• 반도체디스플레이기술학회지
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• 제5권4호
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• pp.17-22
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• 2006

In the manufacturing processes of semiconductor, test process is important for quality of products. In the manufacturing process of dynamic memory, memory test is more important. So, automatic test equipment(ATE) is used necessarily. But, according to increase of speed of dynamic memory operation, the rapid test equipment is needed. Impedance matching between ATE and dynamic memory is expected to be an important problem for making a rapid test equipment over 1Gbps. According to increase of speed, inner impedance of ATE also works on important parameter for test. This paper is about the method that is for impedance matching of inner impedance and coaxial cable occurring in manufacturing of ATE. We proved effects of inner impedance by electric theory and verified the method of impedance matching using computer simulation.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2008년도 춘계학술대회논문집
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• pp.569-574
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• 2008

Nowadays, the equipment for a semiconductor process is required to raise accuracy and productivity. Therefore, the natural frequency of the equipment has been lowered because it has been precise, rapid, large, and light. In order to improve the efficiency of production, it is necessary for the equipment to increase the operation speed, which causes inevitable vibration problems. In this paper, influence analysis of ball-screw in the equipment and evaluation method for the vibration on the base are presented based on the analyses of dynamic characteristics for the mechanical structure through the modal test.

• 반도체디스플레이기술학회지
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• 제11권2호
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• pp.59-62
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• 2012

This test method covers a procedure for measuring particle removal characteristic of equipment fan filter unit(EFFU) installed inside of semiconductor process equipments, FPD manufacturing equipments and so on. Since EFFU is a combination of air filter and the assembly of fan, motor and frame, the integrity of these parts is very important for the performance of EFFU. So a conventional particle removal test method for air filters is not suitable for EFFU particle removal performance. This test method defines an evaluation method for EFFU which is installed inside an enclosed space to remove particles that are generated inside process equipment. The particle removal performance of EFFUs is usually depending on the performance of filter media and air flow rate. To understand a performance of an EFFU, the filter media characteristic, air flow rate and the integrity of EFFU parts should be considered simultaneously. This test method is intended to demonstrate the system performance of an EFFU and successfully evaluated EFFU performance characteristics.

• 한국산학기술학회논문지
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• 제15권10호
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• pp.5906-5911
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• 2014

요즈음 생산되는 반도체의 제품이 제대로 작동하는지, 낮은 습도 또는 높은 온도에서 잘 견디는가를 검사하는 패키지 조립 및 검사 공정이 현장에 많이 있다. 또한 검사공정에서 사용되고 있는 반도체 테스트 핸들러 픽커 검사장비가 있는데, 본 연구에서는 CATIA 프로그램을 이용하여 3D 모델링하였으며, ANSYS 프로그램을 이용하여 반도체 테스트 핸들러 픽커 검사장비 프레임의 모델에 대하여 3가지 피로하중에 대한 해석을 하였다. 해석 결과로서 Case 1과 Case 2 모두 프레임의 가운데에서 최대 변형량이 발생하고 불규칙 피로 하중들 중에서 가장 하중의 변동이 심한 'SAE bracket history'가 가장 불안정하고 'Sample history'가 가장 안정함을 보이고 있다. 본 연구의 피로 해석 결과는 반도체 테스트 핸들러 픽커 검사장비 프레임의 파손방지 및 내구성을 검토함으로서 그 프레임의 설계에 효율적으로 활용이 될 수 있다.

• 한국기계가공학회지
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• 제11권3호
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• pp.182-186
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• 2012

This paper aims to analyze the vibration characteristics of the test equipment that inspects any defects in manufactured semiconductor chips and classifies defective chips. This type of equipment should be robust against any vibrations because such vibrations can cause disruption in the process that requires higher precision. 3D model of the structure of the equipment has been used to configure vibration simulation model. Model analysis have been carried out to analyze which part of the equipment is weak against vibration. To minimize the vibration effect of the equipment, the thickness of the plate consist of the equipment and weights are modified. The results show that thicker plate and higher weight in the equipment can decrease vibration effect.

