• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1997년도 한국자동제어학술회의논문집; 한국전력공사 서울연수원; 17-18 Oct. 1997
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• pp.664-667
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• 1997

For higher component density per chip, it is necessary to identify and control the semiconductor manufacturing process more stringently. Recently, neural networks have been identified as one of the most promising techniques for modeling and control of complicated processes such as plasma etching process. Since wafer states after each run using identical recipe may differ from each other, conventional neural network models utilizing input factors only cannot represent the actual state of process and equipment. In this paper, in addition to the input factors of the recipe, real-time tool data are utilized for modeling of 64M DRAM s-poly plasma etching process to reflect the actual state of process and equipment. For real-time tool data, we collect optical emission spectroscopy (OES) data. Through principal component analysis (PCA), we extract principal components from entire OES data. And then these principal components are included to input parameters of neural network model. Finally neural network model is trained using feed forward error back propagation (FFEBP) algorithm. As a results, simulation results exhibit good wafer state prediction capability after plasma etching process.

• 산업공학
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• 제20권3호
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• pp.288-297
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• 2007

Success of semiconductor/LCD industry depends on its yield and quality of product. For the purpose, FDC (Fault Detection and Classification) system is used to diagnose fault state in main manufacturing processes by monitoring time series data collected by equipment sensors which represent various conditions of the equipment. The data set is segmented at the start and end of each product lot processing by a trigger event module. However, in practice, segmented sensor data usually have the features of data asynchronization such as different start points, end points, and data lengths. Due to the asynchronization problem, false alarm (type I error) and missed alarm (type II error) occur frequently. In this paper, we propose a robust process fault detection system by integrating a process event detection method and a similarity measuring method based on dynamic time warping algorithm. An experiment shows that the proposed system is able to recognize abnormal condition correctly under the asynchronous data situation.

• 한국정보시스템학회지:정보시스템연구
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• 제26권2호
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• pp.105-121
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• 2017

Purpose It is a major goal to improve the product yields during production operations in the manufacturing industry. Therefore, factory is trying to keep the good quality materials and proper production resources, also find the proper condition of facilities and manufacturing environment for yields improvement. Design/methodology/approach We propose the hybrid framework to analyze to dataset extracted from MES. Those data is about the alarm information generated from equipment, both measurement and equipment process value from production and cycle/pitch time measured from production data these covered products during production. We adapt a data warehousing techniques for organizing dataset, a logistic regression for finding out the significant factors, and a association analysis for drawing the rules which affect the product yields. And then we validate the framework by applying the real data generated from the discrete process in secondary cell battery manufacturing. Findings This paper deals with challenges to apply the full potential of modeling and simulation within CPPS(Cyber-Physical Production System) and Smart Factory implementation. The framework is being applied in one of the most advanced and complex industrial sectors like semiconductor, display, and automotive industry.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 하계학술대회 논문집 A
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• pp.156-158
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• 2002

In this paper, we analyze about voltage sag effect at load side during fault according to change of power system condition. through the case studies, we find that there is no close connection between substation bus transfer and voltage sag during fault. however, we find that other feeder connecting with the faulted transmission is directly affected by fault type and magnitude, therefore, the main subject can be divided into the utility and customer side countermeasures, utilities concentrate their effort to prevent the faults and to modify the fault clearing practice in power system. however, the faults in power system can never be completely eliminated. therefore, customer side solutions usually involve the power conditioning equipment for sensitive loads aiso, we investigate that the several methods to reduce the number and severity of voltage sag and to dull the sensitivity of equipment for voltage sag have developed. moreover, about SEMI, the industry association for the semiconductor two voltage sag immunity standards.(SEMI F47, SEMI F42) The simulation is accomplished by PSS/E 26.

