• Title/Summary/Keyword: Sensor Packaging

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Fabrication and Gas Sensing Properties of WO$_3$Thick Film Gas Sensor Dependent on Heat-Treatment Condition (소성 조건에 따른 WO$_3$계 후막센서소자의 제조 및 응답특성)

  • 정용근;엄우식;이희수;최성철
    • Journal of the Microelectronics and Packaging Society
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    • v.6 no.2
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    • pp.63-68
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    • 1999
  • We have fabricated $WO_3$ thick film gas sensor under various firing conditions in order to study gas sensing properties in terms of the variation of microstructure and non-stoichiometric structure of gas sensing layer. $WO_3$ paste mixed homogeneously with organic vehicle was coated by screen printing method on alumina substrate composed of Au electrode and $RuO_2$heater on each side. To change filing condition, sensing materials were fared at 600-$800^{\circ}C$ for 1 hour and refired at $700^{\circ}C$ for 1 hour in the mixtures of $_Ar/O2$gas. In the result of heat-treatment, $WO_3$ gas sensor fared at $700^{\circ}C$ showed best gas sensing properties of 210 gas sensitivity and 2 second response time and the best firing environment was 40-50% of $Ar/O_2$gas.

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Low Cost and High Sensitivity Flexible Pressure Sensor Based on Graphite Paste through Lamination after O2 Plasma Surface Treatment Process (O2 플라즈마 표면 처리 공정 후 라미네이션 공정으로 제작된 흑연 페이스트 기반의 저비용 및 고감도 유연 압력 센서)

  • Nam, Hyun Jin;Kang, Cheol;Lee, Seung-Woo;Kim, Sun Woo;Park, Se-Hoon
    • Journal of the Microelectronics and Packaging Society
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    • v.29 no.4
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    • pp.21-27
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    • 2022
  • Flexible pressure sensor was developed using low-cost conductive graphite as printed electronics. Flexible pressure sensors are attracting attention as materials to be used in future industries such as medical, games, and AI. As a result of evaluating various electromechanical properties of the printed electrode for flexible pressure sensors, it showed a constant resistance change rate in a maximum tensile rate of 20%, 30° tension/bending, and a simple pulse test. A more appropriate matrix pattern was designed by simulating the electrodes for which this verification was completed. Utilizing the Serpentine pattern, we utilized a process that allows simultaneous fabrication and encapsulation of the matrix pattern. One side of the printed graphite electrode was O2 plasma surface treated to increase adhesive strength, rotated 90 times, and two electrodes were made into one through a lamination process. As a result of pasting the matrix pattern prepared in this way to the wrist pulse position of the human body and proceeding with the actual measurement, a constant rate of resistance change was shown regardless of gender.

Thick Film Gas Sensor Based on PCB by Using Nano Particles (나노 입자를 이용한 PCB 기반 후막 가스 센서)

  • Park, Sung-Ho;Lee, Chung-Il;Song, Soon-Ho;Kim, Yong-Jun
    • Journal of the Microelectronics and Packaging Society
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    • v.14 no.2 s.43
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    • pp.59-63
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    • 2007
  • This paper presented a low-cost thick film gas sensor module, which was based on simple PCB (Printed Circuit Board) process. The proposed sensor module included a $NO_2/H_2$ gas sensor, a relative humidity sensor, and a heating element. The $NO_2/H_2$ gas and relative humidity sensors were realized by screen-printing $SnO_2,\;BaTiO_3$ nano-powders on IDTS (Interdigital Transducer) of a PCB substrate, respectively. At first 1% $H_2$ gas flowed into the sensor chamber. After 4 min, air filled the chamber while $H_2$ gas flow stopped. This experiment was performed repeatedly. The Identical procedure was used for the $NO_2$ detection. The result for sensing $H_2$ gas showed the increase of voltage from 0.8V to 3.5V due to the conductance increase and its reaction response time by hydrogen flow was 65 sec. $NO_2$ sensing results showed 2.7 V voltage drop due to the conductance decrease and its response time was 3 sec through a voltage monitoring.

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I-V Characteristics of a Methanol Sensor for Direct Methanol fUel Cell(DMFC) as a Function of Deposited Platinum(Pt) Thickness (직접 메탄올 연료전지용 메탄올 센서의 백금 두께의 변화에 따른 전류-전압 특성 변화)

