• 마이크로전자및패키징학회지
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• 제30권4호
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• pp.1-7
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• 2023

임의의 3D 구조물을 제작할 수 있는 3D/4D 프린팅 기술의 능력은 프린트된 구조물 디자인에 높은 자유도를 제공합니다. 이와 같은 능력은 전자기기 및 바이오 의료 응용분야에 장치 소형화, 맞춤화, 그리고 개인화 추세에 영향을 주고 있습니다. 본 Review 논문에서는, 3D/4D 프린팅 기술을 통해 만들어진, 독특하고 특이한 특성을 가진 3D 프린트된 전자기기 및 바이오 의료 응용 분야의 최신 정보를 살펴봅니다. 구체적으로, 재활용 및 분해 가능한 전자기기, 메타물질 기반 압력 센서, fully 프린트된 휴대용 광검출기, 생체 적합 및 고강도를 가진 치아, 자연모사 마이크로니들, 그리고 3D 세포 배양 및 히스톨로지를 위한 형태 변형 가능한 튜브 어레이와 같은 신흥 영역들을 소개합니다.

• 센서학회지
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• 제14권2호
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• pp.69-77
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• 2005

The electronic nose (e-nose) has been used in food industry and quality controls in plastic packaging. Recently it finds its applications in medical diagnosis, specifically on detection of diabetes, pulmonary or gastrointestinal problem, or infections by examining odors in the breath or tissues with its odor characterizing ability. Moreover, the use of portable e-nose enables the on-site measurements and analysis of vapors without extra gas-sampling units. This is expected to widen the application of the e-nose in various fields including point-of-care-test or e-health. In this study, a PDA-based portable e-nose was developed using micro-machined gas sensor array and miniaturized electronic interfaces. The rich capacities of the PDA in its computing power and various interfaces are expected to provide the rapid and application specific development of the diagnostic devices, and easy connection to other facilities through information technology (IT) infra. For performance verification of the developed portable e-nose system, Six different vapors were measured using the system. Seven different carbon-black polymer composites were used for the sensor array. The results showed the reproducibility of the measured data and the distinguishable patterns between the vapor species. Additionally, the application of two typical pattern recognition algorithms verified the possibility of the automatic vapor recognition from the portable measurements. These validated the portable e-nose based on PDA developed in this study.

• 전기전자학회논문지
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• 제26권3호
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• pp.422-429
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• 2022

조도센서 칩은 아날로그 회로의 트리밍이나 디지털 레지스터의 초기 값을 셋팅하기 위해 소용량의 eFuse(electrical Fuse) OTP(One-Time Programmable) 메모리 IP(Intellectual Property)를 필요로 한다. 본 논문에서는 1.8V LV(Low-Voltage) 로직 소자를 사용하지 않고 3.3V MV(Medium Voltage) 소자만 사용하여 128비트 eFuse OTP IP를 설계하였다. 3.3V 단일 MOS 소자로 설계한 eFuse OTP IP는 1.8V LV 소자의 gate oxide 마스크, NMOS와 PMOS의 LDD implant 마스크에 해당되는 총 3개의 마스크에 해당되는 공정비용을 줄일 수 있다. 그리고 1.8V voltage regulator 회로가 필요하지 않으므로 조도센서 칩 사이즈를 줄일 수 있다. 또한 조도센서 칩의 패키지 핀 수를 줄이기 위해 프로그램 전압인 VPGM 전압을 웨이퍼 테스트 동안 VPGM 패드를 통해 인가하고 패키징 이후는 PMOS 파워 스위칭 회로를 통해 VDD 전압을 인가하므로 패키지 핀 수를 줄일 수 있다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2007년도 춘계학술대회 논문집
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• pp.79-83
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• 2007

We have developed a compact and cost-effective camera module on the basis of wafer-scale replication technology. A multiple-layered structure of several aspheric lenses in a mobile camera module is first assembled by bonding multiple glass-wafers on which 2-dimensional replica arrays of identical aspheric lenses are UV-embossed, followed by dicing the stacked wafers and packaging them with image sensor chips. We have demonstrated a VGA camera module fabricated by the wafer-scale replication processing with various UV-curable polymers having refractive indices between 1.4 and 1.6, and with three different glass-wafers of which both surfaces are embossed as aspheric lenses having 200 um sag-height and aspheric-coefficients of lens polynomials up to tenth-order. We have found that precise compensation in material shrinkage of the polymer materials is one of the most technical challenges, in order to achieve a higher resolution in wafer-scaled lenses for mobile camera modules.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2003년도 ICCAS
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• pp.2182-2186
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• 2003

This paper presents the differential type resonant accelerometer (DRXL) and its performance test results. The DRXL is the INS grade, surface micro-machined sensor. The proposed DRXL device produces a differential digital output upon an applied acceleration, and the principle is a gap-dependent electrical stiffness variation of the electrostatic resonator with torsion beam structures. Using this new operating concept, we designed, fabricated and tested the proposed device. The final device was fabricated by using the wafer level vacuum packaging process. To test the performance of the DRXL, a nonlinear self-oscillation loop is designed using describing function technique. The oscillation loop is implemented using discrete electronic elements. The performance test of the DRXL shows that the sensitivity of the accelerometer is 12 Hz/g and its long term bias stability is about $2mg(1{\sigma})$. The turn on repeatability, bandwidth, and dynamic range are 4.38 mg, 100 Hz, and ${\pm}\;70g$, respectively.