• 반도체디스플레이기술학회지
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• 제20권1호
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• pp.25-31
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• 2021

The semiconductor and display equipment demands an ultra-fine precision of several nm to several ㎛, and the scale is getting smaller due to the explosive development. The manufacturing process equipment for such products with ultra-fine precision is very sensitive to ultra-small vibrations flowing from the floor, resulting in problems of production defects and yield degradation. The vibration criteria are a standard that regulates the vibration environment of the floor where such precision process equipment will be installed. The BBN vibration criteria defined the allowable vibration velocity level in the frequency domain with a flat and inclined line and presented a rating according to it. However, the actual vibration criteria have appeared with various magnitudes in the frequency domain according to the dynamic characteristics of individual equipment. In this study, the relationship between the relative motion of two major points in the equipment and the vibration magnitude of the floor is presented using the frequency response function of a simple 3-DOF model. It is describing the magnitudes according to the frequency of the floor vibration that guarantees the allowable relative motion and this can be used as the vibration criteria. In order to obtain the vibration criteria experimentally a method of extracting through a modal test was introduced and verified analytically. It provides vulnerable frequency and magnitude to floor vibration in consideration of the dynamic characteristics of individual equipment. And it is possible to know necessary to improve the dynamic characteristics of the equipment, and it can be used to check the vibration compatibility of the place where the equipment will be installed.

• 반도체디스플레이기술학회지
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• 제2권3호
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• pp.13-18
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• 2003

A remote monitoring system of the semiconductor equipment is used to monitor or control operations of the equipment. Most of the conventional monitoring systems are based on the client-server model with the general purpose PC. Basically, it implies the difficulties in the system reliability and cost down due to its size and complexity. To overcome these difficulties, we suggest an embedded web server which is based on the low-cost microprocessor. It is designed for the monitoring or controlling a dedicated equipment only. To evaluate the feasibility of the suggested embedded web server, we have implemented a test-board with ATMega103 and programmed the basic modules using the AVR-GCC. Finally, we have tested its operations on the MS Explorer 6.0 environment.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2003년도 춘계학술대회 발표 논문집
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• pp.51-54
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• 2003

반도체 산업의 발전에 따라 생산과정에서의 반도체 소자의 특성을 검사하고, 오류를 검출하는 작업을 효율성 있게 하여 생산성을 향상시키는 것이 더욱 중요시 되고 있다. 이러한 흐름에 맞추어 반도체 test장비에 VFCS(voltage forcing current sensing)와 CFVS(current forcing voltage sensing)를 test 할 수 있게 개발하였다.

• 한국산학기술학회논문지
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• 제13권6호
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• pp.2472-2478
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• 2012

본 연구는 반도체 산업에서 반도체장비 유지보수에 사용되어지는 반도체장비 유지보수 분야의 전문기술인력을 효과적으로 양성할 수 있는 반도체장비 유지보수의 자격종목을 개발하고자 하는데 그 목적이 있다. 연구의 목적을 달성하기 위하여 반도체장비 유지보수 분야의 국내외 실태 조사, 문헌조사를 통하여 반도체장비 유지보수 관련 교육훈련기관 및 검정 수요 예상 인력을 파악했으며, 유사자격제도(전자부품장착기능사, 전자부품장착산업기사, 생산자동화기능사, 생산자동화산업기사)를 분석하였고, 직무분석을 통하여 반도체장비유지보수기능사의 직무 및 교육내용을 분석하였다. 또한 반도체장비 유지보수 자격종목 신설에 대한 설문조사를 실시했으며, 반도체장비유지보수기능사 자격종목의 출제기준 및 채점 방법을 제시했고, 필기시험과 실기시험에 대한 모의 검정시험도 실시하였다. 이러한 결과를 토대로 반도체장비유지보수기능사에 대한 교육프로그램을 만들었으며, 자격검정을 실시할 수 있는 출제기준을 제시하였다.

• 반도체디스플레이기술학회지
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• 제18권4호
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• pp.92-95
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• 2019

Automation control and the data for control of industrial equipment for the diagnosis and prediction is a key to success in the 4th industrial revolution. It increases process efficiency and productivity through data collection, realtime monitoring, and the data analysis. However, university and research environment are still suffering from logging the data in manual way, and we occasionally loss the equipment data logging due to the lack of automatic data logging system. State variable presents the current condition of the equipment operation which is closely related to process result, and it is valuable to monitor and analyze the data for the equipment health monitoring. In this paper, we demonstrate the collection of equipment state variable data via programmable logic controller (PLC) and the visualization of the collected data over the Web access supervisory control and data acquisition (SCADA). Test vehicle for the implementation of the suggested SCADA system is a relay switched physical vapor deposition system in the university environment.