• The Journal of Korean Institute of Communications and Information Sciences
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• v.42 no.4
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• pp.716-722
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• 2017

In this paper, a fully printed NFC tag operating at 13.56 MHz was designed and fabricated using silver nano-paste and carbon ink. The proposed NFC tag has a printed coil with an inductance of $2.74{\mu}H$ on a PI film for application to an NFC tag IC with an internal capacitance of 50 pF. Screen printing technology used in this paper has advantages such as large area printing for mass production, low cost and eco-friendly process compared to conventional PCB manufacturing process. The proposed structure consists of a circular coil implemented as a single layer using silver nano-paste and carbon ink, a jumper pattern for chip mounting between the outer edge and the center of the coil, and an insulation pattern between the coil and the jumper pattern. In order to verify the performance of the proposed NFC tag, we performed the measurements of the printing line width, thickness, line resistance, adhesion and environmental reliability, and confirmed the suitability of the NFC tag based on the full-printed manufacturing method.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.55-59
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• 2015

Novel low-volume solder-on-pad (SoP) process is proposed for a fine pitch Cu pillar bump interconnection. A novel solder bumping material (SBM) has been developed for the $60{\mu}m$ pitch SoP using screen printing process. SBM, which is composed of ternary Sn-3.0Ag-0.5Cu (SAC305) solder powder and a polymer resin, is a paste material to perform a fine-pitch SoP in place of the electroplating process. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder; the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. The Si chip and substrate with daisy-chain pattern are fabricated to develop the fine pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si substrate has 6724 under bump metallization (UBM) with a $45{\mu}m$ diameter and $60{\mu}m$ pitch. The Si chip with Cu pillar bump is flip chip bonded with the SoP formed substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of underfill. The optimized interconnection process has been validated by the electrical characterization of the daisy-chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and micro bump interconnection using a screen printing process.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.11 s.188
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• pp.17-23
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• 2006

• Journal of the Korea Institute of Information and Communication Engineering
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• v.17 no.2
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• pp.263-272
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• 2013

Printed electronics creates electrically functional devices by printing on variety of substrates. Printing typically uses common printing equipment or other low-cost equipment suitable for defining patterns on material, such as screen printing, flexography, gravure, offset lithography and inkjet. Compared to conventional manufacturing of microelectronics, printed electronics is characterized by simpler and more cost-effective fabrication of high and low volume products. Now there is huge effort towards printing many other more functional components, from displays to transistors to photovoltaic cells, using the full range of printing technologies - from inkjet to roll to roll analogue print techniques. The market for printed electronics will rise from $1.99 billion in 2010 to $55.10 billion in 2020. In 2030, this industry could be $300 billion - larger than the silicon semiconductor industry - from lighting to displays[8].

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.73-78
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• 2016

An increase in the transistor density of integrated circuit devices leads to a very high increase in heat dissipation density, which causes a long-term reliability and various thermal problems in microelectronics. In this study, liquid cooling method was investigated using straight microchannels with various metal bumps. Microchannels were fabricated on Si wafer using deep reactive ion etching (DRIE), and Ag, Cu, or Cr/Au/Cu metal bumps were placed on Si wafer by a screen printing method. The surface temperature of liquid cooling structures with various metal bumps was measured by infrared (IR) microscopy. For liquid cooling with Cr/Au/Cu bumps, the surface temperature difference before and after liquid cooling was $45.2^{\circ}C$ and the power density drop was $2.8W/cm^2$ at $200^{\circ}C$ heating temperature.

• Journal of the Korean Ceramic Society
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• v.38 no.10
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• pp.948-952
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• 2001

PZT thick films were fabricated on alumina substrates by a screen printing method. They were sintered at $750^{\circ}C{\sim}1050^{\circ}C$ for 1 h under air or Pb atmosphere. Pyrochlore was observed as a second phase in PZT thick films sintered in air at temperatures of $950^{\circ}C$ and higher. PZT thick films sintered under Pb atmosphere showed denser microstructure, higher dielectric constant, and better-developed P-E hysteresis curve than the films sintered in air. PZT thick films sintered at $900^{\circ}C$ under Pb atmosphere showed the typical ferroelectric hysteresis with remanent polarization of $29.8{\mu}C/cm^2$ and coercive field of 48.4 kV/cm.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 1998.09a
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• pp.79-83
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• 1998

Plasma display panel is a potential candidate for HDTV, due to the fact hat the expansion of screen size is much easier using thick film technology. In this study, transparent dielectric materials using lead borosilicate glasses is developed, which satisfy the requirements of dielectrics for PDP. Paste is made of this glass composition. The paste has thixotropic behavior suitable for screen printing. The paste shows more thixotropic behavior as the particle size decrease. After firing, cross sectional area was analyzed by SEM. The void of fired thick film was removed using bimodal particle system. The dielectric showed good adhesion characteristics.

• Clean Technology
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• v.7 no.3
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• pp.169-178
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• 2001

Textile printing prints around twenty bilion linear meters of textile each year. Rotary and flat bed screen printing requires pre and post treatments, leading to the loss of dyes and the environmental problems due to effluents. Digital ink jet printing can offer a solution to the existing problems, especially the environmental problems, in addition to its flexibility. Pigments are used as a dispersion inks in the digital inkjet textile printing. Molecular dynamic simulation like Stokesian dynamic simulation was employed to simulate the behavior of pigments and velocity distribution under the pressure driven flow in the printer nozzle. The simulation shows that the particle distribution in the flow are uniform if particle volume fraction is low, the ratio of nozzle and particle diameter is large, and the dimensionless average suspension velocity is low.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.28 no.12
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• pp.1007-1010
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• 2017

In this paper, a frequency selective surface(FSS) with bandstop operation for radio-frequency spectrum management is presented. The proposed FSS is composed of patterns of fractal-based miniaturized unit cells for stable performance for angles of incidence and polarizations. For practical applications requiring high productivity and environmental compatibility, we fabricated a film-type FSS by screen-printing using Ag ink, rather than a conventional manufacturing method using a printed circuit board. To validate this study, we measured the transmission characteristics of the proposed FSS using the free-space measurement method, and observed the received strength of signal penetrating the FSS film applied to a wall.

• Clean Technology
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• v.14 no.1
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• pp.21-28
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• 2008

The properties of the dispersion of the red, green, and blue pigments were investigated for the manufacture of the millbase of LCD color filters. Their physical properties and viscosity were controlled to apply to the screen printing in order to substitute the existing photolithography method. The best dispersion properties were obtained with dispersant BYK-2000 and monomer EB-140. The millbase was pre-mixed at 500 rpm for 30 min, and dispersed at 4000 rpm for 5 - 6 hour by Torus Mill. The resulting particle sizes were $100{\sim}110\;nm$ for red, $50{\sim}70\;nm$ for green, and $60{\sim}80\;nm$ for blue. When the millbase viscosity was 200-300 cps in the low viscosity formulation, an efficient impact of the beads on pigments was achieved. The dispersion properties were confirmed from the rheological behavior and color characteristics.