• 제목/요약/키워드: Sac3

검색결과 557건 처리시간 0.023초

GTEM 셀과 전자파 반-무반사실 사이의 상관관계 알고리즘 비교.분석 (Comparison of Correlation Algorithms between GTEM Cell and Semi-Anechoic Chamber)

  • 권종화;이애경;최형도
    • 한국전자파학회논문지
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    • 제13권2호
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    • pp.188-195
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    • 2002
  • 본 논문에서는 GTEM 셀을 이용하여 복사장을 예측하는 알고리즘 중 대표적인 두 가지 기법인 3 방위와 15방위 기법에 대해 전자파 반-무반사실에서 측정한 결과와의 상관관계를 통계적으로 검증하였다. 그리고 이론적인 다이폴 모델에 대해 이 두 가지 기법을 적용하여 접지면상의 복사장을 구하고 그 값을 이론치와 비교하였다. 두 알고리즘을 이용한 견과와 전자파 반-무반사실 측정 결과는 상관계수가 모두 0.8 이상으로 높은 상관성을 가짐을 확인할 수 있고, 기존 3 방위 기법에 의해 계산된 값은 전자파 반-무반사실 혹은 15 방위 기법보다 높게 계산됨을 이들 결과로부터 알 수 있었다.

Sn-1.7Bi-0.7Cu-0.6In 솔더의 특성 연구 (Characteristics of Sn-1.7Bi-0.7Cu-0.6In Lead-free Solder)

  • 박지호;이희열;전지헌;전주선;정재필
    • Journal of Welding and Joining
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    • 제26권5호
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    • pp.43-48
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    • 2008
  • Characteristics of Sn-1.7%Bi-0.7%Cu-0.6%In (hereafter, SBIC) lead-free solder was investigated in this study. The results from SBIC were compared to other lead-free solders such as Sn-3.5%Ag-0.7%Cu (hereafter, SAC), Sn-0.7%Cu (hereafter, SC), and lead-bearing Sn-37%Pb (hereafter, SP) alloy. Tensile properties of bulk solder, wettability, spreading index, bridge and dross were evaluated. As experimental results, tensile strength and elongation of SBIC was 62.5MPa and 21.5%, respectively. The tensile strength was comparable to that of SP solder. The wetting time of SBIC was 1.2 sec at $250^{\circ}C$, and its wetting properties including wetting force were as good as the SAC alloy. However, wettability of the SC was not so good as the SBIC and SAC. The spreading index of SBIC at $250^{\circ}C$ was 71 %, and it was similar level to those of SAC and SC solders. Bridging was not found for all solders of SBIC, SAC and SC in the range from 240 to $260^{\circ}C$. In dross test at $250^{\circ}C$ for an hour, the amount of dross produced from SBIC was about 57% compared to that from SAC.

열충격 사이클에 따른 SnAgCu 솔더별 솔더 접합부의 신뢰성 및 계면반응 (The Interfacial Reactions and Reliability of SnAgCu Solder Joints under Thermal Shock Cycles)

  • 오철민;박노창;한창운;방만수;홍원식
    • 대한금속재료학회지
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    • 제47권8호
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    • pp.500-507
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    • 2009
  • Pb-free solder has recently been used in electronics in efforts to meet environmental regulations, and a number of Pb-free solder alloy choices beyond the near-eutectic SnAgCu solder are now available. With increased demand for thin and portable electronics, the high cost of alloys containing significant amounts of silver and their poor mechanical shock performance have spurred the development of low Ag SnAgCu solder, which provides improved mechanical performance at a reasonable cost. Although low Ag SnAgCu solder exhibits significantly higher fracture resistance under high-strain rates, little thermal fatigue data exist for this solder. Therefore, it is necessary to investigate thermal fatigue reliability of low Ag SnAgCu solder under variation of thermal stress in order to allow its implementation in electronic products with high reliability requirements. In this study, the reliability of Sn0.3Ag0.7Cu(SAC0307), a low Ag solder alloy, is discussed and compared with that of Sn3Ag0.5Cu(SAC305). Three sample types and six samples size are evaluated. Mechanical properties and microstructure of the solder joint are investigated under thermal shock cycles. It was observed that the mechanical strength of SAC0307 dropped slightly with thermal cycling relative to that of SAC305. This reveals that the failure mode of SAC0307 is different from that SAC305 under this critical condition.

