• 한국재료학회:학술대회논문집
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• 한국재료학회 2009년도 춘계학술발표대회
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• pp.22.2-22.2
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• 2009

Currently, metal silicides become increasingly more essential part as a contact material in complimentary metal-oxide-semiconductor (CMOS). Among various silicides, NiSi has several advantages such as low resistivity against narrow line width and low Si consumption. Generally, metal silicides are formed through physical vapor deposition (PVD) of metal film, followed by annealing. Nanoscale devices require formation of contact in the inside of deep contact holes, especially for memory device. However, PVD may suffer from poor conformality in deep contact holes. Therefore, Atomic layer deposition (ALD) can be a promising method since it can produce thin films with excellent conformality and atomic scale thickness controllability through the self-saturated surface reaction. In this study, Ni thin films were deposited by thermal ALD using bis(dimethylamino-2-methyl-2-butoxo)nickel [Ni(dmamb)2] as a precursor and NH3 gas as a reactant. The Ni ALD produced pure metallic Ni films with low resistivity of 25 $\mu{\Omega}cm$. In addition, it showed the excellent conformality in nanoscale contact holes as well as on Si nanowires. Meanwhile, the Ni ALD was applied to area-selective ALD using octadecyltrichlorosilane (OTS) self-assembled monolayer as a blocking layer. Due to the differences of the nucleation on OTS modified surfaces toward ALD reaction, ALD Ni films were selectively deposited on un-coated OTS region, producing 3 ${\mu}m$-width Ni line patterns without expensive patterning process.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.433-433
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• 2012

As the requirement in patterning geometry continuously shrinks down, the termination of etch process at the exact time became crucial for the success in nano patterning technology. By virtue of real-time optical emission spectroscopy (OES), etch end point detection (EPD) technique continuously develops; however, it also faced with difficulty in low open ratio etching, typically in self aligned contact (SAC) and one cylinder contact (OCS), because of very small amount of optical emission from by-product gas species in the bulk plasma glow discharge. In developing etching process, one may observe that coupon test is being performed. It consumes costs and time for preparing the patterned sample wafers every test in priority, so the coupon wafer test instead of the whole patterned wafer is beneficial for testing and developing etch process condition. We also can observe that etch open area is varied with the number of coupons on a dummy wafer. However, this can be a misleading in OES study. If the coupon wafer test are monitored using OES, we can conjecture the endpoint by experienced method, but considering by data, the materials for residual area by being etched open area are needed to consider. In this research, we compare and analysis the OES data for coupon wafer test results for monitoring about the conditions that the areas except the patterns on the coupon wafers for real-time process monitoring. In this research, we compared two cases, first one is etching the coupon wafers attached on the carrier wafer that is covered by the photoresist, and other case is etching the coupon wafers on the chuck. For comparing the emission intensity, we chose the four chemical species (SiF2, N2, CO, CN), and for comparing the etched profile, measured by scanning electron microscope (SEM). In addition, we adopted the Dynamic Time Warping (DTW) algorithm for analyzing the chose OES data patterns, and analysis the covariance and coefficient for statistical method. After the result, coupon wafers are over-etched for without carrier wafer groups, while with carrier wafer groups are under-etched. And the CN emission intensity has significant difference compare with OES raw data. Based on these results, it necessary to reasonable analysis of the OES data to adopt the pre-data processing and algorithms, and the result will influence the reliability for relation of coupon wafer test and whole wafer test.

• 한국진공학회지
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• 제19권2호
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• pp.81-90
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• 2010

층과 층 사이의 정전기적인력, 수소결합 또는 공유결합을 이용하여 층당 두께를 수 옹스트롱에서부터 수십 나노미터까지 제조할 수 있으며 박막의 표면 형태를 흡착시키고자 하는 물질 및 박막 후처리 공정을 통해 제어할 수 있으며 더 나아가, 삽입하는 물질의 특성에 따라 박막의 기능성을 집적화 및 다양화시킬 수 있다. 본 연구에서는 이러한 층상자기조립방법의 특성을 이용하여 반사방지막, 초소수성 필름 및 전기화학센서로의 응용가능성을 제시하였다. 반사방지막의 경우, 구형의 블록공중합체를 유리기판 위에 다층박막으로 적층시킴으로써 박막 굴절률을 1.25까지 감소시켰고 이를 통해 약 99.5%의 빛 투과도를 달성할 수 있었다. 더 나아가 바이오물질인 엔자임을 다층박막에 삽입시킬 경우, 활성 산소를 분해시키는 전기화학센서로의 제조가 가능함을 보인다. 본 연구는 본인이 이미 발표한 논문(J. Am. Chem. Soc. 128, 9935 (2006); Adv. Mater. 19, 4364 (2007); Electro. Mater. Lett. 3, 163 (2007))들을 정리하여 층상자기조립법에 관해 소개하는 논문이다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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• pp.77-77
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• 2000