• 한국IT서비스학회지
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• 제15권3호
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• pp.71-95
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• 2016

In recent years, text mining has been used to extract meaningful insights from the large volume of unstructured text data sets of various domains. As one of the most representative text mining applications, topic modeling has been widely used to extract main topics in the form of a set of keywords extracted from a large collection of documents. In general, topic modeling is performed according to the weighted frequency of words in a document corpus. However, general topic modeling cannot discover the relation between documents if the documents share only a few terms, although the documents are in fact strongly related from a particular perspective. For instance, a document about "sexual offense" and another document about "silver industry for aged persons" might not be classified into the same topic because they may not share many key terms. However, these two documents can be strongly related from the R&D perspective because some technologies, such as "RF Tag," "CCTV," and "Heart Rate Sensor," are core components of both "sexual offense" and "silver industry." Thus, in this study, we attempted to discover the differences between the results of general topic modeling and R&D perspective topic modeling. Furthermore, we package social issues from the R&D perspective and present a prototype system, which provides a package of news articles for each R&D issue. Finally, we analyze the quality of R&D perspective topic modeling and provide the results of inter- and intra-topic analysis.

• 한국생산제조학회지
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• 제23권3호
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• pp.230-236
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• 2014

Wafer level package technology is added to the surface of wafer circuit packages to create a semiconductor technology that can minimize the size of the package. However, in conventional packaging, warpage and fracture are major concerns for semiconductor manufacturing. We optimized the wafer dam design using a finite element method according to the dam height and heat distribution thermal properties. The dam design influences the uniform deposition of the image sensor and prevents the filling material from overflowing. In this study, finite element analysis was employed to determine the key factors that may affect the reliability performance of the dam package. Three-dimensional finite element models were constructed using the simulation software ANSYS to perform the dam thermo-mechanical simulation and analysis.

• 센서학회지
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• 제16권1호
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• pp.62-67
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• 2007

This paper presents a novel MEMS condenser microphone with rigid backplate to enhance acoustic characteristics. The MEMS condenser microphone consists of membrane and backplate chips which are bonded together by gold-tin (Au/Sn) eutectic solder bonding. The membrane chip has 2.5 mm${\times}$2.5 mm, $0.5{\mu}m$ thick low stress silicon nitride membrane, 2 mm${\times}$2 mm Au/Ni/Cr membrane electrode, and $3{\mu}m$ thick Au/Sn layer. The backplate chip has 2 mm${\times}$2 mm, $150{\mu}m$ thick single crystal silicon rigid backplate, 1.8 mm${\times}$1.8 mm backplate electrode, and air gap, which is fabricated by bulk micromachining and silicon deep reactive ion etching. Slots and $50-60{\mu}m$ radius circular acoustic holes to reduce air damping are also formed in the backplate chip. The fabricated microphone sensitivity is $39.8{\mu}V/Pa$ (-88 dB re. 1 V/Pa) at 1 kHz and 28 V polarization voltage. The microphone shows flat frequency response within 1 dB between 20 Hz and 5 kHz.

• 센서학회지
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• 제25권2호
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• pp.155-159
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• 2016

In this work, we have developed a test system to examine whether the charge indicator of the plug-in hybrid electric vehicle (PHEV) works properly or not. In PHEV, the driver should charge the necessary electricity by plugging in manually and be able to know the charging status through the charge indicator conveniently located for the charging individual. Our system used the CAN bus to transmit the same commands from ECU to the indicator to test the proper operation of the indicator lights. It measured the electric current values during operation and analyzed to determine the quality of the indicators. The inspection items included the proper packaging, the electrical shorts, the LED lighting during charging, the LED lighting for charging failure, and the LED lighting when errors occur. We developed the system for the operators in the factory allowing them to approve the test results at the site. We developed the hardware, the control software, and the software to store the test results and the history of the products in the database. Serial numbers were given to the good quality products and the bar code labels were printed to trace the products afterwards. Through this work, we developed a system to inspect the electric parts in real time upon fabrication. We are planning to further improve our system to inspect the brightness of the indicator by adding the vision inspection in future.

• 센서학회지
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• 제7권3호
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• pp.211-217
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• 1998

#7740 interlayer를 적용하여 Si 기관과 ITO가 코팅된 #7059 기판을 정전 열 접합하였다. SIMS 분석을 통하여 #7740 interlayer 내에 존재하는 $Na^{+}$ 이온들의 열-전기적 이동이 접합 메카니즘으로 작용함을 확인하였다. 우수한 접합을 얻기 위한 온도 및 전압 범위는 각각 $180{\sim}200^{\circ}C$ and $50{\sim}70V_{dc}$(10분)으로 나타났다. 이러한 저온 Si-ITO 코팅 유리 간의 접합 공정은 전계 방출 표시 소자의 패키징에 유용하게 이용될 수 있을 것으로 기대된다.