Silent Embolic Infarction after Neuroform Atlas Stent-Assisted Coiling of Unruptured Intracranial Aneurysms

  • Seungho Shin;Lee Hwangbo;Tae-Hong Lee;Jun Kyeung Ko
    • Journal of Korean Neurosurgical Society
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    • 제67권1호
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    • pp.42-49
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    • 2024
  • Objective : There is still controversy regarding whether neck remodeling stent affects the occurrence of silent embolic infarction (SEI) after aneurysm coiling. Thus, the aim of the present study is to investigate the incidence of SEI after stent-assisted coiling (SAC) using Neuroform Atlas Stent (NAS) and possible risk factors. This study also includes a comparison with simple coiling group during the same period to estimate the impact of NAS on the occurrence of SEI. Methods : This study included a total of 96 unruptured intracranial aneurysms in 96 patients treated with SAC using NAS. Correlations of demographic data, aneurysm characteristics, and angiographic parameters with properties of SEI were analyzed. The incidence and characteristics of SEI were investigated in 28 patients who underwent simple coiling during the same period, and the results were compared with the SAC group. Results : In the diffusion-weighted imaging obtained on the 1st day after SAC, a total of 106 SEI lesions were observed in 48 (50%) of 96 patients. Of these 48 patients, 38 (79.2%) had 1-3 lesions. Of 106 lesions, 74 (69.8%) had a diameter less than 3 mm. SEI occurred more frequently in older patients (≥60 years, p=0.013). The volume of SEI was found to be significantly increased in older age (≥60 years, p=0.032), hypertension (p=0.036), and aneurysm size ≥5 mm (p=0.047). The incidence and mean volume of SEI in the SAC group (n=96) were similar to those of the simple coiling group (n=28) during the same period. Conclusion : SEIs are common after NAS-assisted coiling. Their incidence in SAC was comparable to that in simple coiling. They occurred more frequently at an older age. Therefore, the use of NAS in the treatment of unruptured intracranial aneurysm does not seem to be associated with an increased risk of thromboembolic events if antiplatelet premedication has been performed well.

Endolymphatic Sac Tumors : Report of Four Cases

  • Bae, Chae-Wan;Cho, Young-Hyun;Chung, Jong-Woo;Kim, Chang-Jin
    • Journal of Korean Neurosurgical Society
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    • 제44권4호
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    • pp.268-272
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    • 2008
  • Endolymphatic sac tumor is rare, locally aggressive hypervascular tumor of papillary structure, arising from the endolymphatic duct or sac in the posterior petrous bone. We present four cases with this tumor. Two patients were male and the other two were female. Age of each patient was 15, 52, 58, and 67 years. Three patients presented with progressive hearing loss and sustained vertigo for months to years and another one was referred for the tumor detected in routine medical check-up. Preoperative embolization was performed in 3 patients. Complete excision of the tumor was achieved in all patients using translabyrinthine or retrosigmoid approach. Herein, we describe the clinical and radiographic features, surgical treatment and pathologic findings with a review of the literature.

ASMOD를 이용한 3차원 자유 형상 설계 (3-Dimensional Free Form Design Using an ASMOD)

  • 김현철;김수영;이창호
    • 한국지능시스템학회논문지
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    • 제8권5호
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    • pp.45-50
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    • 1998
  • 본 연구에서는 입출력 데이터로부터 비선형 다변수 모델을 자동 인식할 수 있는 적응형 Spline모델링(ASMOD : Adaptive Spline Modeling of Observation Data)과 혼합 곡선 근사법(Hybrid curve approximation)을 이용한 3차원 자유 형상 설계방법을 제안하고, 초기 선형 설계 단계에서 횡단면적 곡선(SAC : Sectional Area Curve) 생성 예를 통해 그 응용 가능성을 검토하였다. 즉 실적선의 SAC를 Bspline 근사법(Fitting methdo)과 유전자 알고리즘(Genetic Algorithm)에 의해 정의하여, 조정점(Control points)에 대한 데이터베이스를 구축한다. 구축된 데이터베이스-주요치수와 이들 조정점관의 관계-를 학습 데이터로 하여 ASMOD를 학습시킨후 , SAC결정을 위한 ASMOD 모델링을 구축한다. 다른 선형 특성 곡선들-design waterline curve, bottom tangent line, center profile line-에 대해서도 동일하게 적용하여 ASMOD를 모델링할 수 있으며, 이들 선형 특성 곡선들을 결합하여 초기 선형을 생성한다.

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ENEPIG 표면처리에서의 Sn-Ag-Cu 솔더조인트 신뢰성: 2. Pd 촉매 시간의 영향 (Reliability of Sn-Ag-Cu Solder Joint on ENEPIG Surface Finish: 2. Effects of time of Pd activation)