Titanium oxide (TiO2) thin films have valuable properties such as a high refractive index, excellent transmittance in the visible and near-IR frequency, and high chemical stability. Therefore it is extensively used in anti-reflection coating, sensor, and photocatalysis as electrical and optical applications. Specially, TiO2 have a high dielectric constant of 180 along the c axis and 90 along the a axis, so it is highlighted in fabricating dielectric capacitors in micro electronic devices. A variety of methods have been used to produce patterned self-assembled monolayers (SAMs), including microcontact printing ($\mu$CP), UV-photolithotgraphy, e-beam lithography, scanned-probe based micro-machining, and atom-lithography. Above all, thin film fabrication on $\mu$CP modified surface is a potentially low-cost, high-throughput method, because it does not require expensive photolithographic equipment, and it produce micrometer scale patterns in thin film materials. The patterned SAMs were used as thin resists, to transfer patterns onto thin films either by chemical etching or by selective deposition. In this study, we deposited TiO2 thin films on Si (1000 substrateds using titanium (IV) isopropoxide ([Ti(O(C3H7)4)] ; TIP as a single molecular precursor at deposition temperature in the range of 300-$700^{\circ}C$ without any carrier and bubbler gas. Crack-free, highly oriented TiO2 polycrystalline thin films with anatase phase and stoichimetric ratio of Ti and O were successfully deposited on Si(100) at temperature as low as 50$0^{\circ}C$. XRD and TED data showed that below 50$0^{\circ}C$, the TiO2 thin films were dominantly grown on Si(100) surfaces in the [211] direction, whereas with increasing the deposition temperature to $700^{\circ}C$, the main films growth direction was changed to be [200]. Two distinct growth behaviors were observed from the Arhenius plots. In addition to deposition of THe TiO2 thin films on Si(100) substrates, patterning of TiO2 thin films was also performed at grown temperature in the range of 300-50$0^{\circ}C$ by MOCVD onto the Si(100) substrates of which surface was modified by organic thin film template. The organic thin film of SAm is obtained by the $\mu$CP method. Alpha-step profile and optical microscope images showed that the boundaries between SAMs areas and selectively deposited TiO2 thin film areas are very definite and sharp. Capacitance - Voltage measurements made on TiO2 films gave a dielectric constant of 29, suggesting a possibility of electronic material applications.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2012년도 춘계학술발표대회
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• pp.52-52
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• 2012

