• 한국정밀공학회지
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• 제22권2호
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• pp.46-52
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• 2005

The sapphire wafer was polished by the implementation of the surface machining technology based on nano-tribology, The removal process has been performed by grinding, lapping and chemical-mechanical polishing. For the chemical mechanical polishing process, the chemical reaction between the slurry and sapphire wafer was investigated in terms of the change of Zeta-potential between two materials. The Zeta-potential was -4.98 mV without the slurry in deionized water and was -37.05 mV for the slurry solution. By including the slurry into the deionized water the Zeta-potential -29.73 mV, indicating that the surface atoms of sapphire become more repulsive to be easy to separate. The average roughness of the polished surface of sapphire wafer was ranged to 1∼4$\AA$.

• Tribology and Lubricants
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• 제34권6호
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• pp.209-216
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• 2018

Sapphire is a substrate material that is widely used in optical and electronic devices. However, the processing of sapphire into a substrate takes a long time owing to its high hardness and chemical inertness. In order to process the sapphire ingot into a substrate, ingot growth, multiwire sawing, lapping, and polishing are required. The lap grinding process using pellets is known as one of the ways to improve the efficiency of sapphire substrate processing. The lap grinding process ensures high processing efficiency while utilizing two-body abrasion, unlike the lapping process which utilizes three-body abrasion by particles. However, the lap grinding process has a high material removal rate (MRR), while its weakness is in obtaining the required surface roughness for the final polishing process. In this study, we examine the effects of free abrasives in lap grinding on the material removal characteristics of sapphire substrate. Before conducting the lap grinding experiments, it was confirmed that the addition of free abrasives changed the friction force through the pin-on-disk wear test. The MRR and roughness reduction rate are experimentally studied to verify the effects of free abrasive concentration on deionized water. The addition of free abrasives (colloidal silica) in the lap grinding process can improve surface roughness by three-body abrasion along with two-body abrasion by diamond grits.

• Journal of the Optical Society of Korea
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• 제12권4호
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• pp.309-313
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• 2008

We studied the sapphire and germanium fibers to determine which optical fiber best transmits Erbium:YAG laser for intracorporeal lithotripsy. Human calculi were ablated with an Erbium:YAG laser in contact mode using two fibers. Optical outputs at the distal end of fibers were measured before and after laser lithotripsy. Upon the irradiation on the calculus with the 50 mJ and 100 mJ pulse energy, the output energy at the distal end of germanium fiber declined to approximately 50% of the input energy. For the sapphire fiber, the output energy at the distal end remained unchanged with 100 mJ input energy; however the output energy had dropped to 50% for 200 mJ input energy. In order to examine how the types of target tissue affect the fiber damage, the sapphire fiber was tested for the irradiation on soft tissue and water as well. No energy decline was observed during soft tissue and water irradiation. We also characterized ablation craters with both optical fibers. Both fibers produced similar craters on calculi in terms of depth and diameter. Sapphire fibers are better suited than germanium fibers for Erbium:YAG lithotripsy in terms of the fiber damage.

• 한국결정성장학회지
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• 제8권1호
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• pp.1-9
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• 1998

본 연구에서는 냉각매체로서 물을 이용하는 수정된 열교환법을 이용하여 45$\times$45$\times$20(mm) 크기의 사각단면 형상의 sapphire 단결정의 제조가능 조건에 대하여 조사하였다. 온도에 따른 성장로 내의 압력 변화로부터 사파이어의 용융 및 응고 과정을 추적할 수 있었으며, 이로부터 sapphire 단결정은 1970~$1960^{\circ}C$에서 응고가 완료됨을 알 수 있었다. 도가니 성형시 이루어지는 '귀'의 형태는 도가니 벽면과 접촉되지 않는 '나선형태'이어야 한다. 열유출부는 융액 내의 온도구배를 지배하며 융액내의 열유속과 씨앗 결정의 흔적은 Mo 봉의 체적 변화로서 조절할 수 있었다. 기공 형성을 억제하기 위해서는 $0.2^{\circ}C$/min 이하의 발열체의 냉각속도가 요구되었다.

• 한국결정성장학회지
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• 제11권5호
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• pp.218-223
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• 2001

수평 Bridgman 방법으로 성장한 사파이어 인고트를 절단 연마한 후, 사파이어 결정기판의 표면을 우레탄 천 위에서 실리카 졸을 사용하여 폴리싱하였다. 표면의 결정성을 X-선 회절을 통하여 조사하였으며, 2중 결정회절에 의한 반치폭은 200~400 arcsec을 가지며, 결정 인고트의 절편화 또는 양면 연삭 연마에 따른 잔류응력에 의한 표면에서의 기계적인 스트레스에 의해 결정성이 손상되어진다. 화학-기계적인 폴리싱공정을 수행한 수에 표면처리로 $1,200^{\circ}C$로 4시간 열처리 및 산처리를 연속적으로 수행할 경우 결정성이 반치폭 8.3 arcsec까지 줄어들어 향상됨을 확인하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.112-112
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• 2013

