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http://dx.doi.org/10.7471/ikeee.2018.22.3.874

Effects on PCB Transmission Characteristics by SMD Pad Alignment  

Kim, Chang-Gyun (School of Electronic Engineering, Soongsil University)
Lee, Seongsoo (School of Electronic Engineering, Soongsil University)
Publication Information
Journal of IKEEE / v.22, no.3, 2018 , pp. 874-877 More about this Journal
Abstract
Many SMDs (surface mount device) are mounted and mutually connected on a PCB (printed circuit board). System performance degrades when their transmission characteristics are bad. Pads connecting a PCB and SMDs affects PCB transmission characteristics significantly, so pad should be properly aligned to optimize impedance matching. In this paper, effects on PCB transmission characteristics are simulated by pad alignment. When frequency is relatively low, pad alignment seldom affect PCB transmission characteristics, but it affects more and more when frequency or pad size becomes larger. Therefore, pad alignment should be carefully chosen based on target frequency and pad size. Especially, the proposed edge-aligned pad is generally more advantageous over the conventional centered-aligned pad in 12~16 GHz Ku-band frequency.
Keywords
Impedance Matching; Pad Shape; Surface Mount Device; Printed Circuit Board; Edge-Aligned;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
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