최근 선진국을 중심으로 제조기술의 산업혁명이라고 불릴 정도로 큰 파급효과가 기대되는 자기조립기반의 산업공정기술을 확보하기 위한 많은 노력과 연구들이 활발하게 진행되고 있다. 자기조립(Self-Assembly) 현상은 자연에서 일어나는 자발적인 힘으로 원자 또는 분자 단위까지 구조물을 제어하고 bottom-up 방식(상향식: 원자/분자 스케일의 나노구조를 배열/조립하여 원하는 형태의 패턴을 만들어 내는 방식)으로 원하는 구조물을 설계/제작할 수 있는 능력을 가지고 있다. 기초적인 과학으로부터 출발한 자기조립기술은 최근 자기조립 응용개발에서 많은 성과를 이루어내면서 산업화 가능성을 크게 하고, 과학계와 산업계의 많은 관심을 불러일으키고 있다. 반도체 산업기술을 예측하는 ITRS 로드맵(2005년)에 의하면 directed self-assembly 방법이 새로운 미래 패터닝 기술로 개발되어 2016년경에 사용되고, 자기조립소재로 제작된 다양한 응용소자들은 새로운 미래소자로 개발될 것으로 예상하고 있다. 이에 맞추어 국내 기업들도 diblock copolymer를 이용한 나노패터닝 기술 확보를 위한 연구를 진행하고 있다. 또한 IBM은 자기조립기술을 반도체공정에 실험적으로 적용하여 자기조립기술이 생산 공정에 부분적으로 적용될 가능성이 크다는 것을 보여주었다. 산업계와 함께 학계의 연구센터에서는 산업화를 위한 자기조립 집적화 공정(Integrated process) 개발을 이루기 위하여 체계적으로 연구를 실시하고 있다. 미국의 Northeastern 대학의 CHN(Center for high-rate Nanomanufacturing) 연구센터는 자기조립 집적화에 용이한 새로운 개념의 소자를 제안하고 이를 집적화하기 위한 다양한 공정을 개발하고 있으며, Wisconsin 대학의 NSEC(Nanosacle Science and Engineering Center) 연구센터는 diblock copolymer를 이용한 나노패터닝 기술 개발에서 획기적인 결과를 도출하여 산업계에 적용될 가능성을 높이고 있다. 이와 같은 결과들로부터 앞으로의 자기조립기술에 대한 연구는 3차원 구조물을 제작할 수 있는 집적화 공정에 집중될 것이고, 이를 위하여 새로운 개념의 단순한 구조의 응용소자개발도 함께 추진될 것으로 판단된다. 또한 실용 가능성이 큰 집적화 공정으로 개발하기 위하여 기존의 top-down 방식을 접목한 bottom-up 방식의 자기조립 집적화 공정이 개발될 것으로 예상하고 있다. 이와 함께 자기조립공정은 반복되는 구조를 쉽게 제작할 수 있는 장점을 가지고 있어 다양한 응용소자 [태양전지(solar cell), 연료전지(fuel cell), 유연성 있는 전자기기(flexible electronics), 화면표시 장치(display device)] 제작에 쉽게 이용되어 새로운 산업을 창출할 수 있는 가능성을 보이고 있다. 본 자기조립 연구 센터에서는 이와 같은 자기조립 특성을 제조공정에 적용하여 혁신적인 제조공정기술을 확보하고자 연구를 진행하고 있다. 그러므로 본 발표에서 이와 같은 연구 흐름과 함께 본 센터에서 진행하고 있는 자기조립 제조방법을 소개하고자 한다. 이와 함께 자기조립방법을 이용하여 제작된 다양한 응용소자 개발 결과를 발표하고, 이를 top-down 방식과 접목하여 집적화공정으로 개발하는 전략을 함께 소개하고자 한다.

• 한국생물공학회:학술대회논문집
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• 한국생물공학회 2003년도 생물공학의 동향(XII)
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• pp.74-78
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• 2003

본 논문에서는 금속의 표면 플라즈몬 공명으로 인한 금속-유전체 경계면에서의 국소적 전자기장의 강화 효과를 이용하여 표면 플라즈몬을 유발하는 금 박막을 유리 기판위에 증착하고, 프리즘 커플러를 이용한 소산장의 공명 흡수현상을 이차원 영상 으로 얻었다. 특히 DNA/단백질 칩 등 향후 가능한 다채널 시스템에의 응용을 고려하여11-MUA, 11-MUOH 등 자기조립 단분자막(SAM)을 크롬 마스크와 리토그래피, 그리고 Shadow mask와 광 산화반응을 이용하여 금 표면 위에 패터닝 하였다. 텅스텐-할로겐 램프와 중심파장이 ${\lambda}_0=633$ nm의 대역통과 필터를 사용하여 이 평행광을 프리즘 커플러에 입사시켜 반사되어 나오는 반사광의 이차원 영상을 얻었다. 이와는 별도로 ${\lambda}_0=633$ nm의 레이저를 이용하여 단분자막이 코팅되어 있을 때와 없을 때의 공명각의 변화를 관찰하였다. 얻어진 이차원 영상의 위치에 따른 화소 값의 변화를 단분자 막의 두께의 변화에 따라 보정하고, 알려진 매질의 SPR 특성을 Fresnel 방정식에 따라 이론적으로 계산하면 다채널 표면 영상으로부터 항원-항체 등 단백질의 결합 정도를 정량적으로 측정할 수 있다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.669-669
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• 2013

