• Journal of Welding and Joining
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• v.28 no.3
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• pp.42-48
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• 2010

Polycarbonate (PC) and Acrylonitrile Butadiene Styrene (ABS) were welded by a combination of a diode laser and a CNC machining center. Laser beam delivered through the transparent PC and was absorbed in an opaque ABS. Polymers were melted and joined by absorbed and conducted heat. Experiments were carried out by varying working distance from 44mm to 50mm for the focus spot diameter control, laser input power from 10W to 25W, and scanning speed from 100 to 400mm/min. The weld bead and cross-section were analyzed for weld quality, and tensile results were presented through the joint force measurement. With focus distance at 48mm, laser power with 20W, and welding speed at 300mm/min, experimental results showed the best welding quality which bead size was measured to be 3.75mm. The shear strength at the given condition was $22.8N/mm^2$. Considering tensile strength of ABS is $43N/mm^2$, shear strength was sufficient to hold two materials. A single process was possible in a CNC machining system, surface processing, hole machining and welding. As a result, the process cycle time was reduced to 25%. Compared to a typical process, specimens were fabricated in a single process, with high precision.

• Journal of Powder Materials
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• v.28 no.3
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• pp.227-232
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• 2021

The purpose of this study is to optimize the powder formulation and manufacturing conditions for the solidification of an extract of the herb Bangpungtongseong-san (BPTS). To develop BPTS-loaded particles for the tablet dosage form, various BPTS-loaded particles composed of BPTS, dextrin, microcrystalline cellulose (MCC), silicon dioxide, ethanol, and water are prepared using spray-drying and high shear granulation (high-speed mixing). Their physical properties are evaluated using scanning electron microscopy and measurements of the angle of repose, Hausner ratio, Carr's index, hardness, and disintegration time. The optimal BPTS-loaded particles exhibit improved flowability and compressibility. In particular, the BPTS-loaded particles containing silicon dioxide show significantly improved flowability and compressibility (the angle of repose, Hausner ratio, and Carr's index are 35.27 ± 0.58°, 1.18 ± 0.06, and 15.67 ± 1.68%, respectively), hardness (18.97 ± 1.00 KP), and disintegration time (17.60 ± 1.50 min) compared to those without silicon dioxide. Therefore, this study suggests that particles prepared by high-speed mixing can be used to greatly improve the flowability and compressibility of BPTS using MCC and silicon dioxide.

• Journal of Welding and Joining
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• v.26 no.3
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• pp.30-36
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• 2008

A flip-chip bonding system using IR laser with a wavelength of 1064 nm was developed and associated process parameters were analyzed using Taguchi methods. An infrared laser beam is designed to transmit through a silicon chip and used for transferring laser energy directly to micro-bumps. This process has several advantages: minimized heat affect zone, fast bonding and good reliability in the microchip bonding interface. Approximately 50 % of the irradiated energy can be directly used for bonding the solder bumps with a few seconds of bonding time. A flip-chip with 120 solder bumps was used for this experiment and the composition of the solder bump was Sn3.0Ag0.5Cu. The main processing parameters for IR laser flip-chip bonding were laser power, scanning speed, a spot size and UBM thickness. Taguchi methods were applied for optimizing these four main processing parameters. The optimized bump shape and its shear force were modeled and the experimental results were compared with them. The analysis results indicate that the bump shape and its shear force are dominantly influenced by laser power and scanning speed over a laser spot size. In addition, various effects of processing parameters for IR laser flip-chip bonding are presented and discussed.

• Laser Solutions
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• v.7 no.2
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• pp.1-10
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• 2004

This work was attempted to join SCP sheet and STS304 sheet by using Nd:YAC laser beam. SCP sheet has good formability and low cost, while STS304 has excellent corrosion resistance and mechanical properties in high temp. In this experiment, butt joint type was used to develop the tailored blank welding for dissimilar steel. Sheets which have different thermal properties. Computer simulation was conducted to obtain the off-set position for efficient welding by considering laser power, scanning speed, focal length and basic properties. The result showed that the optimum thermal distribution was obtained when the laser beam was irradiated at $0.05{\sim}0.1$ mm off-set toward the SCP sheet side. The experiment was conducted based on the result of computer simulation to show the same optimum conditions. Optimum conditions were 3KW in laser beam power, 6m/min in scanning speed, -0.5mm in focal position, 0.1mm off-set toward SCP. Microhardness test, tensile test, bulge test, optical microscopy, EDS, and XRD were performed to observe the microstructure around fusion zone and to evaluate the mechanical properties of optimum conditions, The weld zone had high microhardness values by the formation of the martensitic structure. Tensile test measured the strength of welded region by vertical to strain direction and the elongation of welded region by parallel to strain direction. Bulge test showed $52\%$ formability of the original materials. Bead shape, grain size, and martensitic structure were observed by the optical microscopy in the weld zone. Detailed results of EDS, XRD confirmed that the welded region was connected of martensitic structure.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.12
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• pp.1062-1070
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• 2002

In this paper, variable radix-two multibit coding algorithm is presented and applied in the implementation of discrete cosine transform(DCT) and inverse discrete cosine transform(IDCT). Variable radix-two multibit coding means the 2k SD (signed digit) representation of overlapped multibit scanning with variable shift method. SD represented by 2k generates partial products, which can be easily implemented with shifters and adders. This algorithm is most powerful for the hardware implementation of DCT/IDCT with constant coefficient matrix multiplication. This paper introduces the suggested algorithm, it's proof and the implementation of DCT/IDCT The implemented IDCT chip with 8 PEs(Processing Elements) and one transpose memory runs at a tate of 400 Mpixels/sec at 54MHz frequency for high speed parallel signal processing, and it's verified in HDTV and MPEG decoder.

