A Study on the Defect Detection of Silicon-Chip Surrounding by Ultrasonic Wave - Automatic Determination Method of Threshold Value by Image Processing -

초음파를 이용할 실리콘 칩 주위의 결함 검출에 관한 연구 - 화상처리에 의한 threshold value의 자동 결정법 -

This Paper is to aim the microdefect evaluation of semiconductor Package into a quantitative from NDI's image processing of ultrasonic wave. Accordingly, for the detection of delamination between the Joining condition of boundary microdefect of semiconductor packaga the result from sampling original image, histogramming, binary image or image processing of multinumerloal value is such as the follows. ([) The least limitation from the microdefect detection of the semiconductor package by surveying high ultrasonic wave seems to be about 0.8 $\mu\textrm{m}$ in degree. (2) A result of applying the image processing of multinumerical value to the semiconductor package it was possible to devide the Category into the effectiveness.