• Educational Technology International
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• v.23 no.2
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• pp.207-237
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• 2022

As technological changes continue to accelerate every day, meeting the needs of a shifting educational landscape requires leaving an exclusively "in-person" education behind. Gamified learning environments should be carefully designed in light of conflicting studies to suit students' needs. The purpose of this meta-analysis is to draw conclusive results regarding the application of the most commonly used game elements in education, i.e., badges and leaderboards, through a comprehensive analysis of their impact on academic performance in online learning. Review Manager (RevMan 5.4) was used to analyze eligible studies selected from Emerald, SAGE, ERIC, EBSCO, and ProQuest between January 2011 and January 2022. Analyzing 37 studies found that using leaderboards and badges in online education enhanced academic performance when compared to traditional learning without gamification (SMD = 0.39). The badge-only intervention showed a larger effect size (SMD = 0.33) than the leaderboard-only intervention (SMD = 0.27). Badges and leaderboards together exhibited a larger effect size (SMD = 0.48) than individual game elements (SMD = 0.40). The impact of the game elements on academic performance was greater in the humanities (SMD = 0.51) than in STEM fields (SMD = 0.32) and was greater for K-12 students (SMD = 0.63) than for college students (SMD = 0.31). This study contributes to a timely discussion of the use of badges and leaderboards in COVID-19 online learning trends and provides relevant data for designing integrations of online education and gamification models.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.41-47
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• 2010

The effect of PCB and BGA pad designs was investigated on the mechanical property of Pb-free solder joints. The mechanical property of solder joint was tested by three different test methods of drop impact tests, bending impact test, and high speed shear test. Two kinds of pad design such as NSMD (Non-Solder Mask Defined) and SMD (Solder Mask Defined) were applied with the OSP finished Pb-free solder (Sn-3.0Ag-0.5Cu, Sn-1.2Ag-0.5Cu). in the drop impact test and bending impact test, the characterized lifetime showed the same tendency, and SMD design showed better mechanical property of solder joint than NSMD regardless of test method, which was due to the different crack path. The fracture crack on SMD pad was propagated along the intermetallic compound (IMC) layer of solder joint, while the fracture crack on NSMD pad propagated through upper edge of land which shields pattern. In the high speed shear test, pad lift occurred on the solder joint of NSMD. SMD/SMD combination of pad design consequently illustrated the best mechanical property of BGA/PCB solder joint, followed by SMD/NSMD, NSMD/SMD, and NSMD/NSMD.

• Journal of Digital Convergence
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• v.10 no.5
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• pp.283-288
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• 2012

This study was undertaken to investigation the spray characteristics of the twin fluid atomization nozzle system. The light oil was injected at the normal temperature and injection pressure was 5 bar - 10 bar by 1 bar and volume flow was 0.5, 1.0 and 2,0 mmH2O(X10-2). We measured the SMD of sprayed droplet to study spray characteristics. The following conclusions were reached from the results of these study. 1. The more injection pressure increased, the more SMD decreased. 2. The more measuring distance between pressure nozzle tip and analyser beam increased, the more SMD increased. 3. SMD of the blower-air-added injection system were shown, increasing volume flow decreased respectively. The result of this study indicated the blower-air-added injection system induced beneficial changes in SMD. And it will be considered important indicator for spray characteristics design and performance evaluation of twin fluid atomization nozzle system.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.529-532
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• 2001

A Remote Monitoring Server(RMS) server which uses Internet and World Wide Web is constructed for SMD in-line system. Hardware base consists of server computer, virtual SMD in-line system and other computers. Software includes assignment of server, RDBMS and various modules in server home page. Web browser provide production quantity, bad PCB quantity, error number and error message in virtual SMD module, user information in setup module, detailed error information in fault diagnosis module, fault history in fault history module and customer information in customer service management module. These functions of the RMS helps a decrease of non-operation time and a service response as fast as possible.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.6
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• pp.1133-1138
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• 2007

DLLs(Delay Locked Loops) have widely been used in many systems in order to achieve the clock synchronization. A SMD (Synchronous Mirror Delay) structure is used both for skew reduction and for DCC (Duty Cycle Correction). In this paper, a SMD based DLL with DCC using Reduced Delay Lines is proposed in order to reduce the clock skew and correct the duty cycle. The merged structure allows the forward delay array to be shared between the DLL and the DCC, and yields a 25% saving in the number of the required delay cells. The designed chip was fabricated using a $0.25{\mu}m$ 1-poly, 4-metal CMOS process. Measurement results showed the 3% duty cycle error when the input signal ranges from 80% to 20% and the clock frequency ranges from 400MHz to 600MHz. The locking operation needs 3 clock and duty correction requires only 5 clock cycles as feature with SMD structure.

