Browse > Article
http://dx.doi.org/10.3740/MRSK.2015.25.1.21

Characteristics of Sapphire Wafers Polishing Depending on Ion Conductivity of Silica Sol  

Na, Ho Seong (Korea Institute of Ceramic Engineering & Technology(KICET))
Cho, Gyeong Sook (Korea Institute of Ceramic Engineering & Technology(KICET))
Lee, Dong-Hyun (Korea Institute of Ceramic Engineering & Technology(KICET))
Park, Min-Gyeong (Korea Institute of Ceramic Engineering & Technology(KICET))
Kim, Dae Sung (Korea Institute of Ceramic Engineering & Technology(KICET))
Lee, Seung-Ho (Korea Institute of Ceramic Engineering & Technology(KICET))
Publication Information
Korean Journal of Materials Research / v.25, no.1, 2015 , pp. 21-26 More about this Journal
Abstract
CMP(Chemical Mechanical Polishing) Processes have been used to improve the planarization of the wafers in the semiconductor manufacturing industry. Polishing performance of CMP Process is determined by the chemical reaction of the liquid sol containing abrasive, pressure of the head portion and rotational speed of the polishing pad. However, frictional heat generated during the CMP process causes agglomeration of the particles and the liquidity degradation, resulting in a non-uniform of surface roughness and surface scratch. To overcome this chronic problem, herein, we introduced NaCl salt as an additive into silica sol for elimination the generation of frictional heat. The added NaCl reduced the zata potential of silica sol and increased the contact surface of silica particles onto the sapphire wafer, resulting in increase of the removal rate up to 17 %. Additionally, it seems that the silica particles adsorbed on the polishing pad decreased the contact area between the sapphire water and polishing pad, which suppressed the generation of frictional heat.
Keywords
CMP(Chemical Mechanical Polishing); silica sol; removal rate; frictional heat; ion conductivity; zeta potential;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 H. C. Lee, Korean. J. Ceram., 14(5), 7 (2011) (in Korean).
2 H. Tang, H. C. Li and J. Xu, InTech., 308 (2013).
3 W. Xu, X. Lu, G. Pan, Y. Lei and J. Luo, Appl. Surf. Sci., 257(7), 2905 (2011).   DOI   ScienceOn
4 H. Aida, T. Doi, H. Takeda, H. Katakura, S. W. Kim, K. Koyama, T. Yamazaki and M. Uneda, Curr. Appl. Phys., 12, S41 (2012).   DOI   ScienceOn
5 P. Kumar, J. Lee, G. Lee, S. Rao, D. Singh and R. K. Singh, Appl. Surf. Sci., 273, 58 (2013).   DOI   ScienceOn
6 A. Tamhankar and R. Patel, ICALEO, (2010).
7 Z. Zhang, W. Yan, L. Zhang, W. Liu and Z. Song, Microelectro. Eng., 88(9), 3020 (2011).   DOI   ScienceOn
8 X. Hu, Z. Song, Z. Pan, W. Liu and L. Wu, Appl. Surf. Sci., 255(19), 8230 (2009).   DOI   ScienceOn
9 L. Yuling, T. Baimei, N. Xinhuan and Z. Haitao, 1 (2009).
10 H. Zhu, L. A. Tessaroto, R. Sabia, V. A. Greenhut, M. Smith and D. E. Niesz, Appl. Surf. Sci., 236(1), 120 (2004).   DOI   ScienceOn
11 G. B. Basim, I. U. Vakarelski, and B. M. Moudgil, J. Colloid. Interf. Sci., 263(2), 506 (2003).   DOI   ScienceOn
12 http://www.displaybank.com/contents_img/296975.gif
13 H. S. Hwang, J. H. Park, J. G. Park, M. C. Jeon, S. S. Lee, J. Y. Kim and H. R. Kim, J. Korean. Inst. Met. Mater., 25(2), 17 (2012). (in Korean)
14 H. J. Kim, H. Y. Kim, H. D. Jeong, E. S. Lee and Y. J. Shin, J. Mater. Process. Tech., 130-131, 334 (2002).   DOI   ScienceOn
15 M. H. Choi, N. H. Kim, S. Y. Kim and E. G. Chang, J. KIEEME., 18(1), 24 (2005).
16 N. Chandrasekaran, S. Ramarajan, W. Lee, G. M. Sabde and S. Meikle, J. Electrochem. Soc., 151(12), G882 (2004).   DOI   ScienceOn
17 L. Borucki, L. Charns and A. philipossian, J. Electrochem. Soc., 151(12), G809 (2004).   DOI   ScienceOn
18 G. B. Basim and B. M. Moudgil, J. Colloid. Interf. Sci., 256(1), 137 (2002).   DOI   ScienceOn
19 F. C. Chang, P. Kumar, R. Singh, K. Balasundaram, J. Lee, J. Lee, R. K. Singh, Colloid Surface.Physicochem. Eng. Aspect., 389(1), 33 (2011).   DOI   ScienceOn
20 W. Choi, U. Mahajan, S. M. Lee, J. Abiade and R. K. Singh, J. Electrochem. Soc., 151(3), G185 (2004).   DOI   ScienceOn
21 N. G. Cha, Y. J. Kang, I. K. Kim, K. C. Kim and J. G. Park, Kor. J. Mater. Res., 16(12), 731 (2006).   DOI   ScienceOn