• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1544-1545
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• 2007

본 논문은 피에조방식으로 구동하는 MEMS 구조의 산업용 잉크젯 헤드를 제작하여 잉크를 충진하여 토출하는 과정에서 토출이 되지 않는 원인 중 하나인 기포에 대해서 연구하였다. 기포를 직접 관찰하기 위한 방법으로 투명한 유리로 Membrane을 제작하여 기포가 발생하여 거동하는 모습을 관찰하였으며 Actuator가 구동하는 헤드내 기포를 구동 중에 관찰하기 위한 방법으로 LDV(Laser Doffler Vibrometer)를 이용하였다. 그 결과, 구동하면서 발생하는 변위의 미세한 차이를 관찰할 수 있었으며 주파수 data의 차이를 관찰함으로써 기포의 크기에 따른 토출의 양태를 구별할 수 있었다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.502-502
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• 2007

Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.04a
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• pp.22-22
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• 2006

• Journal of the Korean Ceramic Society
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• v.46 no.2
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• pp.175-180
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• 2009

Multilayer ceramic capacitors (MLCCs) have continually been made smaller in size and larger in capacity in resent years. However, the end termination electrode is still thick in many MLCCs. In this study, we used small grain glass frit to embody thin film and highly densification in the end termination by improve sintering driving force with well-dispersion and rising surface energy. Pastes were fabricated using size changed glass frit, such as 0.1 ${\mu}m$, 0.5 ${\mu}m$, 1.0 ${\mu}m$, 4.0 ${\mu}m$. Fabricated pastes were applied 05A475KQ5 chip and fired various sintering temperatures to analyze sintering behavior of pastes. Consequently, small glass frit used pastes have many merits than larger, such as well-dispersion, improve cornercoverage and surface roughness, possibility of low temperature sintering. However, we confirmed that small glass frit used pastes have narrow sintering window by rapid completion of sintering densification.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.108-108
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• 2007

Inkjet printing is a non-contact and direct writing associated with a computer. In the industrial field, there have been many efforts to utilize the inkjet printing as a new way of manufacturing, especially for electronic devices. The etching resist used in this process is an organic polymer which becomes solidified when exposed to ultraviolet lights and has high viscosity of 300 cPs at ambient temperature. A piezoelectric-driven ink jet printhead is used to dispense $20-40\;{\mu}m$ diameter droplets onto the copper substrate to prevent subsequent etching. In this study, factors affecting the pattern formation such as printing resolution, jetting property, adhesion strength, etching and strip mechanism, UV pinning energy have been investigated. As a result, microscale Etch resist patterning of printed circuit board with tens of ${\mu}m$ high have been fabricated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.24-24
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• 2009

ENIG(Electroless Nickel Immersion Gold) is the surface treatment method that is used most widely at fine pitch's SMT and BGA packaging process. In this paper, we have studied the effect of P content variation during ENIG process on those phenomena related to the solder joint. The effect of P content was discussed using the results obtained from FE-SEM, EPMA, EDS and FIB. Finally, it was concluded that the more P-content in Ni layer, the thicker P-rich layer.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1702-1703
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• 2011

MEMS 소자의 Wafer level Package 관련하여 Deep cavity를 가진 Cap Wafer와 Polymer bonding 중 cavity 단차로 인한 Polymer Patterning 및 접합 불량의 어려움을 극복할 수 있는 새로운 공정 flow를 제안하였다. Cavity를 형성할 때 사용하는 Si deep etching Mask인 기존의 Photoresist를 접합용 감광성 Polymer로 대체하고, cavity 형성 후, 별도의 추가 공정 없이 이 Polymer를 이용해 Wafer bonding을 진행하였다. 이를 통해 cavity 단차에 따른 문제를 해결함과 동시에 공정이 단순하고 제작 비용이 저렴하며, 신뢰성 있는 Wafer level Package를 구현하였다.

• Proceedings of the KIPE Conference
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• 2011.07a
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• pp.308-309
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• 2011

최근 PDP와 LCD등의 FPD용(用) 전원 시스템에 고효율화, 고밀도화 및 Slim화를 위한 전원 회로 기술이 요구됨에 따라 이를 실현하기 위해서는 전원 회로를 구성하는 각 컨버터의 최적 Topology 확보뿐만 아니라, 전원 회로에 사용되는 부품들에 대한 차별화된 핵심 부품 기술 확보가 필수적이다. 이러한 요구에 부합하기 위해서 FPD용(用) 전원에 적용되는 자성부품구조도 기존의 성능을 유지하면서 박형화, 저비용화 및 자동 권선화를 구현할 수 있는 방안에 대한 연구가 필요하다. 본 논문에서는 LED-TV용 전원장치의 EMI Filter부의 개발사례 및 특히 EMI Filter부의 대책부품 중에 자동권선형 공통모드 초크의 개발동향 및 사례에 대해서 소개하고자 한다.

• JSTS:Journal of Semiconductor Technology and Science
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• v.6 no.2
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• pp.79-86
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• 2006

N-polar, Ga-polar, and non-polar GaN was grown by MBE and MOVPE using various substrates and influence of polarity has been investigated. The GaN growth by MOVPE is along cplane (0001), c-plane (0001), and a-plane (11-20) direction on c-plane (0001), a-plane (11-20) and r-plane (1-102) sapphire substrate respectively. The polarity of the film has a strong influence on the morphology and the optical properties of PA-MBE grown As-doped GaN layers. Strong blue emission from As-doped GaN was observed only in the case of N-polarity (000-1) layers, which was attributed to the highest concentration of Ga dangling bonds for this polarity of a GaN surface.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1550-1551
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• 2007

노즐 직경 $30\;{\mu}$인 MEMS 압전 잉크젯 헤드를 이용하여 Ag 나노 잉크를 PDMS 처리된 PI(Polyimide) 기판 위에 토출하였다. 구동주파수 5 KHz에서 액적부피 1.5 pl, 속도가 약 4.5 m/s인 액적이 토출 되었다. 인쇄된 액적의 크기는 직경 약 $12\;{\mu}m$이었다. 메니스커스의 거동에 맞춘 구동파형의 입력에 의해 새틀라이트 없는 매우 작은 액적을 토출할 수 있었다.