  • Yang, Jin-Seok;Kim, Seong-Il;Kim, Chun-Keun;Park, Jung-Ho
    • Journal of the Microelectronics and Packaging Society
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    • v.14 no.1
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    • pp.49-53
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    • 2007
  • The direct methanol fuel cell (DMFC) is a promising power source for portable applications due to many advantages such as simple construction, compact design, high energy density, and relatively high energy-conversion efficiency. In this work, an electrochemical methanol sensor for monitoring the methanol concentration in direct methanol fuel cells was fabricated using a thin composite nafion membrane as the electrolyte. We have analyzed the I-V characteristic of the fabricated methanol sensor as a function of methanol concentration, catalyst electrode and platinum(Pt) thickness. The fabricated sensor was analyzed by I-V measurement with various methanol concentration. When we measured the sensor characteristics with 10nm Pt and at 1V, the current value was $1.30{\times}10^{-6}A,\;1.96{\times}10^{-6}A\;and\;2.80{\times}10^{-6} A$ for three methanol concentration of 1M, 2M and 3M, respectively. When the methanol concentration was fixed at 2M, the current value of the fabricated device with Pt layers of 5, 10 and 15 nm thickness was $3.06{\times}10^{-6}A,\;1.96{\times}10^{-6}A\;and\;1.00{\times}10^{-6}A$, respectively. These results lead us to the conclusion that when the methanol concentration increases, the output current increases and when the catalyst electrode become thinner, the current increase more. It showed that, the thinner the catalyst electrode, the more electrochemistry become activation.

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Low Temperature Hermetic Packaging using Localized Beating (부분 가열을 이용한 저온 Hermetic 패키징)

  • 심영대;김영일;신규호;좌성훈;문창렬;김용준
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.10a
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    • pp.1033-1036
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    • 2002
  • Wafer bonding methods such as fusion and anodic bonding suffer from high temperature treatment, long processing time, and possible damage to the micro-scale sensor or actuators. In the localized bonding process, beating was conducted locally while the whole wafer is maintained at a relatively low temperature. But previous research of localized heating has some problems, such as non-uniform soldering due to non-uniform heating and micro crack formation on the glass capsule by thermal stress effect. To address this non-uniformity problem, a new heater configuration is being proposed. By keeping several points on the heater strip at calculated and constant potential, more uniform heating, hence more reliable wafer bonding could be achieved. The proposed scheme has been successfully demonstrated, and the result shows that it will be very useful in hermetic packaging. Less than 0.2 ㎫ contact Pressure were used for bonding with 150 ㎃ current input for 50${\mu}{\textrm}{m}$ width, 2${\mu}{\textrm}{m}$ height and 8mm $\times$ 8mm, 5mm$\times$5mm, 3mm $\times$ 3mm sized phosphorus-doped poly-silicon micro heater. The temperature can be raised at the bonding region to 80$0^{\circ}C$, and it was enough to achieve a strong and reliable bonding in 3minutes. The IR camera test results show improved uniformity in heat distribution compared with conventional micro heaters. For gross leak check, IPA (Isopropanol Alcohol) was used. Since IPA has better wetability than water, it can easily penetrate small openings, and is more suitable for gross leak check. The pass ratio of bonded dies was 70%, for conventional localized heating, and 85% for newly developed FP scheme. The bonding strength was more than 30㎫ for FP scheme packaging, which shows that FP scheme can be a good candidate for micro scale hermetic packaging.

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Thermocompression bonding for wafer level hermetic packaging of RF-MEMS devices (RF-MEMS 소자의 웨이퍼 레벨 밀봉 패키징을 위한 열압축 본딩)

  • Park, Gil-Soo;Seo, Sang-Won;Choi, Woo-Beom;Kim, Jin-Sang;Nahm, Sahn;Lee, Jong-Heun;Ju, Byeong-Kwon
    • Journal of Sensor Science and Technology
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    • v.15 no.1
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    • pp.58-64
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    • 2006
  • In this study, we describe a low-temperature wafer-level thermocompression bonding using electroplated gold seal line and bonding pads by electroplating method for RF-MEMS devices. Silicon wafers, electroplated with gold (Au), were completely bonded at $320^{\circ}C$ for 30 min at a pressure of 2.5 MPa. The through-hole interconnection between the packaged devices and external terminal did not need metal filling process and was made by gold films deposited on the sidewall of the throughhole. This process was low-cost and short in duration. Helium leak rate, which is measured to evaluate the reliability of bonded wafers, was $2.7{\pm}0.614{\times}10^{-10}Pam^{3}/s$. The insertion loss of the CPW packaged was $-0.069{\sim}-0.085\;dB$. The difference of the insertion loss between the unpackaged and packaged CPW was less than -0.03. These values show very good RF characteristics of the packaging. Therefore, gold thermocompression bonding can be applied to high quality hermetic wafer level packaging of RF-MEMS devices.

Miniaturized Methanol Sensor with Porous Pt-Au Electrode (다공성 Pt-Au 전극을 이용한 초소형 메탄올 센서)

