thoery with Projects and Experiments, 4th ed, McGraw-Hill, New York, U.S.A.
15 M. S. Hong, K. M. Bae, W. K. Choi, H. S. Lee, S. J. Park, K. H. An, and B. J. Kim, Chem. Eng. J., 23, 313 (2012).
16 G. Jung, C. W. Nah, M. K. Seo, J. H. Byun, K. H. Lee, and S. J. Park, Polymer (Korea), 36, 612 (2012).
17 Z. J. Wang, D. J. Kwon, G. Y. Gu, J. K. Park, W. I. Lee, and J. M. Park, J. Adhesion and Interface, 11, 149 (2010).
18 T. Zhou, X. Wang, G. U. Mingyuan, and L. Xiaoheng, Polymer, 49, 4666 (2008).   DOI   ScienceOn