• 대한안전경영과학회:학술대회논문집
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• 대한안전경영과학회 2009년도 추계학술대회
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• pp.187-201
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• 2009

Semiconductor industry is based on equipment industry and timing industry. In particular, semiconductor process is very complex and as semiconductor-chip width tails and is becoming equipment gradually more as a high technology. Equipment operation is primarily engaged in semiconductor manufacturing (engineers and operator) of being conducted by, equipment errors have also been raised. Equipment operational data related to the error of korea occupational safety and health agency were based on data and production engineers involved in the operator's questionnaire was drawn through the error factor. Equipment operating in the error factor of 9 big item and 36 detail item detailed argument based on the errors down, and 9 big item the equipment during operation of the correlation error factor was conducted. Each of the significance level was correlated with the tabulation and analysis. Using the maximum correlation coefficient, the correlation between the error factors to derive the relationship between factors were analyzed. Facility operating with the analysis of error factors (big and detail item) derive a relationship between the model saw. The end of the operation of the facility in operation on the part of the two factors appeared as prevention. Safety aspects and ergonomics aspects of the approach should be guided to the conclusion.

• 반도체디스플레이기술학회지
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• 제21권4호
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• pp.126-131
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• 2022

The number of joint disease patients is increasing every year. Currently, the most CPM(Continuous Passive Motion) equipment uses expensive imported equipment, and one CPM equipment is designed to be used only in one joint, medical personnel or hospitals who are the main users of the medical equipment need to have several types of CPMs for joint rehabilitation. To solve this problem, this paper designed a multifunctional joint medical equipment that enables rehabilitation of knee, shoulder, and elbow joints in one CPM equipment and includes general, intensive, and adaptive exercise functions for effective treatment according to the patient's condition. The patient's condition was diagnosed using a load cell and a current sensor. In this paper, effective rehabilitation methods were presented and high reliability and precision of medical equipment was confirmed through experiments using potentiometer, encoder, and PI controller.

• 한국융합학회논문지
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• 제10권11호
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• pp.85-93
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• 2019

한국은 반도체 산업에서의 독보적 우위에도 불구하고, 반도체 장비 분야에서는 두각을 나타내지 못하고 있다. 세정장비는 반도체 장비 중 한 분야로, 반도체 기술의 고도화에 따라 향후 중요성이 더욱 강조되는 분야이다. 본 연구는 특허 정보를 분석하여 한국을 포함한 주요 국가별 세정장비 분야 기술경쟁력을 파악하고 국가별 중점 기술분야를 살펴보고자 하였다. 이를 위해 최근 10년 간 미국 특허청에 등록된 세정장비 특허를 검색하여, 정량적 특허분석 및 특허 동시분류 네트워크 분석을 실시하였다. 연구 결과, 미국과 일본이 이 분야 기술을 선도하고 있는 것으로 나타났으며, 한국은 이들 선도국에 비해 경쟁력이 크게 뒤쳐짐은 물론, 경쟁국인 대만이나 후발국인 중국에 비해서도 우위에 있다고 보기 어려운 상황이다. 또한 국가별 전문화가 진행되어 있어, 국가 간 협력체제가 원활치 못할 경우 기술장벽으로 작용할 가능성도 없지 않다. 따라서 국내 세정장비 산업의 발전을 위한 적극적인 연구개발과 기술역량 확충이 요구된다.

• 반도체디스플레이기술학회지
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• 제19권4호
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• pp.18-21
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• 2020

Undetected wafer slip during the lift pin-down motion in semiconductor equipment may affect the center to edge variation, wafer warpage, and pattern misalignment in plasma equipment. Direct measuring of the amount of wafer slip inside the plasma process chamber is not feasible because of the hardware space limitation inside the plasma chamber. In this paper, we demonstrated a practice for the wafer lift pin-up and down motions with respect to the gear ratio, operating voltage, and pulse width modulation to maintain accurate wafer position using remote control linear servo motor with an experimentally designed chamber mockup. We noticed that the pin moving velocity and gear ratio are the most influencing parameters to be control, and the step-wised position control algorithm showed the most suitable for the reduction of wafer slip.

• 반도체디스플레이기술학회지
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• 제7권2호
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• pp.39-43
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• 2008

Productivity is one of the performance indices of the semiconductor equipment in manufacturing viewpoint. Among many ways tried and adopted for improvement of the productivity of the FAB equipment, variation of equipment configuration was considered and its effect on the throughput was analyzed. Parallel machine cycle charts that were generated based on the equipment log were used in the analysis. Efficiency of the equipment due to change of the structure and the probability of the usage in the manufacturing process were examined. The results showed that the modification of the control algorithm in the equipment and the redistribution of the process time for each process and transfer module along to the change in the structure enhance the throughput of the equipment.