Well-defined surfaces of single-crystalline solid materials are starting points of self-organizationof nanostructures and chemical reactions controlled in nanoscale. Although highly ordered atomicarrangement can be obtained on semiconductor surfaces, they can be maintained only in vacuumand not in air or in aqueous environment. Since single-crystalline metal oxide surfaces arechemically stable and no further oxidation occurs, their atomic structures can be utilized fornanofabrication in liquid processes, nanoelectrochemistry and nanobiotechnology. Sapphire is oneof the most stable metal oxides and its crystalline quality is excellent, as can be applied to electronicdevices that require ultralow defect densities. We recently found that chemical phase separationoccurs on sapphire surfaces by annealing processes and the formed nanodomains exhibit specificproperties in air and in water [1,2]. In our experiments, highly selective and controllable adsorptionof various protein molecules is observed on the phase-separated surfaces though the materials andcrystallographic orientations are identical [3,4]. Planar lipid bilayers supported on thephase-separated sapphire surface also exhibit a specific formation site selectivity [5]. Chemicalnanodomains appear on other metal-oxide surfaces, such as well-ordered titania surfaces. Wedemonstrate that surface chemistry of the nanodomains can be characterized in aqueousenvironment using atomic force microscopy equipped with colloidal tips and then show adsorptionand desorption behaviors of various proteins on the phase-separated surfaces.

• 한국재료학회지
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• 제25권1호
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• pp.21-26
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• 2015

CMP(Chemical Mechanical Polishing) Processes have been used to improve the planarization of the wafers in the semiconductor manufacturing industry. Polishing performance of CMP Process is determined by the chemical reaction of the liquid sol containing abrasive, pressure of the head portion and rotational speed of the polishing pad. However, frictional heat generated during the CMP process causes agglomeration of the particles and the liquidity degradation, resulting in a non-uniform of surface roughness and surface scratch. To overcome this chronic problem, herein, we introduced NaCl salt as an additive into silica sol for elimination the generation of frictional heat. The added NaCl reduced the zata potential of silica sol and increased the contact surface of silica particles onto the sapphire wafer, resulting in increase of the removal rate up to 17 %. Additionally, it seems that the silica particles adsorbed on the polishing pad decreased the contact area between the sapphire water and polishing pad, which suppressed the generation of frictional heat.

• 한국가시화정보학회지
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• 제13권3호
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• pp.20-23
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• 2015

In this experiment, a heterogeneous droplet consisted of de-ionized water and olive oil was made through two 31G injection needles. The injection flow rate was $50{\mu}{\ell}/min$ and the droplet size was 2 mm. The droplet was impinged onto a sapphire plate which was heated up to $300^{\circ}C$ by a heater. Two high speed cameras were used for visualization, and the frame rate was 20,000 fps. A 150W metal halite lamp was used for illumination. The dropping height was fixed to 20 mm and the corresponding Weber number was 10.6 based on water. Due to different boiling points of two liquids, partial boiling features of heterogeneous droplet was observed. At the Leidenfrost condition, micro explosion phenomenon has occurred.

• Tribology and Lubricants
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• 제33권5호
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• pp.228-233
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• 2017

Chemical Mechanical Polishing of chemically stable sapphire substrates is dominantly affected by the mechanical processing of abrasives, in terms of the material removal rate. In this study, we investigated the effect of electrostatic force between the abrasives and substrate, on the polishing. If potassium chloride (KCl) is added to slurry, water molecules are decomposed into $H^+$ and $OH^-$ ions, and the amount of ions in the slurry changes. The zeta potential of the abrasives decreases with an increase in the amount of $H^+$ ions in the stern layer; consequently, the electrostatic force between the abrasives and substrate decreases. The change in zeta potential of abrasives in the slurry is affected by the slurry pH. In acidic zones, the amount of ions bound to the abrasives increases if the amount of $H^+$ ions is increased by adding KCl. However, in basic zones, there is no change in the corresponding amount. In acidic zones, zeta potential decreases as molar concentration of potassium increases; however, it does not change significantly in basic zones. The removal rate tends to decrease with increase in molar amount of potassium in acidic zones, where zeta potential changes significantly. However, in basic zones, the removal rate does not change with zeta potential. The tendencies of zeta potential and that of the frictional force generated during polishing show strong correlation. Through experiments, it is confirmed that the contact probability of abrasives changes according to the electrostatic force generated between the abrasives and substrate, and variation in removal rate.

• 마이크로전자및패키징학회지
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• 제25권3호
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• pp.1-5
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• 2018

본 연구에서는 InGaN/GaN multi quantum well (MQW)에서 Indium (In) 도핑효과에 따른 광전기화학적 특성을 관찰하였다. 기판으로는 Sapphire을 사용하였고, 각 Quantum well (QW)을 구성하고 있는 InGaN의 조성을 다르게 하였다. 투과도 측정 결과 일정한 In 조성을 가진 InGaN/GaN MQW에 비해 각 QW의 In 조성을 다르게 한 InGaN/GaN MQW에서 흡수도가 향상되는 것을 확인할 수 있었다. 이는 각각 다른 In 조성을 가진 InGaN 층이 더 넓은 영역의 스펙트럼 에너지를 가지는 빛을 흡수하기 때문인 것으로 생각된다. 광학적 특성을 평가하기 위해 진행한 상온 photoluminescence (PL) 실험을 진행한 결과, 역시 다양한 In 조성을 가진 InGaN/GaN MQW이 더 넓은 파장에서 발광이 나타나는 것을 확인할 수 있었다. 이들 샘플에 대한 광전기화학적 특성평가를 통하여, gradation In 조성을 가지고 있는 InGaN/GaN MQW이 일정한 In 조성을 가지는 InGaN/GaN MQW에 비해 광전기화학적 물분해 능력이 월등히 향상됨을 확인하였다.