• 대한의용생체공학회:의공학회지
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• 제29권1호
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• pp.82-87
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• 2008

In this paper, the study was carried out to design and implement the medical compound stimulator based on the preexisting individual medical stimulators with Low frequency, High frequency and cooling stimulation. The proposed equipment is designed to compound all the functions including a cooling stimulation with a range of $0{\sim}20^{\circ}C$ and the verified low and high frequencies of 250Hz, 500Hz, 1KHz and 1MHz respectively from the previous clinical experiment with a consideration of its credibility and efficiency. Also, it was constructed by using a new technique, thermoelectricity semiconductor with a consideration of miniaturization and stability. In accordance with patients' treatment purpose, the hand piece of low frequency/cooling stimulation and High frequency/cooling stimulation were separately designed for convenience. The frequency, accuracy and other factors of implemented medical compound stimulator was satisfied according to its measurement. It was also tested by Korean Testing Laboratory (KTL) for its stability and efficacy and it confirmed that the medical compound stimulator is suitable for use as it fits in with the medical equipment standards.

• 정보처리학회논문지:컴퓨터 및 통신 시스템
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• 제10권7호
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• pp.205-214
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• 2021

반도체 물류 공정은 스마트 제조를 위해 물류 자동화 시스템을 운영한다. 물류 자동화 시스템 중 하나인 OCS(OHT Control System)는 천장에 설치된 레일을 따라 이동하는 OHT(Overhead Hoist Transport)를 자율적으로 제어하는 시스템이다. 본 논문은 반도체 물류 공정에서 효율적인 작업 계획을 위한 실시간 스케줄링 시스템을 제안한다. 제안 시스템의 주된 역할은 OHT 할당 및 최적경로 생성이며, 전체 OCS에서 별도의 독립된 시스템으로 개발하여 시스템의 수정 및 확장이 용이하도록 구성하였다. 시스템 개발을 위해 반도체 물류의 기능 요구사항을 식별하고, 명령 유형에 따른 OHT 제어 시나리오를 정의하였다. 그리고 시스템 간 연동 확장성을 위해 국제반도체장비재료협회(SEMI) 규격을 적용하여 시퀀스 다이어그램과 인터페이스 메시지를 설계하였다. 기능 요구사항과 설계 문서를 바탕으로 개발된 스케줄링 시스템은 Main 시스템 및 데이터베이스와 실시간 연동되어 OHT의 최적할당 및 경로제어를 수행한다. 개발 시스템의 기능 검증을 위해 실제 반도체 물류 현장에서 OCS Main 시스템과 통합시험을 수행하였다. 6가지의 기본 시나리오와 2가지의 예외 시나리오에서 개발 시스템이 OHT 최적할당과 경로제어를 성공적으로 수행함을 검증하였다.

• Transactions on Electrical and Electronic Materials
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• 제12권2호
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• pp.56-59
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• 2011

The characterization of the chemical mechanical polishing (CMP) process for undensified phophosilicate glass (PSG) film is reported using design of experiments (DOE). DOE has been used by experimenters to understand the relationship between the input variables and responses of interest in a simple and efficient way, and it typically is beneficial for determining the appropriatesize of experiments with multiple process variables and making statistical inferences for the responses of interest. The equipment controllable parameters used to operate the machine consist of the down force of the wafer carrier, pressure on the back side wafer, table and spindle speeds (SS), slurry flow (SF) rate, pad condition, etc. None of these are independent ofeach other and, thus, the interaction between the parameters also needs to be understoodfor improved process characterization in CMP. In this study, we selected the five controllable equipment parameters the most recommendedby process engineers, viz. the down force (DF), back pressure (BP), table speed (TS), SS, and SF, for the characterization of the CMP process with respect to the material removal rate and film uniformity in percentage terms. The polished material is undensified PSG which is widely used for the plananization of multi-layered metal interconnects. By statistical modeling and the analysis of the metrology data acquired from a series of $2^{5-1}$ fractional factorial designs with two center points, we showed that the DF, BP and TS have the greatest effect on both the removal rate and film uniformity, as expected. It is revealed that the film uniformity of the polished PSG film contains two and three-way interactions. Therefore, one can easily infer that process control based on a better understanding of the process is the key to success in current semiconductor manufacturing, in which the size of the wafer is approaching 300 mm and is scheduled to continuously increase up to 450 mm in or slightly after 2012.

