Study on pre-bonding according with HF pre-treatment conditions in Si wafer direct bonding (실리콘기판 직접접합에 있어서 HF 전처리 조건에 따른 초기접합에 관한 연구)
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- Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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- 1999.05a
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- pp.370-373
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- 1999