• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.171-174
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• 1997

The great development of semiconductor industry demands the high efficiency and performance of related device, but the pick and place system of semiconductor packaging device can load a few units until nowdays. Although the system can load a lot of units, it can work multiple sort operation. The defect like that causes a low efficiency. Therefore, this paper represents the development of pick and place system which can work multiple sort operation.

• Journal of the Semiconductor & Display Technology
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• v.13 no.3
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• pp.1-6
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• 2014

Visual defect inspection for electronics parts manufacturing processes is comprised of 2 steps - automatic visual inspection by machine and inspection by human inspectors. It is necessary that spatial points which were detected by the machine should be adequately clustered for subsequent human inspection. This research deals with the spatial clustering algorithm for the purpose of process productivity improvement. Distribution based clustering is newly developed and experimentally confirmed to show better clustering efficiency than existing algorithm - area based clustering.

• Journal of the Semiconductor & Display Technology
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• v.1 no.1
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• pp.29-33
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• 2002

In the flip-chip process, the problem like electric defect or fatigue crack caused by the difference of CTE, between chip and substrate board had occurred. Underfill of flip chip to overcome this defects is noticed as important work developing in whole reliability of chip by protecting the chip against the external shock. In this paper, we introduce the underfill methods using mold and plunge and improvement of process and reliability, and the advantage which can be taken from embodiment of device.

• Journal of the Semiconductor & Display Technology
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• v.3 no.3
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• pp.19-21
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• 2004

This paper presents a 3-dimensional diffusion simulation with adaptive solution strategy. The developed diffusion simulator VLSIDIF-3 was designed to re-refine areas. Refine scheme was calculated by the difference of doping concentration between any of two nodes. Each element is greater than tolerance and redo diffusion process until error is tolerable. Numerical experiment in low doping diffusion problem showed that this adaptive solution strategy is very efficient in both memory and time, and expected this scheme would be more powerful in complex diffusion model.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.179-180
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• 2007

반도체의 최소 회로 선폭이 감소함에 따라 Contact 저항이 크게 증가하게 된다. Contact 저항을 낮추기 위하여 Tungsten Metal Contact을 일반적으로 사용하며, Si 기판과의 Ohmic 접촉 및 WF6의 Fluorine과 Si 반응을 억제하기 위한 Barrier Metal로 Ti/TiN 이중막을 사용한다. 본 논문에서는 90nm급 이하 제품의 CVD Ti/TiN Barrier Metal이 유발하는 불량 현상과 원인 규명에 대하여 연구하였으며, Ohmic Contact형성을 위해 TiSix형성 최적화 방안에 대해 정리하였다.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.12 no.2
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• pp.65-70
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• 2003

In this study, researchers developed the estimative algorithm for artificial defect in semiconductor packages and performed it by pattern recognition technology. For this purpose, the estimative algorithm was included that researchers made software with MATLAB. The software consists of some procedures including ultrasonic image acquisition, equalization filtering, Self-Organizing Map and Backpropagation Neural Network. Self-organizing Map and Backpropagation Neural Network are belong to methods of Neural Networks. And the pattern recognition technology has applied to classify three kinds of detective patterns in semiconductor packages : Crack, Delamination and Normal. According to the results, we were confirmed that estimative algerian was provided the recognition rates of 75.7% (for Crack) and 83.4% (for Delamination) and 87.2 % (for Normal).

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1991.11a
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• pp.87-94
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• 1991

This Paper is to aim the microdefect evaluation of semiconductor Package into a quantitative from NDI's image processing of ultrasonic wave. Accordingly, for the detection of delamination between the Joining condition of boundary microdefect of semiconductor packaga the result from sampling original image, histogramming, binary image or image processing of multinumerloal value is such as the follows. ([) The least limitation from the microdefect detection of the semiconductor package by surveying high ultrasonic wave seems to be about 0.8 $\mu\textrm{m}$ in degree. (2) A result of applying the image processing of multinumerical value to the semiconductor package it was possible to devide the Category into the effectiveness.

• Journal of Mechanical Science and Technology
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• v.19 no.3
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• pp.820-825
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• 2005

This paper proposes non-destructive ESPI technique to evaluate inside defects of semiconductor package quantitatively. Inspection system consists of ESPI system, thermal loading system and adiabatic chamber. The technique has high feasibility in non-destructive testing of semiconductor and gives solutions to the drawbacks in previous technique, time-consuming and the difficulty of quantitative evaluation. In result, most of defects are classified in delamination, from which it is inferred to the insufficiency of adhesive strength between layers and nonhomogeneous heat spread. The $90\%$ of tested samples have a delamination defect started at the around of the chip which may be related to heat spread design.

• Journal of the Korea Safety Management & Science
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• v.8 no.1
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• pp.17-26
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• 2006

Basis frame-work's base in a semiconductor industry have gas, chemical, electricity and various facilities in bring to it. That it is a foundation by fire, power failure, blast, spill of toxicant huge by large size accident human and physical loss and damage because it can bring this efficient, connect with each kind mechanical, physical thing to prevent usefully need that control finding achievement factor of human factor of human action. Large size accident in a semiconductor industry to machine and human and it is involved that present, in system by safety interlock defect of machine is conclusion for error of behaviour. What is not construing in this study, do safety in a semiconductor industry to do improvement. Control human error analyzes in human control with and considers mechanical element and several elements. Also, apply achievement factor using O'conner Model by control method of human error. In analyze by failure mode effect using actuality example.

• Journal of the Semiconductor & Display Technology
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• v.19 no.3
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• pp.112-117
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• 2020

NAND flash memory is a non-volatile memory that retains stored data even without power supply. Internal memory used as a data storage device and solid-state drive (SSD) is used in portable devices such as smartphones and digital cameras. However, NAND flash memory carries the risk of electric shock, which can cause errors during read/write operations, so use error correction codes to ensure reliability. It efficiently recovers bad block information, which is a defect in NAND flash memory. BBT (Bad Block Table) is configured to manage data to increase stability, and as a result of experimenting with the error correction code algorithm, the bit error rate per page unit of 4Mbytes memory was on average 0ppm, and 100ppm without error correction code. Through the error correction code algorithm, data stability and reliability can be improved.