• 한국기계가공학회지
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• 제15권3호
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• pp.66-71
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• 2016

Reducing the wafer breakage rate and sawing thinner wafers will decrease the cost of solar cells. This study was carried out in order to identify ways to achieve this goal. In this study, the cutting force characteristics using an ingot tilting-type diamond multi wire-sawing machine were analyzed. The cutting force was analyzed while varying the tilting angles and wire speed. The obtained data were analyzed by classifying the tangential cutting force and the normal cutting force. In this cutting force experiment, the difference between the forces was confirmed; it was found that it rises with increasing the tilting angles and decreases when the wire speed elevates. The resulting value can be utilized as basic data for the determination of an ideal cutting recipe.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1996년도 한국자동제어학술회의논문집(국내학술편); 포항공과대학교, 포항; 24-26 Oct. 1996
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• pp.743-746
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• 1996

A hybrid control scheme to regulate the force and position by dual arms is proposed, where two arms are treated as one arm in a kinematic viewpoint. Our approach is different from other hybrid control approaches which consider robot dynamics, in the sense that we employ a purely kinematic based approach for hybrid control, with regard to the nature of position-controlled industrial robots. The proposed scheme is applied to sawing task. In the sawing task, the trajectory of the saw grasped by dual arms is planned in an offline fashion. When the trajectory of the saw is planned to follow a line in a horizontal plane, 3 position parameters are to be controlled(i.e, two translational positions and one rotational position). And a certain level of contact force has to be controlled along the vertical direction(i.e., minus z-direction) not to loose the contact with the object to be sawn. Typical feature of sawing task is that the contact position where the force control is to be performed is continuously changing. Therefore, the kinematic mapping between the force controlled position and the joint actuators has to be updated continuously. The effectiveness of the proposed control scheme is experimentally demonstrated. The proposed hybrid control scheme can be applied to arbitrary dual arm systems, regardless of their kinematic structure and the number of actuated joints.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 심포지엄 논문집 정보 및 제어부문
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• pp.327-329
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• 2006

In this paper, the cutting qualities by laser dicing and fracture strength of a silicon die is investigated. Laser micromachining is the non-contact process using thermal ablation and evaporation mechanisms. By these mechanisms, debris is generated and stick on the surface of wafer, which is the problem to apply laser dicing to semiconductor manufacture process. Unlike mechanical sawing using diamond blade, chipping on the surface and crack on the back side of wafer isn't made by laser dicing. Die strength by laser dicing is measured via the three-point bend test and is compared with the die strength by mechanical sawing. As a results, die strength by laser dicing shows a decrease of 50% in compared with die strength by mechanical sawing.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2006년도 춘계학술대회
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• pp.251-254
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• 2006

In this paper, cutting qualifies and fracture strength of silicon dies by laser dicing are investigated. Laser micromachining is the non-contact process using thermal ablation and evaporation mechanisms. By these mechanisms, debris is generated and stick on the surface of wafer, which is the problem to apply laser dicing to semiconductor manufacture process. Unlike mechanical sawing using diamond blade, chipping on the surface and crack on the back side of wafer isn't made by laser dicing. Die strength by laser dicing is measured via the three-point bending test and is compared with the die strength by mechanical sawing. As a results, die strength by the laser dicing shows a decrease of 50% in compared with die strength by the mechanical sawing.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.881-882
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• 2006

In 1997, Dr. James Chien-Min Sung patented the technology of making diamond tools according to a predetermined pattern. The optimization of this pattern may double the tool life and the cutting speed. In 1998, Sung also made $DiaGrid^{(R)}$ saw segments that showed superior performance in cutting granite and marble. In 2000, Sung visited Shinhan and introduced them this revolutionary concept of diamond saw segments. In 2005, Shinhan adapted the idea and produced saw segments with diamond grits set in a predetermined pattern, their results confirmed that the sawing speed and the sawing life were both improved over conventional designs.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2003년도 international symposium on advanced powder metallurgy
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• pp.62-63
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• 2003

The inter-particle distance between diamonds on the segment surface of sawing blade predicted theoretically and measured experimentally followed a Gamma or Weibull function, rather than a normal distribution function. These results suggest that random dispersion of diamond particles in the segment may not be an efficient way of improving cutting efficiency of the blade.