  • 허석환;이지혜;함석진
    • 마이크로전자및패키징학회지
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    • 제21권3호
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    • pp.51-56
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    • 2014
  • 솔더조인트의 신뢰성에는 인쇄회로기판의 표면처리 특성이 많은 영향을 미치고 있다. 본 연구에서는 ENEPIG 표면처리에서 Sn-4.0wt%Ag-0.5wt%Cu (SAC405) 솔더와 Pd 촉매 처리 시간에 따른 high speed shear 에너지 및 파괴 모드를 연구하였다. 또한 Pd 촉매 처리 시간과 무전해 Ni-P 도금의 표면 거칠기 (Ra)와의 관계를 규명하였다. Pd 촉매 처리 시간이 길어질수록 Ni-P nodule의 면적은 넓어지고, Ni-P 도금의 표면 거칠기 (Ra)는 감소한다. 이러한 영향으로 질산 기상 처리한 시편의 high speed shear 평가후 quasi-brittle과 brittle 모드의 점유율은 감소한다. 이는 Pd 촉매 처리 시간의 증가가 SAC405 솔더조인트의 신뢰도를 향상시키는 역할을 한다는 것을 나타낸다.

온주(溫州)밀감 sac의 저장중(貯藏中) 변화(變化) (Changes of Satsuma Mandarin Sacs during Storage)

  • 최영배;강동섭;강영주
    • 한국식품영양과학회지
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    • 제16권3호
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    • pp.21-25
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    • 1987
  • 온주(溫州)밀감 sac을 통조림 저장하기 위한 기초자료를 얻기 위하여 sac을 염소수에 침지하여 예비살균하고 밀봉전 살균온도가 저장중 sca에 미치는 영향을 검토하였다. sac의 당도, 산도 및 pH는 처리조건에 따라 큰 변화가 없었으나 염소처리에 의하여 sac의 파괴율은 저장초기에 증가하였으나 저장기간이 길어짐에 따라 평준화 되었다. 총 카로테노이드는 변화가 크지 않았으며, 총 비타민 C는 저장 3개월과 4개월 사이에 감소가 컸다. 환원형 비타민 C는 저장초기에, 산화형 비타민 C는 저장후기에 주로 감소하였다. 또한 비타민 C의 감소는 염소처리보다 살균온도 및 저장온도에 의해 더 큰 영향을 받은 것으로 보였다.

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Simulative Investigation of Spectral Amplitude Coding Based OCDMA System Using Quantum Logic Gate Code with NAND and Direct Detection Techniques

  • Sharma, Teena;Maddila, Ravi Kumar;Aljunid, Syed Alwee
    • Current Optics and Photonics
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    • 제3권6호
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    • pp.531-540
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    • 2019
  • Spectral Amplitude Coding Optical Code Division Multiple Access (SAC OCDMA) is an advanced technique in asynchronous environments. This paper proposes design and implementation of a novel quantum logic gate (QLG) code, with code construction algorithm generated without following any code mapping procedures for SAC system. The proposed code has a unitary matrices property with maximum overlap of one chip for various clients and no overlaps in spectra for the rest of the subscribers. Results indicate that a single algorithm produces the same length increment for codes with weight greater than two and follows the same signal to noise ratio (SNR) and bit error rate (BER) calculations for a higher number of users. This paper further examines the performance of a QLG code based SAC-OCDMA system with NAND and direct detection techniques. BER analysis was carried out for the proposed code and results were compared with existing MDW, RD and GMP codes. We demonstrate that the QLG code based system performs better in terms of cardinality, which is followed by improved BER. Numerical analysis reveals that for error free transmission (10-9), the suggested code supports approximately 170 users with code weight 4. Our results also conclude that the proposed code provides improvement in the code construction, cross-correlation and minimization of noises.

Sound Absorption of Natural Fiber Composite from Sugarcane Bagasse and Coffee Silver Skin

  • Wachara KALASEE;Putipong LAKACHAIWORAKUN;Visit EAKVANICH;Panya DANGWILAILUX
    • Journal of the Korean Wood Science and Technology
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    • 제51권6호
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    • pp.470-480
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    • 2023
  • This study aimed to develop a sound-absorbing composite using sugarcane bagasse (SB) and coffee silver skin (CS) as raw materials. The composite boards were manufactured by bonding the fibers with Melamine Urea-Formaldehyde adhesive, ensuring a consistent thickness of 30 mm. Various densities were employed, namely 380, 450, and 520 kg/m3. The samples were fabricated with different fiber ratios, including SB100%, SB75% with CS25%, and SB50% with CS50%. The sound absorption coefficient (SAC) and noise reduction coefficient (NRC) were measured using the impedance tube method within a frequency range of 63-6,300 Hz. The experimental results revealed that the mixing ratio of CS exerted a notable influence on enhancing the SAC, while the density of the composite board exhibited a significant impact on increasing both the SAC and NRC. Among the densities tested, the optimal value was observed at 520 kg/m3, yielding a SAC value of 0.65 at a frequency of 1,000 Hz and an NRC value of 0.55 for the SB50-CS50 composite plate. These findings underscore the importance of considering the CS mixing ratio and composite board density when aiming to optimize sound absorption properties.