• Applied Microscopy
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• v.38 no.3
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• pp.159-165
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• 2008

Morphological and physicochemical changes of a woman's virgin hair treated with various dye depths were investigated by using scanning electron microscopy and thermal analyzer. With the hair treated with the dye of the high brightness level, the speed of weight decrease was slower than compared with thermal analysis weight of a normal hair sample. We confirmed that the moisture content and protein composition of hair were changed depending on level depth of coloring agent. Moreover oxidative residues and dye molecules penetrated into the hair cause chemical changes of hair structure. As a result, the heat reaction speed of hair treated with high level coloring agent was made slower than normal hair.

• The korean journal of orthodontics
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• v.22 no.1
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• pp.123-131
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• 1992

This study was done to evaluate the changes of enamel surface by interproximal stripping and recovery of it by polishing. The number of 34 1st premolars which had extracted for orthodontic treatment were selected as samples. Interproximal stripping was performed by hand with metal strip and strip placer (Dentaurum Co., Germany) and low speed handpiece with diamond disk (Superdiaflex, Germany). Polishing was performed by hand with plastic strip (3M Col) and low speed handpiece with whip-mix, DCPA (Dicalcium Phosphate, Anhydrous, $CaHPO_4$) powder and Sof-lex (3M Co. U.S.A.) polishing kit. Each groups were examined under the scanning electron microscope (JEOL Co., JSM-840A, Japan) and the following results were obtained: 1. The stripped group performed by metal strip and diamond disk altogether showed deep furrow on the enamel surface as wide as about $10{{\mu}m}$. 2. There could be seen more irregular scratched line in the group stripped by metal strip than that by diamond disk. 3. The polished group performed by plastic strip and DCPA powder showed slight smoothening of the edge of stripped furrow on the enamel surface without relation to the stripping method. 4. The polished group performed by Sof-lex progressive polishing kit could not avoid the formation of the furrows on the enamel surface according to the particle size without relation to the stripping method. 5. The polished group performed by the superfine polishing wheel, the final stage of Sof-lex polishing method showed shallow scratched line as wide as within about $2{{\mu}m}$ on the enamel surface without relation to the stripping method. 6. The interproximal stripped enamel surface could not recover its original surface texture by any kind of polishing methods.

• Laser Solutions
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• v.11 no.4
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• pp.29-34
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• 2008

Ultraviolet laser micromachining has increasingly been applied to the electronics industry where precision machining of high-density, multi-layer, and multi material components is in a strong demand. Due to the ever-decreasing size of electronic products such as cellular phones, MP3 players, digital cameras, etc., flexible printed circuit board (FPCB), multi-layered with polymers and metals, tends to be thicker. In present, multi-layered FPCBs are being mechanically cut with a punching die. The mechanical cutting of FPCBs causes such defects as burr on layer edges, cracks in terminals, delamination and chipping of layers. In this study, the laser cutting mechanism of FPCB was examined to solve problems related to surface debris and short-circuiting that can be caused by the photo-thermal effect. The laser cutting of PI and FCCL, which are base materials of FPCB, was carried out using a pico-second laser(355nm, 532nm) and nano-second UV laser with adjusting variables such as the average/peak power, scanning speed, cycles, gas and materials. Points which special attention should be paid are that a fast scanning speed, low repetition rate and high peak power are required for precision machining.

• Korean Journal of Metals and Materials
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• v.49 no.5
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• pp.388-394
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• 2011

High speed copper filling into TSV (through-silicon-via) for three dimensional stacking of Si chips was investigated. For this study, a tapered via was prepared on a Si wafer by the DRIE (deep reactive ion etching) process. The via had a diameter of 37${\mu}m$ at the via opening, and 32${\mu}m$ at the via bottom, respectively and a depth of 70${\mu}m$. $SiO_2$, Ti, and Au layers were coated as functional layers on the via wall. In order to increase the filling ratio of Cu into the via, a PPR (periodic pulse reverse) wave current was applied to the Si chip during electroplating, and a PR (pulse reverse) wave current was applied for comparison. After Cu filling, the cross sections of the vias was observed by FE-SEM (field emission scanning electron microscopy). The experimental results show that the tapered via was filled to 100% at -5.85 mA/$cm^2$ for 60 min of plating by PPR wave current. The filling ratio into the tapered via by the PPR current was 2.5 times higher than that of a straight via by PR current. The tapered via by the PPR electroplating process was confirmed to be effective to fill the TSV in a short time.

• Journal of the Korea institute for structural maintenance and inspection
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• v.26 no.5
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• pp.30-42
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• 2022

Due to the increase in construction of tunnels, the burdens of maintenance works for tunnel structures have been increasing in Korea. In addition, the increase of traffic volume and aging of materials also threatens the safety of tunnel facilities, therefore, maintenance costs are expected to increase significantly in the future. Accordingly, automated condition assessment technologies like image-based tunnel scanning system for inspection and diagnosis of tunnel facilities have been proposed. For image-based tunnel scanning system, it is key to create a planar image through stitching of multiple images captured by tunnel scanning system. In this study, performance of feature-based stitching algorithms suitable for stitching tunnel scanning images was evaluated. In order to find a suitable algorithm SIFT, ORB, and BRISK are compared. The performance of the proposed algorithm was determined by the number of feature extraction, calculation speed, accuracy of feature matching, and image stitching result. As for stitching performance, SIFT algorithm was the best in all parts of tunnel image. ORB and BRISK also showed satisfactory performance and short calculation time. SIFT can be used to generate precise planar images. ORB and BRISK also showed satisfactory stitching results, confirming the possibility of being used when real-time stitching is required.