• Journal of the Korean Society for Precision Engineering
• /
• v.22 no.2
• /
• pp.46-52
• /
• 2005

The sapphire wafer was polished by the implementation of the surface machining technology based on nano-tribology, The removal process has been performed by grinding, lapping and chemical-mechanical polishing. For the chemical mechanical polishing process, the chemical reaction between the slurry and sapphire wafer was investigated in terms of the change of Zeta-potential between two materials. The Zeta-potential was -4.98 mV without the slurry in deionized water and was -37.05 mV for the slurry solution. By including the slurry into the deionized water the Zeta-potential -29.73 mV, indicating that the surface atoms of sapphire become more repulsive to be easy to separate. The average roughness of the polished surface of sapphire wafer was ranged to 1∼4$\AA$.

• Tribology and Lubricants
• /
• v.34 no.6
• /
• pp.209-216
• /
• 2018

Sapphire is a substrate material that is widely used in optical and electronic devices. However, the processing of sapphire into a substrate takes a long time owing to its high hardness and chemical inertness. In order to process the sapphire ingot into a substrate, ingot growth, multiwire sawing, lapping, and polishing are required. The lap grinding process using pellets is known as one of the ways to improve the efficiency of sapphire substrate processing. The lap grinding process ensures high processing efficiency while utilizing two-body abrasion, unlike the lapping process which utilizes three-body abrasion by particles. However, the lap grinding process has a high material removal rate (MRR), while its weakness is in obtaining the required surface roughness for the final polishing process. In this study, we examine the effects of free abrasives in lap grinding on the material removal characteristics of sapphire substrate. Before conducting the lap grinding experiments, it was confirmed that the addition of free abrasives changed the friction force through the pin-on-disk wear test. The MRR and roughness reduction rate are experimentally studied to verify the effects of free abrasive concentration on deionized water. The addition of free abrasives (colloidal silica) in the lap grinding process can improve surface roughness by three-body abrasion along with two-body abrasion by diamond grits.

• Journal of the Optical Society of Korea
• /
• v.12 no.4
• /
• pp.309-313
• /
• 2008

We studied the sapphire and germanium fibers to determine which optical fiber best transmits Erbium:YAG laser for intracorporeal lithotripsy. Human calculi were ablated with an Erbium:YAG laser in contact mode using two fibers. Optical outputs at the distal end of fibers were measured before and after laser lithotripsy. Upon the irradiation on the calculus with the 50 mJ and 100 mJ pulse energy, the output energy at the distal end of germanium fiber declined to approximately 50% of the input energy. For the sapphire fiber, the output energy at the distal end remained unchanged with 100 mJ input energy; however the output energy had dropped to 50% for 200 mJ input energy. In order to examine how the types of target tissue affect the fiber damage, the sapphire fiber was tested for the irradiation on soft tissue and water as well. No energy decline was observed during soft tissue and water irradiation. We also characterized ablation craters with both optical fibers. Both fibers produced similar craters on calculi in terms of depth and diameter. Sapphire fibers are better suited than germanium fibers for Erbium:YAG lithotripsy in terms of the fiber damage.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.8 no.1
• /
• pp.1-9
• /
• 1998

In this study, we have investigated the preparation conditions of 45$\times$45$\times$20(mm) square cross-section sapphire single crystal by the modified heat exchanger method using water as a coolant. Melting and solidification processes were optimized by the systematic change of the chamber pressure with the heater temperature. As a results, solidification temperature was between 1960 and $1970^{\circ}C$. The crucible was formed by handling. Therefore its shape should had the 'spiral type' ear at edge of its side. Heat exchanger affected to the temperature distribution and gradient of molten alumina. Heat flux and unmelted seed were controlled by volume of heat exchanger. Voids were controlled by the cooling rate of the heater below $0.2^{\circ}C$/min.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.11 no.5
• /
• pp.218-223
• /
• 2001

The chemical-mechanical polishing process was carried out for 2"-dia. sapphire wafer grown by horizontalBridgman method on the urethane lapping pad with the silica sol. The polished wafer shows the full-width at halfmaximum of 200~400 arcsec in double-crystal X-ray diffraction, indicating that the slicing, grinding and lapping processes before the polishing process affected the crystalline structural property of the wafer surface by the mechanical residual stress. For the inclusion of surface treatments after chemical-mechanical polishing such as the thermal annealing at the temperature of $1,200^{\circ}C$for 4 hrs. and chemical etching, the crystalline quality was sigdicantly enhanced with the reduced full-width at half maximum up to 8.3 arcsec.arcsec.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.02a
• /
• pp.112-112
• /
• 2013

