• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.05b
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• pp.85-88
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• 2005

In this study, it analysis electric field of SMD(Surface Mounted Device) Inductor Core and it get electric field only exist inside of SMD core. Therefore electric fields do not affect any device and equipments. These results are very important to design data acquisition system(several test equipments such as temperature, impedance, and current test), because data acquisition system can place under the SND Inductor core. So, it can be decrease their test error due to electric field.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.43 no.4 s.310
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• pp.45-52
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• 2006

In his paper, we have developed the SMD(surface mounted device) type PECL(positive emitter-coupled logic) VCXO of the $5{\times}7mm$ size for gratifying the requested specifications and the multilayer ceramic SMD(surface mounted device) package technology. The VCXO wired with the PECL(positive emitter coupled logic) package take place a stray inductance and a parasitic capacitance by the length and the inner pattern of the VCXO and the amplitude attenuation and signal loss due to the reflection of power source and the noise component. We have developed the Zig system to analyze the precise spectrum and evaluate the performance. The basic operating voltage is the 3.3 V and have the frequency range of 120MHz-180MHz. The Q factor is over 5K and it has the low jitter characteristics of 3.5 ps and low phase noise.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.18 no.4
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• pp.15-21
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• 2004

The optical characteristics; luminous flux, correlated color temperature, and CIE -chromaticity coordinate etc., of HB LED(high brightness light emitting diode) of yellow/green/white SMD(surface mounted device) type were tested with integrating sphere photometer and monochromator, and the results were comparatively evaluated And, for the white LED, color rendering indices were considered to analyze.

• Journal of IKEEE
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• v.22 no.3
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• pp.874-877
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• 2018

Many SMDs (surface mount device) are mounted and mutually connected on a PCB (printed circuit board). System performance degrades when their transmission characteristics are bad. Pads connecting a PCB and SMDs affects PCB transmission characteristics significantly, so pad should be properly aligned to optimize impedance matching. In this paper, effects on PCB transmission characteristics are simulated by pad alignment. When frequency is relatively low, pad alignment seldom affect PCB transmission characteristics, but it affects more and more when frequency or pad size becomes larger. Therefore, pad alignment should be carefully chosen based on target frequency and pad size. Especially, the proposed edge-aligned pad is generally more advantageous over the conventional centered-aligned pad in 12~16 GHz Ku-band frequency.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.30 no.2A
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• pp.107-113
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• 2005

In this paper, we have developed the miniature ceramic PECL(positive emitter-coupled logic) VCXO of the $5{\times}7mm$ size for gratifying the requested specifications and the multilayer ceramic SMD(surface mounted device) package technology. The ceramic SMD PECL VCXO designed by the inverted Mesa type HFF is operating at the 3.3 Voltage and have the frequency range of 120MHz-180MHz. The Q factor is over 5K and it has the low jitter characteristics of 3.5 ps and low phase noise.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.04b
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• pp.6-7
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• 2008

The purpose of this study was to investigate heat resistance for union type SMD inductor core. The samples was produced with process 5 step. In this study, it analysis heat resistance of SMD(Surface Mounted Device) inductor core and it get electric field only exist inside of SMD core. Therefore electric fields do not affect any device and equipments. These results are very important to design data acquisition system(several test equipments such as temperature, impedance, and current test), because data acquisition system can place under the SMD Inductor core. So, it can be decrease their test error due to electric field.

• Journal of Institute of Control, Robotics and Systems
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• v.4 no.3
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• pp.384-391
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• 1998

When a device is mounted on the PCB, it is impossible to have zero defects due to many unpredictable problems. Among these problems, devices with bent corner leads due to mis-handling and which are not placed at a given point measured along the axis are principal problem in SMT(Surface Mounting Technology). It is obvious that given the complexity of the inspection task, the efficiency of a human inspection is questionable. Thus, new technologies for inspection of SMD(Surface Mounting Device) should be explored. An example of such technologies is the Automated Visual Inspection(AVI), wherein the vision system plays a key role to correct this problem. In implementing vision system, high-speed and high-precision are indispensable for practical purposes. In this paper, a new algorithm based on the Radon transform which uses a projection technique to inspect the FIC(Flat Integrated Circuit) device is proposed. The proposed algorithm is compared with other algorithms by measuring the position error(center and angle) and the processing time for the device image, characterized by line scan camera.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2011.10a
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• pp.115-119
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• 2011

Instead of very expensive sound record and professional measurement microphones the low cost Surface Mounted Device (SMD) microphones are proposed for practical barrier ANC system. FRF of the microphones and theirs sensitivity to the wind interferences are evaluated in semi anechoic chamber. The improvement of feedforward algorithm noise reduction index was evaluated based on measured coherence function between tested SMD and reference microphone. Test was performed at various wind speed from 1 m/s to 5 m/s.

• Journal of the Korean Institute of Telematics and Electronics B
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• v.32B no.1
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• pp.73-84
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• 1995

New morphological positioning algorithm and inspection method are presented and compared with a method by means of the Hough transform. The positioning algorithm is the process of finding the center and the rotated angle of the surface mounted device (SMD). The inspection method is capable of detecting the location of broken or bent leads. In order to obtain the center and the orientation of the SMD rapidly, the Hough transform method utilizes feature points (concave points) and is executed on a DSP board. The proposed morphological method is implemented by using the morphological skeleton subsets, and an ultimate orientation is decided by the Hit-or-Miss transform (HMT). In the inspection process, two inspection methods also are presented. The first method utilizes the morphological methods, i.e., opening and closing. It is performed before the positioning process and called an initial inspection. The second method follows the positioning process and is performed by an inspection of intersections of rulers and the lead edge (or the skeleton). It is a ruling technique which is referred to as a detailed inspection. We find the morphological approach is preciser and faster than the Hough approach by the comparison of the proposed algorithms.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.42 no.1
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• pp.23-31
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• 2005

Recently, the multimedia and high speed telecommunication systems needs a high frequency and high stability oscillator. The VCXO(voltage controlled -crystal oscillator) have continually downsized to gratify a thin and small size of the telecommunication systems. In his paper, we have developed the small ceramic PECL(positive emitter-coupled logic) VCXO of the 5×7 mm size for gratifying the requested specifications from user, and then use the multilayer ceramic SMD(surface mounted device) package technology. The ceramic SMD PECL VCXO is operating at the 3.3 Voltage and have the frequency range of 120MHz～180MHz. The Q factor is over 5K and it has the low jitter characteristics of 3.5 ps and low phase noise.