• Journal of the Semiconductor & Display Technology
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• v.5 no.4 s.17
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• pp.17-22
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• 2006

In the manufacturing processes of semiconductor, test process is important for quality of products. In the manufacturing process of dynamic memory, memory test is more important. So, automatic test equipment(ATE) is used necessarily. But, according to increase of speed of dynamic memory operation, the rapid test equipment is needed. Impedance matching between ATE and dynamic memory is expected to be an important problem for making a rapid test equipment over 1Gbps. According to increase of speed, inner impedance of ATE also works on important parameter for test. This paper is about the method that is for impedance matching of inner impedance and coaxial cable occurring in manufacturing of ATE. We proved effects of inner impedance by electric theory and verified the method of impedance matching using computer simulation.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2008.04a
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• pp.569-574
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• 2008

Nowadays, the equipment for a semiconductor process is required to raise accuracy and productivity. Therefore, the natural frequency of the equipment has been lowered because it has been precise, rapid, large, and light. In order to improve the efficiency of production, it is necessary for the equipment to increase the operation speed, which causes inevitable vibration problems. In this paper, influence analysis of ball-screw in the equipment and evaluation method for the vibration on the base are presented based on the analyses of dynamic characteristics for the mechanical structure through the modal test.

• Journal of the Semiconductor & Display Technology
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• v.11 no.2
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• pp.59-62
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• 2012

This test method covers a procedure for measuring particle removal characteristic of equipment fan filter unit(EFFU) installed inside of semiconductor process equipments, FPD manufacturing equipments and so on. Since EFFU is a combination of air filter and the assembly of fan, motor and frame, the integrity of these parts is very important for the performance of EFFU. So a conventional particle removal test method for air filters is not suitable for EFFU particle removal performance. This test method defines an evaluation method for EFFU which is installed inside an enclosed space to remove particles that are generated inside process equipment. The particle removal performance of EFFUs is usually depending on the performance of filter media and air flow rate. To understand a performance of an EFFU, the filter media characteristic, air flow rate and the integrity of EFFU parts should be considered simultaneously. This test method is intended to demonstrate the system performance of an EFFU and successfully evaluated EFFU performance characteristics.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.10
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• pp.5906-5911
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• 2014

Currently, there are many processes of package assembly and inspections of real fields that examine whether a manufactured semiconductor can be operated regularly and can endure low humidity or high temperatures. As the inspection equipment of a semiconductor test handler picker has been used at the inspection process, these inspection equipment frames were modelled in 3D and these models were analyzed using 3 kinds of fatigue loadings. As the analysis result, maximum deformation occurred at the midparts of the frames at cases 1 and 2. Among the cases of nonuniform fatigue loads, the 'SAE bracket history' with the severest change in load became the most unstable but the 'Sample history' became the most stable. Fatigue analysis result can be used effectively with the design of an inspecting equipment frame of a semiconductor test handler picker to examine the prevention and durability against damage.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.3
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• pp.182-186
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• 2012

This paper aims to analyze the vibration characteristics of the test equipment that inspects any defects in manufactured semiconductor chips and classifies defective chips. This type of equipment should be robust against any vibrations because such vibrations can cause disruption in the process that requires higher precision. 3D model of the structure of the equipment has been used to configure vibration simulation model. Model analysis have been carried out to analyze which part of the equipment is weak against vibration. To minimize the vibration effect of the equipment, the thickness of the plate consist of the equipment and weights are modified. The results show that thicker plate and higher weight in the equipment can decrease vibration effect.

• Journal of the Semiconductor & Display Technology
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• v.20 no.1
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• pp.25-31
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• 2021

The semiconductor and display equipment demands an ultra-fine precision of several nm to several ㎛, and the scale is getting smaller due to the explosive development. The manufacturing process equipment for such products with ultra-fine precision is very sensitive to ultra-small vibrations flowing from the floor, resulting in problems of production defects and yield degradation. The vibration criteria are a standard that regulates the vibration environment of the floor where such precision process equipment will be installed. The BBN vibration criteria defined the allowable vibration velocity level in the frequency domain with a flat and inclined line and presented a rating according to it. However, the actual vibration criteria have appeared with various magnitudes in the frequency domain according to the dynamic characteristics of individual equipment. In this study, the relationship between the relative motion of two major points in the equipment and the vibration magnitude of the floor is presented using the frequency response function of a simple 3-DOF model. It is describing the magnitudes according to the frequency of the floor vibration that guarantees the allowable relative motion and this can be used as the vibration criteria. In order to obtain the vibration criteria experimentally a method of extracting through a modal test was introduced and verified analytically. It provides vulnerable frequency and magnitude to floor vibration in consideration of the dynamic characteristics of individual equipment. And it is possible to know necessary to improve the dynamic characteristics of the equipment, and it can be used to check the vibration compatibility of the place where the equipment will be installed.

• Journal of the Semiconductor & Display Technology
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• v.2 no.3
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• pp.13-18
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• 2003

A remote monitoring system of the semiconductor equipment is used to monitor or control operations of the equipment. Most of the conventional monitoring systems are based on the client-server model with the general purpose PC. Basically, it implies the difficulties in the system reliability and cost down due to its size and complexity. To overcome these difficulties, we suggest an embedded web server which is based on the low-cost microprocessor. It is designed for the monitoring or controlling a dedicated equipment only. To evaluate the feasibility of the suggested embedded web server, we have implemented a test-board with ATMega103 and programmed the basic modules using the AVR-GCC. Finally, we have tested its operations on the MS Explorer 6.0 environment.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.05a
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• pp.51-54
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• 2003

반도체 산업의 발전에 따라 생산과정에서의 반도체 소자의 특성을 검사하고, 오류를 검출하는 작업을 효율성 있게 하여 생산성을 향상시키는 것이 더욱 중요시 되고 있다. 이러한 흐름에 맞추어 반도체 test장비에 VFCS(voltage forcing current sensing)와 CFVS(current forcing voltage sensing)를 test 할 수 있게 개발하였다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.6
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• pp.2472-2478
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• 2012

This research is aiming to develop Semiconductor equipment maintenance certification course to train qualified maintenance experts more effectively requested in related semiconductor industry. In the course of research, we adopted diverse research technique such as interview, on-spot investigation, documentary references to analyze current status of related training facilities, and forecast the population of test applicants. We analyzed similar certification course(Craftsman SMT, Industrial Engineer SMT, Craftsman Mechatronics, Industrial Enginee Mechatronics, et) as reference to set up job objectives and curriculum of semiconductor equipment maintenance certification. We conducted survey on expectations on newly created certificate, presented evaluation standard and objective of test, and preliminary writing test and demonstration test. Based on the result of various research, we were able to present training program for semiconductor equipment maintenance certification and set the assessment standard of qualification exam.

• Journal of the Semiconductor & Display Technology
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• v.18 no.4
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• pp.92-95
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• 2019

Automation control and the data for control of industrial equipment for the diagnosis and prediction is a key to success in the 4th industrial revolution. It increases process efficiency and productivity through data collection, realtime monitoring, and the data analysis. However, university and research environment are still suffering from logging the data in manual way, and we occasionally loss the equipment data logging due to the lack of automatic data logging system. State variable presents the current condition of the equipment operation which is closely related to process result, and it is valuable to monitor and analyze the data for the equipment health monitoring. In this paper, we demonstrate the collection of equipment state variable data via programmable logic controller (PLC) and the visualization of the collected data over the Web access supervisory control and data acquisition (SCADA). Test vehicle for the implementation of the suggested SCADA system is a relay switched physical vapor deposition system in the university environment.