• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.3
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• pp.66-71
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• 2016

Reducing the wafer breakage rate and sawing thinner wafers will decrease the cost of solar cells. This study was carried out in order to identify ways to achieve this goal. In this study, the cutting force characteristics using an ingot tilting-type diamond multi wire-sawing machine were analyzed. The cutting force was analyzed while varying the tilting angles and wire speed. The obtained data were analyzed by classifying the tangential cutting force and the normal cutting force. In this cutting force experiment, the difference between the forces was confirmed; it was found that it rises with increasing the tilting angles and decreases when the wire speed elevates. The resulting value can be utilized as basic data for the determination of an ideal cutting recipe.

• 제어로봇시스템학회:학술대회논문집
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• 1996.10b
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• pp.743-746
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• 1996

A hybrid control scheme to regulate the force and position by dual arms is proposed, where two arms are treated as one arm in a kinematic viewpoint. Our approach is different from other hybrid control approaches which consider robot dynamics, in the sense that we employ a purely kinematic based approach for hybrid control, with regard to the nature of position-controlled industrial robots. The proposed scheme is applied to sawing task. In the sawing task, the trajectory of the saw grasped by dual arms is planned in an offline fashion. When the trajectory of the saw is planned to follow a line in a horizontal plane, 3 position parameters are to be controlled(i.e, two translational positions and one rotational position). And a certain level of contact force has to be controlled along the vertical direction(i.e., minus z-direction) not to loose the contact with the object to be sawn. Typical feature of sawing task is that the contact position where the force control is to be performed is continuously changing. Therefore, the kinematic mapping between the force controlled position and the joint actuators has to be updated continuously. The effectiveness of the proposed control scheme is experimentally demonstrated. The proposed hybrid control scheme can be applied to arbitrary dual arm systems, regardless of their kinematic structure and the number of actuated joints.

• Proceedings of the KIEE Conference
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• 2006.04a
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• pp.327-329
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• 2006

In this paper, the cutting qualities by laser dicing and fracture strength of a silicon die is investigated. Laser micromachining is the non-contact process using thermal ablation and evaporation mechanisms. By these mechanisms, debris is generated and stick on the surface of wafer, which is the problem to apply laser dicing to semiconductor manufacture process. Unlike mechanical sawing using diamond blade, chipping on the surface and crack on the back side of wafer isn't made by laser dicing. Die strength by laser dicing is measured via the three-point bend test and is compared with the die strength by mechanical sawing. As a results, die strength by laser dicing shows a decrease of 50% in compared with die strength by mechanical sawing.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2006.05a
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• pp.251-254
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• 2006

In this paper, cutting qualifies and fracture strength of silicon dies by laser dicing are investigated. Laser micromachining is the non-contact process using thermal ablation and evaporation mechanisms. By these mechanisms, debris is generated and stick on the surface of wafer, which is the problem to apply laser dicing to semiconductor manufacture process. Unlike mechanical sawing using diamond blade, chipping on the surface and crack on the back side of wafer isn't made by laser dicing. Die strength by laser dicing is measured via the three-point bending test and is compared with the die strength by mechanical sawing. As a results, die strength by the laser dicing shows a decrease of 50% in compared with die strength by the mechanical sawing.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.881-882
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• 2006

In 1997, Dr. James Chien-Min Sung patented the technology of making diamond tools according to a predetermined pattern. The optimization of this pattern may double the tool life and the cutting speed. In 1998, Sung also made $DiaGrid^{(R)}$ saw segments that showed superior performance in cutting granite and marble. In 2000, Sung visited Shinhan and introduced them this revolutionary concept of diamond saw segments. In 2005, Shinhan adapted the idea and produced saw segments with diamond grits set in a predetermined pattern, their results confirmed that the sawing speed and the sawing life were both improved over conventional designs.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2003.10a
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• pp.62-63
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• 2003

The inter-particle distance between diamonds on the segment surface of sawing blade predicted theoretically and measured experimentally followed a Gamma or Weibull function, rather than a normal distribution function. These results suggest that random dispersion of diamond particles in the segment may not be an efficient way of improving cutting efficiency of the blade.

• Resources Recycling
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• v.22 no.2
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• pp.37-43
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• 2013

Unlike the conventional slurry type wire sawing, the diamond wire sawing method adopts diamond plated wire as sawing media instead of slurry consisted of both silicon carbide and oil. Wafering with diamond plated wire leaves solid element of the sludge mostly made up of silicon, and it is not difficult to recover 95% or more of silicon by a simple separation process of oil from the sludge. In this study, silicon was recovered from the sludge by drying process and organic and metal impurities were removed by sintering process. As result 3N grade silica was obtained successfully by thermal processing utilized the fact that the recovered silicon readily combines with oxygen due to fine particle size.

• Proceedings of the Korea Concrete Institute Conference
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• 1999.04a
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• pp.469-474
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• 1999

The object of study is analysis to joint crack behavior of cracked joint concrete pavement. In the new constructing concrete pavement, joint crack behavior was compared general joint depth D/4 with joint depth D/3 and D/5 that it's environmental effects changed temperature and humidity. After joint saw cutting joint section was predicted crack at joint depth D/5 test section from the result for monitoring development of crack. In the setting of data logger system of the joint section, it's data compared see with the naked eye. In the research, development of crack at the joint section should effect to joint saw timing latter than joint depth. This performance could be the minimum of deterioration to the early curing. In this research, At new constructing of joint concrete pavement of highway, the monitoring system be setting after finished paving and joint sawing. The system and see with the naked eye could be analysis to pavement behaviors from collecting data at the test section. This system could be monitoring shot term and long term. In this report, joint section of crack behavior analysis used to collected data during a month after paving and joint sawing.

• Current Photovoltaic Research
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• v.6 no.1
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• pp.1-11
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• 2018

Current major photovoltaic (PV) market share (> 60%) is being occupied by the multicrystalline (mc)-silicon solar cells despite of low efficiency compared to single crystalline silicon solar cells. The diamond wire sawing technology reduces the production cost of crystalline silicon solar cells, it increases the optical loss for the existing mc-silicon solar cells and hence its efficiency is low in the current mass production line. To overcome the optical loss in the mc-crystalline silicon, caused by the diamond wire sawing, next generation texturing process is being investigated by various research groups for the PV industry. In this review, the limitation of surface structure and optical loss due to the reflectivity of conventional mc-silicon solar cells are explained by the typical texturing mechanism. Various texturing technologies that could minimize the optical loss of mc-silicon solar cells are explained. Finally, next generation texturing technology to survive in the fierce cost competition of photovoltaic market is discussed.

• Journal of the Korean Society of Industry Convergence
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• v.11 no.3
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• pp.121-125
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• 2008

Commutator which plays the major role in switching electric currents from AC to DC is composed of copper and molding compound. The longevity of the DC motors are mostly hampered by the improper machining of the parts. Smooth surface will be mandatory to create the proper air gap of the commutator. In this thesis the selection of the proper materials and tools, the design and analysis of machine structure and the final test procedures have been investigated to achieve the smooth cut surface of the commutators. The performance and the product of the newly manufactured machine has been compared with those of the existing one. And the test result shows the new sawing machine has better overall efficiency and durability.