• Journal of Radiation Industry
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• v.5 no.3
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• pp.191-196
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• 2011

The economic scale of nuclear application is a good indicator to show how the radiation technology is useful and contribute to improve public welfare and living standard. Recent research in Japan shows that the economic scale of nuclear field was 4,112 B¥ for radiation application(46%) and 4,741 B¥ for nuclear energy (54%) playing a role of "two wheels of one cart" in nuclear field and the total 8,853 B¥ constitutes 1.8% of gross domestic products (GDP). The radiation application consisted of 2,295 B¥ (56%) in industry (semiconductor, sterilization, nondestructive testing, radiation processing of tires, etc.), 1,538 B¥ (37%) in medicine (therapy and diagnosis such as X-ray, nuclear medicine, computed tomography, etc.) and 279 B¥ (7%) in agriculture (mutation breeding, food irradiation, sterile insect technique, etc.). Radiation application by ${\gamma}$-ray, electron beam and ion beam is steadily increasing in Japan.

• Journal of the Korean Chemical Society
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• v.48 no.6
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• pp.553-560
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• 2004

In this experiment, a three dimensional structure analysis was carried out to examine the surface defects of semiconductor made artificially on known scale. It was investigated the three dimensional imaging according to the sample depth and the thermal diffusivity as well as the carrier transport properties. The thermal diffusivity measurement of the intrinsic GaAs semiconductor was also analyzed by the difference of frequency-dependence photoacoustic signals from the sample surface of different conditions. Thermal properties such as thermal diffusion length or thermal diffusivity of the Si wafer with and without defects on the surface were obtained by interpreting the frequency dependence of the PA signals. As a result, the photoacoustic signal is found to have the dependency on the shape and depth of the defects so that their structure of the defects can be analyzed. This method demonstrates the possibility of the application to the detection of the defects, cracks, and shortage of circuits on surface or sub-surface of the semiconductors and ceramic materials as a nondestructive testing(NDT) and a nondestructive evaluation(NDE) technique.

• Korean Journal of Cognitive Science
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• v.9 no.1
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• pp.31-39
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• 1998

This paper describes an electronic performance support system called HELPS(Handler Electronic Learning Performence Support) for semiconductor testing e equipment. The purpose of this system is to improve productivity of operators by providing just-in-time, on-the-job, mutimedia-based system information for operational support, training, and knowledge-based trouble shooting and repair. HELPS is composed of a operation module and a trouble shooting module. The operation module uses multimedia and hypermedia to provide the detailed and easily accessible information about equipment to users. Multimedia incorporate multiple. media forms including still and video images. animations 'texts' graphics. and audio. Hypermedia a are provided through a hierarchical information structure which offers not only specific information which is needed to perform a task to experienced operators. but detailed system guidance and information to novice operators. The trouble shooting module is composed of an integrated mutimedia-supported expert system which assists operators in trouble shooting and equipment repair. After diagnosis through the use of the expert system. multimedia advice is presented to the user in either still images with text or motion sequences with sound HELPS is evaluated in term of training time and trouble shooting and repair time. It improved productivity by saving more than 30% of the total time used without the system. This s system has the potential to improve productivity when it is used with ICAIOntellignet Computer Aided Instruction) and virtual reality.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.25 no.1
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• pp.27-35
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• 2015

Objectives: To investigate safety and health management, conditions in factories or facilities handling radiation-generating devices and radioactive isotopes were reviewed in terms of regulations of radiation safety control in Korea. Radiation exposure levels generated at those facilities were directly measured and evaluated for establishing an effective safety and health management plan. Methods: Government organizations with laws and systems of radiation safety and health were investigated and compared. There are three laws governing radiation-related employment such as occupational safety and health acts, nuclear safety acts, and medical service acts. We inspected 12 workplaces as research objects:four workplaces that manufacture and assemble semiconductor devices, three non-destructive inspection workplaces that perform inspections on radiation penetration, and five workplaces in textile and tire manufacturing. Monitoring of radiation exposure was performed through two methods. Spatial and surface monitoring using real-time radiation instruments was performed on each site handling radiation generating devices and radioactive isotopes in order to identify radiation leakage. Results: According to the occupational safety and health act, there is no legal obligation to measure ionizing radiation and set dose limits. This can cause confusion in the application of the laws, because the scopes and contents are different from each other. Surface dose rates in radiation generating devices such as implanters, thickness gages and accelerators, which were registered according to nuclear safety acts, using surveymeters, and seven of 36 facilities(19.4%) exceeded the international standards for surface radiation dose of $10{\mu}Sv/hr$. Conclusions: The results showed that occupational health and safety acts require a separate provision for measuring and assessing the radiation exposure of workers performing radiation work. Like noise, ionizing radiation will also periodically be controlled by including it in the object factors of work-environment measurement.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.178-178
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• 2010

With the scaling down of ULSI(Ultra Large Scale Integration) circuit of CMOS(Complementary Metal Oxide Semiconductor)based electronic devices, the electronic devices become more faster and smaller size that are promising field of semiconductor market. However, very narrow line width has some disadvantages. For example, because of narrow line width, deposition of conformal and thin barrier is difficult. Besides, proportion of barrier width is large, thus resistance is high. Conventional PVD(Physical Vapor Deposition) thin films are not able to gain a good quality and conformal layer. Hence, in order to get over these side effects, deposition of thin layer used of ALD(Atomic Layer Deposition) is important factor. Furthermore, it is essential that copper atomic diffusion into dielectric layer such as silicon oxide and hafnium oxide. If copper line is not surrounded by diffusion barrier, it cause the leakage current and devices degradation. There are some possible methods for improving the these secondary effects. In this study, TaNx, is used of Tertiarybutylimido tris (ethylamethlamino) tantalum (TBITEMAT), was deposited on the 24nm sized trench silicon oxide/silicon bi-layer substrate with good step coverage and high quality film using plasma enhanced atomic layer deposition (PEALD). And then copper was deposited on TaNx barrier using same deposition method. The thickness of TaNx was 4~5 nm. TaNx film was deposited the condition of under $300^{\circ}C$ and copper deposition temperature was under $120^{\circ}C$, and feeding time of TaNx and copper were 5 seconds and 5 seconds, relatively. Purge time of TaNx and copper films were 10 seconds and 6 seconds, relatively. XRD, TEM, AFM, I-V measurement(for testing leakage current and stability) were used to analyze this work. With this work, thin barrier layer(4~5nm) with deposited PEALD has good step coverage and good thermal stability. So the barrier properties of PEALD TaNx film are desirable for copper interconnection.