  • Kim, Jung-Doo;Lee, Yi-Jae;Park, Jae-Yeong
    • Proceedings of the KIEE Conference
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    • 2009.07a
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    • pp.1539_1540
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    • 2009
  • 본 논문에서는 Porous Au-Pt 전극을 기반으로 연료전극과 공기전극으로 구성된 초소형 메탄올 센서를 설계 및 제작하고 그 특성을 분석해 보았다. 제안된 Porous Au-Pt 전극은 Porous 구조의 금속을 만드는 방법 중 하나인 Templating기법을 적용하여 수백나노 크기의 Pore들을 가진 Porous Au 전극을 제작하였고 그 위에 수 나노 크기의 Pt particles을 전해 도금하여 제작되었다. 고분자 전해질막 층으로서 Nafion film은 전해 도금한 Porous Au-Pt 전극 사이에 삽입하고 hot Pressing 통하여 센서를 구성하였다. Porous Au-Pt 전극을 기반으로한 전기화학 메탄올 센서는 $0.25\;cm^2$ 의 작은 전극 면적에도 불구하고 넓은 온도 범위 ($20^{\circ}C-100^{\circ}C$) 에서 온도에 따른 뛰어난 선형성(Correlation coefficient = 0.986)을 보였으며, 특히, 일정온도 ($60^{\circ}C$)에서 메탄올 농도 0 M에서 2 M 까지의 전류응답 특성을 측정, 분석 결과 메탄올 농도에 따른 9.6 mA/$mM{\cdot}cm^2$ 의 민감도 및 10 초 이내의 응답시간 특성을 보였다.

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Characterization of Nafion Coated Non-enzymatic Glucose Sensor in Human Plasma and Whole Blood (나피온을 이용하여 패키징된 무효소 혈당센서의 혈장 및 전혈에서의 특성 평가)

  • Lee, Yi-Jae;Kim, Jung-Doo;Park, Jae-Yeong
    • Proceedings of the KIEE Conference
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    • 2008.07a
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    • pp.1474-1475
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    • 2008
  • 본 논문에서는 nanoporous Pt (Platinum) 전극을 이용한 무효소 혈당센서의 생체 적합성 및 전류응답 특성 향상을 위해 다양한 패키징 방법이 제안되었다. 생체적합성을 갖는 Nafion 멤브레인을 dipping, spin coating, chemical bonding 방법으로 패키징 한 후, 다양한 글루코오스 농도의 혈장, 전혈에서 특성을 분석, 비교하였다. 단백질 등이 포함되지 않은 환경에서 spin coating 방법으로 패키징한 센서의 전류응답 특성은 가장 좋았지만, 혈장 및 전혈에서는 dipping, chemical bonding 방법으로 패키징한 센서의 전류응답 특성에 미치지 못했다. Nafion film을 센서와 chemical bonding한 센서의 혈장에서 sensitivity 는 0.32 ${\mu}A/mM{\cdot}cm^2$ 이었다. 한편, 전혈에서 bare 센서가 급격한 bio-fouling 현상을 보이는 반면 패키징한 센서는 글루코오스 농도에 따라 일정한 전류변화를 보였다. 이는 Nafion을 이용하여 패키징한 무효소 혈당 센서가 생체환경에 적합할 뿐 아니라 생체이식형 및 연속 측정 가능한 시스템에 적용 가능함을 보여준다.

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Development of Smart Packaging for Cream Type Cosmetic (크림 제형 화장품용 스마트 패키징 기술 개발)

  • Jeon, Sooyeon;Moon, Byounggeoun;Oh, Jaeyoung;Kang, Hosang;Jang, Geun;Lee, Kisung
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.25 no.3
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    • pp.79-87
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    • 2019
  • The degree of cosmetic's oxidation depends on the storage conditions and external conditions when using the product. The microbial contamination and oxygen exposure often results in the quality deterioration of cosmetics. In addition, the problem is that consumers often use cream-type cosmetics, which have short expiration period (6-12 months), even after the product is expired. When using the deteriorated cosmetics, it can be fatal to consumers' safety including some symptoms such as folliculitis, rashes, edema, and dermatitis. Therefore, it is necessary to develop sealed smart packaging for cosmetics to prevent the deterioration of cosmetics and improve consumer safety. In this study, we have developed smart packaging design for cosmetics that can measure the surrounding environment and expiration date for the cosmetics in the real time. In addition, the smart packaging includes sensor, which are linked to the mobile application. Users can find out the measurement results through the application. Also, the packaging design and functions were set up based on the survey results by the user and feasible model can be produced based on user choice. The measurement in the three environment has been done after manufactured the sensor, PCB, and mobile application. As a result, it works normally within a certain range under all three environmental conditions. It is believed that the information on expiration dates and storage environment can be efficiently delivered to the consumers through developed cosmetics smart packaging and applications. The development of UI/UX design for consumer is further studied. The UX/UI design of the application plays an essential role in achieving this goal through the commercialization the cosmetic products in the wide range.

A Study on Characteristics of Laser Cladding Layer of STS316L (STS316L 분말의 레이저 클래딩층 특성에 관한 연구)

  • Hong, SungMoo;Oh, JaeYong;Kim, DongSeob;Chang, SeungCheol;Shin, BoSung
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.3
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    • pp.53-56
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    • 2017
  • Laser cladding is a technique for forming beads by melt-sintering with a laser while directly feeding metal powder onto the base material through nozzles. This technique, which is applied in laser surface treatment technology, is useful for repairing broken or worn parts by allowing selective formation of the surface layer of the base metal material. In this paper, laser cladding process was performed on STS316L powder using high power continuous wave laser with IR wavelength and the cladding characteristics according to process conditions were experimentally analyzed.