Well-defined surfaces of single-crystalline solid materials are starting points of self-organizationof nanostructures and chemical reactions controlled in nanoscale. Although highly ordered atomicarrangement can be obtained on semiconductor surfaces, they can be maintained only in vacuumand not in air or in aqueous environment. Since single-crystalline metal oxide surfaces arechemically stable and no further oxidation occurs, their atomic structures can be utilized fornanofabrication in liquid processes, nanoelectrochemistry and nanobiotechnology. Sapphire is oneof the most stable metal oxides and its crystalline quality is excellent, as can be applied to electronicdevices that require ultralow defect densities. We recently found that chemical phase separationoccurs on sapphire surfaces by annealing processes and the formed nanodomains exhibit specificproperties in air and in water [1,2]. In our experiments, highly selective and controllable adsorptionof various protein molecules is observed on the phase-separated surfaces though the materials andcrystallographic orientations are identical [3,4]. Planar lipid bilayers supported on thephase-separated sapphire surface also exhibit a specific formation site selectivity [5]. Chemicalnanodomains appear on other metal-oxide surfaces, such as well-ordered titania surfaces. Wedemonstrate that surface chemistry of the nanodomains can be characterized in aqueousenvironment using atomic force microscopy equipped with colloidal tips and then show adsorptionand desorption behaviors of various proteins on the phase-separated surfaces.

• Korean Journal of Materials Research
• /
• v.25 no.1
• /
• pp.21-26
• /
• 2015

CMP(Chemical Mechanical Polishing) Processes have been used to improve the planarization of the wafers in the semiconductor manufacturing industry. Polishing performance of CMP Process is determined by the chemical reaction of the liquid sol containing abrasive, pressure of the head portion and rotational speed of the polishing pad. However, frictional heat generated during the CMP process causes agglomeration of the particles and the liquidity degradation, resulting in a non-uniform of surface roughness and surface scratch. To overcome this chronic problem, herein, we introduced NaCl salt as an additive into silica sol for elimination the generation of frictional heat. The added NaCl reduced the zata potential of silica sol and increased the contact surface of silica particles onto the sapphire wafer, resulting in increase of the removal rate up to 17 %. Additionally, it seems that the silica particles adsorbed on the polishing pad decreased the contact area between the sapphire water and polishing pad, which suppressed the generation of frictional heat.

• Journal of the Korean Society of Visualization
• /
• v.13 no.3
• /
• pp.20-23
• /
• 2015

In this experiment, a heterogeneous droplet consisted of de-ionized water and olive oil was made through two 31G injection needles. The injection flow rate was $50{\mu}{\ell}/min$ and the droplet size was 2 mm. The droplet was impinged onto a sapphire plate which was heated up to $300^{\circ}C$ by a heater. Two high speed cameras were used for visualization, and the frame rate was 20,000 fps. A 150W metal halite lamp was used for illumination. The dropping height was fixed to 20 mm and the corresponding Weber number was 10.6 based on water. Due to different boiling points of two liquids, partial boiling features of heterogeneous droplet was observed. At the Leidenfrost condition, micro explosion phenomenon has occurred.

• Tribology and Lubricants
• /
• v.33 no.5
• /
• pp.228-233
• /
• 2017

Chemical Mechanical Polishing of chemically stable sapphire substrates is dominantly affected by the mechanical processing of abrasives, in terms of the material removal rate. In this study, we investigated the effect of electrostatic force between the abrasives and substrate, on the polishing. If potassium chloride (KCl) is added to slurry, water molecules are decomposed into $H^+$ and $OH^-$ ions, and the amount of ions in the slurry changes. The zeta potential of the abrasives decreases with an increase in the amount of $H^+$ ions in the stern layer; consequently, the electrostatic force between the abrasives and substrate decreases. The change in zeta potential of abrasives in the slurry is affected by the slurry pH. In acidic zones, the amount of ions bound to the abrasives increases if the amount of $H^+$ ions is increased by adding KCl. However, in basic zones, there is no change in the corresponding amount. In acidic zones, zeta potential decreases as molar concentration of potassium increases; however, it does not change significantly in basic zones. The removal rate tends to decrease with increase in molar amount of potassium in acidic zones, where zeta potential changes significantly. However, in basic zones, the removal rate does not change with zeta potential. The tendencies of zeta potential and that of the frictional force generated during polishing show strong correlation. Through experiments, it is confirmed that the contact probability of abrasives changes according to the electrostatic force generated between the abrasives and substrate, and variation in removal rate.

• Journal of the Microelectronics and Packaging Society
• /
• v.25 no.3
• /
• pp.1-5
• /
• 2018

In this study, the effects of indium (In) doping in InGaN/GaN multi quantum well (MQW) on photoelectrochemical (PEC) properties were investigated. Each quantum well (QW) layer with controlled In content were grown on sapphire substrate. Before growth of MQW, GaN growth consisted of various stages in the following order: buffer GaN growth, undoped GaN growth, and Si-doped n-type GaN growth. Absorbance of InGaN/GaN MQW having different In composition was higher than that of the InGaN/GaN MQW having a constant In composition. It indicates that InGaN layer having different In composition absorbs light having a broad spectrum energy. These results are in agreement with those in photoluminescence (PL). After evaluation of PEC properties, it demonstrated that InGaN/GaN MQW having different In composition was improved InGaN/GaN MQW having constant In composition in PEC water splitting ability.