• Design & Manufacturing
• /
• v.14 no.3
• /
• pp.44-49
• /
• 2020

One of display trends today is development of high pixel density. To get high PPI, a small size of pixel must be developed. RGB pixel is arranged by evaporation process which determines pixel size. Normally, a fine metal mask (FMM; Invar alloy) has been used for evaporation process and it has advantages such as good strength, and low thermal expansion coefficient at low temperature. A FMM has been manufactured by chemical etching which has limitation to controlling the pattern shape and size. One of alternative method for patterning FMM is laser micromachining. Femtosecond laser is normally considered to improve those disadvantages for laser micromachining process due to such short pulse duration. In this paper, a femtosecond laser drilling for thickness of 16 ㎛ FMM is examined. Additionally, we introduce experimental results for controlling taper angle of hole by vibration module adapted in laser system. We used Ti:Sapphire based femtosecond laser with attenuating optics, co-axial illumination, vision system, 3-axis linear stage and vibration module. By controlling vibration amplitude, entrance and exit diameters are controllable. Using vibrating objective lens, we can control taper angle when femtosecond laser hole drilling by moving focusing point. The larger amplitude of vibration we control, the smaller taper angle will be carried out.

• Journal of the Microelectronics and Packaging Society
• /
• v.20 no.1
• /
• pp.33-37
• /
• 2013

In this research, we investigated the effect of mole concentration of precursor on morphological, structural and optical properties of ZnO nanorods. ZnO nanorods were hydrothermally grown on c-plane sapphire substrates in aqueous solution which contains zinc nitrate hexahydrate and hexamethylenetetramine at 90oC in the precursor range of 0.01 M to 0.025 M. With the increase of mole concentration, length and diameter of ZnO nanorods increased. In all the conditions, the growth direction of rods was longitudinally c-axis direction. From the strong emission peak at 380 nm of PL spectra at room temperature, we could confirm that the crystal quality of ZnO nanorods is good to emit radiative recombination spectra.

• Journal of the Korean Vacuum Society
• /
• v.7 no.s1
• /
• pp.15-19
• /
• 1998

Structural and optical properties of $In_xGa_{1-X}N$ as well as $In_{0.1}Ga_{0.9}N$/GaN single quantum we11 (SQW) grown on sapphire (0001) substrate with an based GaN using rf-plasma assisted MBE have been investigated. The quality of the InXGal.,N fdm was improved as the growth temperature increased. In PL measurements at low temperatures, the band edge emission peaks of $In_xGa_{1-X}N$ was shifted to red region as an indium cell and substrate temperature increased. For $In_{0.1}Ga_{0.9}N$/GaN SQW, the optical emission energy has blue shift about 15meV in PL peak, due to the confined energy level in the well region. And, the FWHM of the $In_{0.1}Ga_{0.9}N$/GaN SQW was larger than that of the bulk Ino,la.9N films. The broadening of FWHM can be explained either as non-uniformity of Indium composition or the potential fluctuation in the well region. Photoconductivity (PC) decay measurement reveals that the optical transition lifetimes of the SQW measured gradually increased with temperatures.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.15 no.2
• /
• pp.51-56
• /
• 2016

High brittleness is a characteristic of glass, and in many cases it is broken during the process of machining due to processing problems, such as scratches, chipping, and notches. Machining defects occur due to the vibration of the equipment. Therefore, design techniques are needed that can control the vibration generated in the equipment to increase the strength of tempered glass. The natural frequency of the machine tool via vibration analysis (computer simulation) must be accurately understood to improve the design to ensure the stability of the machine. To accurately understand the natural frequency, 3D modeling, which is the same as actual apparatus, was used and a constraint condition was also applied that was the same as that of the actual apparatus. The maximum speeds of ultrasonic and high frequency, which are 15,000 rpm and 60,000 rpm, respectively, are considerably faster than those of typical machine tools. Therefore, an improved design is needed so that the natural frequency is formed at a lower region and the natural frequency does not increase through general design reinforcement. By restructuring the top frame of the glass processing, the natural frequency was not formed in the operating speed area with the improved design. The lower-order natural frequency is dominant for the effects that the natural frequency has on the vibration. Therefore, the design improvement in which the lower-order natural frequency is not formed in the operating speed area is an optimum design improvement. It is possible to effectively control the vibrations by avoiding resonance with simple design improvements.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.16 no.6
• /
• pp.1-6
• /
• 2017

Recently, the brittle materials such as ceramics, glass, sapphire and textile material have been widely used in semiconductors, aerospace and automobile owing to high functional characteristics. On the other hand, it has the characteristics of difficult-to-cut material relative to all materials. In this study, diamond electro-deposited band-saw machine was developed to operate stably using water-coolant type through relative motion between band-saw tool and $Al_2O_3$ material. High densified $Al_2O_3$ material was manufactured by spark plasma sintering method. The bulk density was observed by the Archimedes law and the theoretical density was estimated to be $3.88g/cm^3$ and its hardness 14.7 MPa. From the dicing sawing test of $Al_2O_3$ specimen, behavior of surface roughness and band-saw wear are dominantly affected by the increase of the band-saw linear velocity. Additionally, an continuous pattern type of diamond band-saw was a very effective due to entry impact as a one-off for brittle material.