• Journal of the Korean institute of surface engineering
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• v.48 no.6
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• pp.253-259
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• 2015

The test equipment becomes more important with the development of semiconductor industry. MEMS probe is an important testing component to detect the defects from the generated electric signal when it contacts the metal pad of semiconductor devices. Ni-Pd alloy has been paid attention to as a candidate of MEMS probe material because of its high surface hardness and relatively low resistivity. In this study, electroplated Ni-Pd alloy has been prepared by using ethylene diamine as a complexing agent. Solid solution alloy coating could be formed when concentration of palladium chloride and current density were in the ranges of 1~5 mM and $0.2{\sim}1.5A/dm^2$, respectively. The increase of current density brought about an decrease in palladium content, which made both of lattice parameter and grain size smaller. As a result of grain refinement, high hardness could be obtained. However, surface cracking was observed due to residual stress when the current density was above $1.3A/dm^2$. When effects of heat treatment temperature on hardness and sheet resistance were investigated, the accompanied grain growth decreased both of them. The decrease of hardness remained stable at a temperature of $200^{\circ}C$. The sheet resistance was drastically reduced at $100^{\circ}C$. After that, it was found to become constant.

• Journal of the Semiconductor & Display Technology
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• v.10 no.1
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• pp.43-49
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• 2011

In this study, the dynamic characteristics of an air spring connected with an external chamber through a flexible tube are examined. The uncoupled dynamic parameters of the air spring are identified through experiments, followed by the suggestion of a model-based approach to obtain the remaining coupled dynamic parameters using the various frequency response functions derived in PART I paper [1]. To improve or control the damping characteristics of the air spring, this vibration isolation air spring system is physically established in laboratory scale. And we attempt to identify various parameters used to describe to air spring system by both theoretically [1] and experimentally, which is performed in this report. The damping parameter of the tube system is identified through experiments on the system incorporated with the air cylinder, and a nonlinear regression procedure is employed to find solutions. The resulting value is used to expect the frequency response function of dynamic pressure in the top chamber (air spring) with respect to that in the bottom chamber (external chamber). Comparison with the experimental data supports the validity of the present estimation procedures. Also, the dynamic mechanism of the damping effects particularly in a low frequency range is investigated through this experimental endeavor.

• Journal of the Semiconductor & Display Technology
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• v.10 no.2
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• pp.115-119
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• 2011

A tip-type carbon nanotube(CNT)-based field emitter was studied to consider it as electron source for micro-focused x-ray tube. The CNT was grown directly on a metal (tungsten) substrate by using an inductively coupled plasma-chemical vapor deposition (ICP-CVD) method. Prior to CNT growth, the metal substrate was etched to have various tip angles from $10^{\circ}$ to $180^{\circ}C$ (flat-type). The morphologies and microstructures of all the grown CNTs were analyzed via field-emission SEM. Furthermore, the effects of substrate tip-angles on the emission properties of CNT-based field emitters were characterized to estimate the maximum current density, the turn-on voltage, and the spatial distribution of electron beams. Prolonged long-term stability testing of the CNT emitters was also performed. All the experiment results obtained from this study indicated why a tip-type CNT emitter, compared with a flat-type CNT emitter, would be more desirable for a micro-focused x-ray system, in terms of the emission current level, the focused beam area, and the emission stability.

• The Transactions of the Korea Information Processing Society
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• v.7 no.10
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• pp.3226-3235
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• 2000

The more complex and larger semiconductor integraed circuits become, the core important delay test becomes which guarantees that semiconductor integrated circuits operate in time. In this paper, we propose a new partial enhanced scan method that can generate test patterns for path delay faults offectively. We implemented a new partial enhanced scan method based on an automatic test pattern generator(ATPG) which uses implication and justification . First. we generate test patterns in the standard scan environment. And if test patterns are not generated regularly in the scan chain, we determine flip-flops which applied enhanced scan flip-flops using the information derived for running an automatic test pattern generator inthe circuti. Determming enhanced scan flip-flops are based on a fault coverage or a hardware overhead. through the expenment for JSCAS 89 benchmark sequential circuits, we compared the fault coverage in the standard scan enviroment and enhance scan environment, partial enhanced scan environment. And we proved the effectiveness of the new partial enhanced scan method by identifying a high fault coverage.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.4
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• pp.1509-1514
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• 2011

The core of IT products, electronic components, especially the MLCC, chip inductors, chip Varistors and so on. In order to test the electrical characteristics of the chip using the Reno-pin contact test method has been used. In current chips, mass production of semiconductor manufacturing processes, high-speed production test for the chip speed up, precision is required. But Vibration displacement is a very short, so in order to overcome these shortcomings, the displacement amplification to design the structure has been actively studied. In this paper, a building structure with a flexible hinge was designed amplification instrument, semiconductor chip industry in the performance test and inspection equipment to measure the electrical characteristics of high speed linear actuators Reno-Pin using system was developed.