• 자원리싸이클링
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• 제22권2호
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• pp.37-43
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• 2013

다이아몬드 입자를 전착한 와이어를 사용하여 실리콘 잉곳을 슬라이싱 하는 방식은 기존의 슬러리를 사용하는 방식과 달리 절단매체인 실리콘카바이드를 사용하지 않기 때문에 웨이퍼링 후에 발생하는 슬러지에 함유되어 있는 고형분의 대부분은 잉곳으로부터 분리되어 나온 실리콘 성분으로 구성되어 있다. 따라서 슬러지에 함유되어 있는 액상성분만 제거하여도 어렵지 않게 90% 이상의 순도를 가지는 실리콘을 회수할 수 있는 이점이 있다. 본 연구에서 다이아몬드 와이어 쏘잉 방식에서 배출된 슬러지로부터 오일 성분을 제거하여 고품위 실리콘 분말을 회수하였으며, 성형 및 소결공정을 통하여 실리콘에 포함되어 있는 유기물을 포함한 금속불순물을 제거하고, 미분체 실리콘의 산화가 용이한 점을 활용하여 열산화 공정으로 3N급 순도의 실리카를 제조하였다.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 1999년도 봄 학술발표회 논문집(I)
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• pp.469-474
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• 1999

The object of study is analysis to joint crack behavior of cracked joint concrete pavement. In the new constructing concrete pavement, joint crack behavior was compared general joint depth D/4 with joint depth D/3 and D/5 that it's environmental effects changed temperature and humidity. After joint saw cutting joint section was predicted crack at joint depth D/5 test section from the result for monitoring development of crack. In the setting of data logger system of the joint section, it's data compared see with the naked eye. In the research, development of crack at the joint section should effect to joint saw timing latter than joint depth. This performance could be the minimum of deterioration to the early curing. In this research, At new constructing of joint concrete pavement of highway, the monitoring system be setting after finished paving and joint sawing. The system and see with the naked eye could be analysis to pavement behaviors from collecting data at the test section. This system could be monitoring shot term and long term. In this report, joint section of crack behavior analysis used to collected data during a month after paving and joint sawing.

• Current Photovoltaic Research
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• 제6권1호
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• pp.1-11
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• 2018

Current major photovoltaic (PV) market share (> 60%) is being occupied by the multicrystalline (mc)-silicon solar cells despite of low efficiency compared to single crystalline silicon solar cells. The diamond wire sawing technology reduces the production cost of crystalline silicon solar cells, it increases the optical loss for the existing mc-silicon solar cells and hence its efficiency is low in the current mass production line. To overcome the optical loss in the mc-crystalline silicon, caused by the diamond wire sawing, next generation texturing process is being investigated by various research groups for the PV industry. In this review, the limitation of surface structure and optical loss due to the reflectivity of conventional mc-silicon solar cells are explained by the typical texturing mechanism. Various texturing technologies that could minimize the optical loss of mc-silicon solar cells are explained. Finally, next generation texturing technology to survive in the fierce cost competition of photovoltaic market is discussed.

• 한국산업융합학회 논문집
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• 제11권3호
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• pp.121-125
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• 2008

Commutator which plays the major role in switching electric currents from AC to DC is composed of copper and molding compound. The longevity of the DC motors are mostly hampered by the improper machining of the parts. Smooth surface will be mandatory to create the proper air gap of the commutator. In this thesis the selection of the proper materials and tools, the design and analysis of machine structure and the final test procedures have been investigated to achieve the smooth cut surface of the commutators. The performance and the product of the newly manufactured machine has been compared with those of the existing one. And the test result shows the new sawing machine has better overall efficiency and durability.