• Transactions on Electrical and Electronic Materials
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• 제12권3호
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• pp.115-118
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• 2011

Process characterization of the chemical mechanical polishing (CMP) process for undensified phosphosilicate glass (PSG) film is reported using design of experiments (DOE). DOE has been addressed to experimenters to understand the relationship between input variables and responses of interest in a simple and efficient way. It is typically beneficial for determining the adequate size of experiments with multiple process variables and making statistical inferences for the responses of interests. Equipment controllable parameters to operate the machine include the down force (DF) of the wafer carrier, pressure on the backside of the wafer, table and spindle speed (SS), slurry flow rate, and pad condition. None of them is independent; thus, the interaction between parameters also needs to be indicated to improve process characterization in CMP. In this paper, we have selected the five controllable equipment parameters, such as DF, back pressure (BP), table speed (TS), SS, and slurry flow (SF), most process engineers recommend to characterize the CMP process with respect to material removal rate (RR) and film uniformity as a percentage. The polished material is undensified PSG. PSG is widely used for the plananization in multi-layered metal interconnects. We identify the main effect of DF, BP, and TS on both RR and film uniformity, as expected, by the statistical modeling and analysis on the metrology data acquired from a series of $2^{5-1}$ fractional factorial design with two center points. This revealed the film uniformity of the polished PSG film contains two and three-way interactions. Therefore, one can easily infer that the process control based on better understanding of the process is the key to success in semiconductor manufacturing, typically when the wafer size reaches 300 mm and is continuously scheduled to expand up to 450 mm in or little after 2012.

• 한국정보기술학회논문지
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• 제16권11호
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• pp.23-34
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• 2018

본 논문에서는 고효율 고역률 LED 조명장치용 전원공급장치를 제안한다. 제안한 전원공급장치는 풀브리지 다이오드 정류기와 플라이백 컨버터로 구성된 단일단 전력구조이며, 이에 따라 하나의 제어기 IC와 하나의 전력반도체스위치만을 사용하여 역률개선과 출력전압조정을 동시에 수행한다. 또한 제안한 전원공급장치는 회생스너버를 이용하여 주스위치의 전압스트레스와 스위칭손실을 감소시키며, 동기정류기를 이용하여 시스템 효율을 향상한다. 적용된 동기정류기는 새로운 전압구동형이며 동작과 구성이 간단하다. 본 논문에서는 역률개선부와 주전력변환부의 동작분석을 통하여 제안한 전원공급장치의 동작원리를 설명하고 동기정류기의 동작에 관하여 간략하게 설명한다. 또한 40W급 프로토타입 전력회로의 설계예시를 제시하며, 설계된 회로파라미터들에 의해 제작된 프로토타입의 실험 결과를 통하여 제안한 전원공급장치의 동작특성을 입증한다.

• 한국전자통신학회논문지
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• 제18권4호
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• pp.641-648
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• 2023

최근 4차 산업 혁명 중에서 인공지능의 급성장은 반도체의 성능 향상 및 회로의 집적을 기반으로 진보하였다. 전자기기 및 장비의 내부에서 연산을 돕는 트랜지스터는 고도화 및 소형화 되어 가며 발열의 제어 및 방열의 효율 개선이 새로운 성능의 지표로 대두되었다. DUT(Device Under Test) Shell은 트랜지스터의 검수를 위하여 정격 전류를 인가한 후, 임의의 발열 지점에서 전원을 차단한 상태에서, 방열을 통하여 트랜지스터의 내구도를 평가하여 불량 트랜지스터를 검출하는 장비이다. DUT Shell은 장비 내부의 방열 구조에 따라 동시에 더 많은 트랜지스터를 테스트할 수 있기 때문에 방열 효율은 불량 트랜지스터 검출 효율과 직접적인 관계를 갖는다. 이에 본 논문에서는 DUT Shell의 방열 최적화를 위하여 배치구조의 다양한 방법을 제안하고 전산유체역학을 이용하여 최적의 DUT Shell의 다양한 변형과 열 해석을 제안하였다.