• Journal of the Microelectronics and Packaging Society
• /
• v.26 no.4
• /
• pp.113-118
• /
• 2019

In this study, we investigated the growth of single-crystallinity α-Ga₂O₃ thin films on c-plane sapphire substrates using halide vapor pressure epitaxy. We also found the optimal growth conditions to suppress the phase transition of α-Ga₂O₃. Our results confirmed that the growth temperature and partial pressure of the reactive gas greatly influenced the crystallinity. The optimal growth temperature range was about 460~510℃, and the α-Ga₂O₃ thin films with the highest crystallinity were obtained at a III/VI ratio of 4. The thickness and surface morphology of the thin films was observed by scanning electron microscopy. The film thickness was 6.938 ㎛, and the full width at half maximum of the ω-2θ scan rocking curve was as small as 178 arcsec. The optical band gap energy obtained was 5.21 eV, and the films were almost completely transparent in the near-ultraviolet and visible regions. The etch pit density was found to be as low as about 6.0 × 10⁴ cm^-2.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.22 no.6
• /
• pp.261-264
• /
• 2012

In this paper, we investigated characteristics of etching induced surface morphology variation by wet etching of GaN epilayer were grown on sapphire (0001) substrate by hydride vapor phase epitaxy (HVPE). As a results of scanning electron microscope (SEM) observation, three types of hexagonal etch pits (Edge, Screw, Mixed) were formed by the GaN epilayer thickness variations. A lot of etch pits, attributed to screw and mixed type TD, were observed at thinner epilayer, leading to high etch pit density. On the other hand, the thickness of GaN epilayer increased with the number of etch pits corresponding to edge and mixed dislocations, which are the majority of TDs are observed.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2009.05a
• /
• pp.38.1-38.1
• /
• 2009

Plasma etching is an essential process for electronic device industries and the particulate contamination during plasma etching has been interested as a big issue for the yield of productivity. The oxynitride glasses have a merit to prevent particulate contamination due to their amorphous structure and plasma etching resistance. The YSiAlON oxynitride glasses with increasing nitrogen content were manufactured. Each oxynitride glasses were fluorine-plasma etched and their plasma etching rate and surface roughness were compared with reference materials such as sapphire, alumina and quartz. The reinforcement mechanism of plasma etching resistance of the YSiAlON glasses studied by depth profiling at plasma etched surface using electron spectroscopy for chemical analysis. The plasma etching rate decreased with nitrogen content and there was no selective etching at the plasma etched surface of the oxynitride glasses. The concentration of silicon was very low due to the generation of SiF4 very volatile byproduct and the concentration of aluminum and yttrium was relatively constant. The elimination of silicon atoms during plasma etching was reduced with increasing nitrogen content because the content of the nitrogen was constant. And besides, the concentration of oxygen was very low on the plasma etched surface. From the study, the plasma etching resistance of the glasses may be improved by the generation of nitrogen related structural groups and those are proved by chemical composition analysis at plasma etched surface of the YSiAlON oxynitride glasses.

• Journal of the Korean Ceramic Society
• /
• v.36 no.8
• /
• pp.813-819
• /
• 1999

Inner crack-like pores with controlled amount of Ca impurity level in the high purity alumina single crystal sapphire had been created by micro-fabrication technique which includes ion implantation photo-lithography Ar ion milling and hot press technique. The morphological change and the healing of crack-like pore in the Ca doped high purity single crystal alumina during high temperature heat treatment in vacuum were observed using optical microscopy. The hexagonal bridging ligaments were developed and the size of hexagonal bridging ligaments had been increased with temperature and Ca amount and had grown to their corner rounded. It appeared that the hexagonal bridging ligaments would have an equilbrium size with temperature and the amount of Ca addition. Three kinds of crack-like pore healing type were observed. Edge regression and ligament growth were observed from relatively low temperature in the crack-like pore. Edge regression were found in almost all of the crack-like pore but the ligament growth were found only in the several crack-like pores accelerating heating very fast. Flow type healing was observed above $1800^{\circ}C$ and It healed the crack-like pore very slowly.

• Electrical & Electronic Materials
• /
• v.9 no.1
• /
• pp.30-37
• /
• 1996

Previously, crystallization of a-Si:H films on glass substrates were limited to anneal temperature below 600.deg. C, over 10 hours to avoid glass shrinkage. Our study indicates that the crystallization is strongly influenced by anneal temperature and weakly affected by anneal duration time. Because of the high temperature process and nonconducting substrate requirements for poly-Si TFTs, the employed substrates were limited to quartz, sapphire, and oxidized Si wafer. We report on poly-Si TFT's using high temperature anneal on a Si:H/Mo structures. The metal Mo substrate was stable enough to allow 1000.deg. C anneal. A novel TFT fabrication was achieved by using part of the Mo substrate as drain and source ohmic contact electrode. The as-grown a-Si:H TFT was compared to anneal treated poly-Si TFT'S. Defect induced trap states of TFT's were examined using the thermally stimulated current (TSC) method. In some case, the poly-Si grain boundaries were passivated by hydrogen. A-SI:H and poly-Si TFT characteristics were investigated using an inverted staggered type TFT. The poly -Si films were achieved by various anneal techniques; isothermal, RTA, and excimer laser anneal. The TFT on as grown a-Si:H exhibited a low field effect mobility, transconductance, and high gate threshold voltage. Some films were annealed at temperatures from 200 to >$1000^{\circ}C$ The TFT on poly-Si showed an improved $I_on$$I_off$ ratio of $10_6$, reduced gate threshold voltage, and increased field effect mobility by three orders. Inverter operation was examined to verify logic circuit application using the poly Si TFTs.