Hierarchical N doped TiO2 nanostructured catalyst with micro, meso and macro porosity have been synthesized by a facile self-formation route using ammonia and titanium isopropoxide precursor. The samples were calcined in different calcination temperature ranging from $300^{\circ}C$ to $800^{\circ}C$ at slow heating rate ($5^{\circ}C$/min) and designated as NHPT-300 to NHPT-800. $TiO_2$ nanostructured catalyst have been characterized by physico-chemical and spectroscopy methods to explore the structural, electronic and optical properties. UV-Vis diffuse reflectance spectra confirmed the red shift and band gap narrowing due to the doping of N species in TiO2 nanoporous catalyst. Hierarchical macro porosity with fibrous channel patterning was observed (confirmed from FESEM) and well preserved even after calcination at $800^{\circ}C$, indicating the thermal stability. BET results showed that micro and mesoporosity was lost after $500^{\circ}C$ calcination. The photocatalytic activity has been evaluated for methanol oxidation to formaldehyde in visible light. The enhanced photocatalytic activity is attributed to combined synergetic effect of N doping for visible light absorption, micro and mesoporosity for increase of effective surface area and light harvestation, and hierarchical macroporous fibrous structure for multiple reflection and effective charge transfer.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 디스플레이 광소자분야
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• pp.86-89
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• 2004

Organic thin film transistors (OTFTs) are fabricated on the plastic substrate through 4-level mask process without photolithographic patterning to yield the simple fabrication process. And we herewith report for the effect of dielectric surface modification on the electrical characteristics of OTFTs. The KIST-JM-1 as an organic molecule for the surface modification is deposited onto the surface of zirconium oxide $(ZrO_2)$ gate dielectric layer. In this work, we have examined the dependence of electrical performance on the interface surface state of gate dielectric/pentacene, which may be modified by chemical properties in the gate dielectric surface.

• 대한치과기공학회지
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• 제27권1호
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• pp.115-129
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• 2005

The purpose of this study was to identify injury characteristics happened in the college dental laboratory technique classes and to provide the empirical accident findings for safety education development for the college dental technology classes. The research data were collected from a self-administered survey distributed to the conveniently selected college students. The study participants were 476 freshmen, sophomore and junior students whose major was the dental laboratory technology of the 4 colleges in 2 metropolitan cities and 2 medium-size cities. All collected survey responses were encoded and analyzed in SPSS 12.0. The findings were as follows. The accidents happened to the college students during the dental laboratory technology classes: 1. The accident rate was the highest in the sophomore and the freshmen, junior in order. 2. The body parts frequently injured were hands, face, eyes, arms, and legs in order. 3. The frequent injury types were cut, burnt, stuck, wound, and suffocated in order. 4. The treatment methods for their accidents were the simple first-aids, no treatment, and the emergency room visits in order. 5. The laboratory training conditions inducing the accidents were significantly frequent under wire-related, and wax-related, iron-related, alcohol-related jobs in order, but not frequent in investing material-related, porcelain-related, resin-related, and agar-related jobs. Polishing was the most accident-prone job explaining 63% of the laboratory accidents and then, model producing, wax patterning, casting, burning, and investing jobs in order. In summary, the college dental laboratory accidents had the certain patterns by the training level and by the material or machine involved in each class. Thus, the planned and organized safety education programs should be produced and investigated for college students before their major laboratory classes.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.68-69
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• 2005

BTO ($BaTiO_3$) thin film is one of the high dielectric materials for high-density dynamic random access memories (DRAMs) due to its relatively high dielectric constant. It is generally known that BTO film is difficult to be etched by plasma etching, but high etch rate with good selectivity to pattern mask was required. The problem of sidewall angle also still remained to be solved in plasma etching of BTO thin film. In this study, we first examined the patterning possibility of BTO film by chemical mechanical polishing (CMP) process instead of plasma etching. The sputtered BTO film on TEOS film as a stopper layer was polished by CMP process with the self-developed $BaTiO_3$- and $TiO_2$-mixed abrasives slurries (MAS), respectively. The removal rate of BTO thin film using the$ BaTiO_3$-mixed abrasive slurry ($BaTiO_3$-MAS) was higher than that using the $TiO_2$-mixed abrasive slurry ($TiO_2$-MAS) in the same concentrations. The maximum removal rate of BTO thin film was 848 nm/min with an addition of $BaTiO_3$ abrasive at the concentration of 3 wt%. The sufficient within-wafer non-uniformity (WIWNU%)below 5% was obtained in each abrasive at all concentrations. The surface morphology of polished BTO thin film was investigated by atomic force microscopy (AFM).