• Journal of the Korean Institute of Telematics and Electronics B
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• v.31B no.3
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• pp.80-90
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• 1994

In this paper, a high-resolution algorithm for detecting the orientation and position of the SMD and an algorithm for compensating the position and skew angle of the PCB are proposed. The proposed algorithm for the first topic consists of two parts. Its first part is a preprocessing step. in which corner points of the SMD are detected and they are grouped. Then the coarse angle of the principal axis is obtained by line fitting. The second part is a main processing step, in which the fuzzy Hough transform over the limited range of angles is applied to the corner points to detect precisely the orientation of the SMD. The position of the SMD is determined by using its four corner points. The proposed algorithm for the second topic is the one which detects a rotation angle and translation parameters of the PCB using a template matching method. The computer simulation shows that the parametes obtained by proposed algorithms are more precise than those by the several conventional methods considered. The proposed algorithms can be applied to the fast and accurate automatic inspection systems.

• Journal of Mechanical Science and Technology
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• v.17 no.5
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• pp.766-775
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• 2003

The intermittent spray characteristics of a multi-hole diesel nozzle with a 2-spring nozzle holder were investigated experimentally. Without changing the total orifice exit area, the hole number of the multi-hole nozzle varied from 3 (d$\_$n/=0.42 mm) to 5 (d$\_$n/=0.32 mm). The time-resolved droplet diameters of the spray including the SMD (Saute. mean diameter) and the AMD (arithmetic mean diameter), injected intormittently from the multi-hole nozzles into still ambient ai., were measured by using a 2-D PDPA (phase Doppler particle analyze.). The 5-hole nozzle spray shows the smaller spray cone angle, the decreased SMD distributions and the small difference between the SMD and the AMD, compared with that of the 3-hole nozzle spray. From the SMD distributions with the radial distance, the spray structure can be classified into the three regions : (a) the inner region showing the high SMD distribution , (b) the mixing flow region where the shea. flow structure would be constructed : and (c) the outer region formed through the disintegration processes of the spray inner region and composed of fine droplets. Through the SMD distributions along the spray centerline, it reveals that the SMD decreases rapidly after showing the maximum value in the vicinity of the nozzle tip. The SMD remains the constant value near the Z/d$\_$n/=166 and 156.3 for the 3-hole and 5-hole nozzles, which illustrate that the disintegration processes of the 5-hole nozzle spray proceed more rapidly than that of the 3-hole nozzle spray.

• Journal of Institute of Control, Robotics and Systems
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• v.5 no.6
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• pp.698-704
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• 1999

There are several types of defects of SMDs mounted on PCB, that is, missing components, misalignment, wrong parts and poor solder joints. This research study mainly focuses on measuring of deviation of SMD leads using the partial image of component, not using the full image. This processing based on the partial image has the advantage of the reduction in calculation time compared to the full image. Since position of lead is calculated with respect of the reduction in calculation time compared to the full image. Since position of lead is calculated with respect to pad, the accuracy of the system is not dependent on percise positioning stage. The grabbed image of gray scale is converted into binary format using a cutomatic threshold. After small fragments in the image is removed by a series of morphology operations such as opening and closing, the centroids of PCB pads and SMD leads is obtained together with labeling of blobs. Translational shift and rotationial angle of SMD are succedingly estimated using above information and chip data. The expression that can calculate the maximum deviation of leads with respect to PCB pads has been derived, and inferior mounting of SMD is judged by a given criterion. Some experiments have been executed to verify this measuring scheme.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.04b
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• pp.6-7
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• 2008

The purpose of this study was to investigate heat resistance for union type SMD inductor core. The samples was produced with process 5 step. In this study, it analysis heat resistance of SMD(Surface Mounted Device) inductor core and it get electric field only exist inside of SMD core. Therefore electric fields do not affect any device and equipments. These results are very important to design data acquisition system(several test equipments such as temperature, impedance, and current test), because data acquisition system can place under the SMD Inductor core. So, it can be decrease their test error due to electric field.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2004.05a
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• pp.286-289
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• 2004

본 연구는 U사의 SMD Wave Soldering 공정을 최적화하기 위해 납땜에 관련된 PCB의 여러 계수형 특성들을 종합하여 계량화한 후 분석한 사례이다. SMD Wave Soldering 공정은 PCB 불량의 80% 이상을 결정하는 중요 공정으로 SMD 작업 불량으로 인한 재작업 등 각종 문제점들을 내포하고 있다. 그러나 검사 결과 미납, 냉납, 과납, 쇼트 등의 발생 건수 형태의 계수형 데이터가 집계되어 이를 체계적으로 분석하여 공정을 개선하는데 어려움이 있어 불량 유형별로 보다 세분화된 평가표를 작성하여 먼저 데이터를 계량화한 후 이를 기초로 공정 개선을 실시하였다.