• 한국CDE학회논문집
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• 제13권4호
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• pp.273-285
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• 2008

In this paper we propose an engineering bill of materials (E-BOM) copy method that can be utilized to manage the product information for each equipment during building a product lifecycle management (PLM) system in the order-specific semiconductor equipment manufacturer. The previous works studied on an E-BOM creation and management method for the mass manufacturing and production. The method is difficult to apply to an environment in which many engineering changes occur and the different specification to each equipment is required such as semiconductor equipments and facilities adopting built-to-order instead of built for inventory. Moreover the method is known to be the major drawback to deteriorate the design efficiency. Our E-BOM copy method enables users efficiently to manage the specification of a product and shortens the product development cycle. To implement the E-BOM copy method in the PLM environment, we developed the E-BOM copy system that automatically generates new parts and their numbers according to the numbering rule while copying the E-BOM from existing semiconductor equipments and then can apply the parts for reuse to new semiconductor equipments. This system can duplicate not only 3D CAD data but also technical documents.

• 실천공학교육논문지
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• 제7권2호
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• pp.125-134
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• 2015

본 연구는 반도체산업에서 반도체 장비의 유지보수를 위한 전문기술인력을 효과적으로 양성할 수 있는 반도체장비 유지보수 기능인력 양성 프로그램을 개발하고자 하는데 그 목적이 있다. 연구의 목적을 달성하기 위하여 반도체장비유지보수 분야의 국내외 실태 조사, 문헌조사를 통하여 반도체장비유지보수 관련 교육훈련 수요 예상 인력을 파악했으며, 직무분석을 통하여 반도체 장비 유지보수 기능 인력의 직무 및 교육내용을 분석하였다. 이러한 결과를 토대로 반도체 장비 유지 보수 기능인력 양성을 위한 교육프로그램을 제시하였다.

• 반도체디스플레이기술학회지
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• 제18권4호
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• pp.40-45
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• 2019

The smart factory has developed with the help of several technologies such as automation, artificial intelligence, big data, smart sensors and communication protocols. The Internet of things(IOT) among communication protocols has become the key factor for the seamless integration of various manufacturing equipment. Therefore, it is important that the IOT cooperate with the standards of communication protocols proposed by the SEMI in the semiconductor industry. In this paper, we suggest a novel reference model of the communication protocols for semiconductor equipment by introducing an IOT service layer. With the IOT service layer, we can use the functions and the additional services provided by the IOT standards that give the inter-operability between factory machines and host computers. We implement the standard of the communication protocols for semiconductor equipment with the IOT service layer by using ns3 simulator. It concludes that it is necessary to provide the platform for the IOT service layer to deploy efficiently the proposed reference model of the communication protocols.

• 반도체디스플레이기술학회지
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• 제19권2호
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• pp.16-21
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• 2020

How accurately reproducible energy is delivered to the wafer in the process of making thin films using PE-CVD (Plasma enhanced chemical vapor deposition) during the semiconductor process. This is the most important technique, and most of the reaction on the wafer surface is made by thermal energy. In this study, we studied the method of monitoring the change of thermal energy transferred to the wafer surface by monitoring the temperature change according to the change of the thin film formed on the showerhead facing the wafer. Through this research, we could confirm the monitoring of wafer thin-film which is changed due to abnormal operation and accumulation of equipment, and we can expect improvement of semiconductor quality and yield through process reproducibility and equipment status by real-time monitoring of problem of deposition process equipment performance.

• 한국항행학회논문지
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• 제14권3호
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• pp.432-438
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• 2010

본 논문에서는 반도체 장비의 상황을 인지하는 시스템을 제안하고 이에 대한 성능을 평가하였다. 제안하는 시스템은 반도체 장비 주변에 배치된 클라이언트 노드의 가속도, 압력, 온도, 가스 센서로부터 정보를 획득하고 서버로 데이터를 전송한다. 서버로 전송된 데이터는 다중 이벤트 및 단일 이벤트의 상황인지 알고리즘을 통해 알람을 3단계로 발생시키게 된다. 제안한 상황인지 시스템의 동작 실험결과에 따른 상황인지 알고리즘을 사용하지 않은 경우보다 알람이 약 80% 정도 적게 발생하여 정보의 신뢰성 및 효율성을 향상시켰으며, 다수의 클라이언트 노드로부터 주위의 정보를 습득할 수 있으므로 반도체 장비의 효과적인 상태감시가 가능함을 확인하였다.