• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
• /
• pp.111-111
• /
• 2007

Further scaling the semiconductor devices down to low dozens of nanometer needs the extremely shallow depth in junction and the intentional counter-doping in the silicon gate. Conventional ion beam ion implantation has some disadvantages and limitations for the future applications. In order to solve them, therefore, plasma source ion implantation technique has been considered as a promising new method for the high throughputs at low energy and the fabrication of the ultra-shallow junctions. In this paper, we study about the effects of DC bias and base pressure as a process parameter. The diluted mixture gas (5% $PH_3/H_2$) was used as a precursor source and chamber is used for vacuum pressure conditions. After ion doping into the Si wafer(100), the samples were annealed via rapid thermal annealing, of which annealed temperature ranges above the $950^{\circ}C$. The junction depth, calculated at dose level of $1{\times}10^{18}/cm^3$, was measured by secondary ion mass spectroscopy(SIMS) and sheet resistance by contact and non-contact mode. Surface morphology of samples was analyzed by scanning electron microscopy. As a result, we could accomplish the process conditions better than in advance.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
• /
• pp.119-119
• /
• 2011

This study examined the synthesis of large area graphene and the change of its characteristics depending on the ratio of CH4/H2 by using the thermal CVD methods and performed the experiments to control the electron-hole conduction and Dirac-point of graphene by using chemical doping methods. Firstly, with regard to the characteristics of the large area graphene depending on the ratio of CH4/H2, hydrophobic characteristics of the graphene changed to hydrophilic characteristics as the ratio of CH4/H2 reduces. The angle of contact also increased to 78$^{\circ}$ from 58$^{\circ}$. According to the results of Raman spectroscopy showing the degree of defect, the ratio of I(D)/I(G) increases to 0.42% from 0.25% and the surface resistance also increased to 950 ${\Omega}$ from 750 ${\Omega}$/sq. As for the graphene synthesis at the high temperature of 1,000$^{\circ}$ by using CH4/H2 in a Cu-Foil, the possibility of graphene formation was determined as a function of the ratio of H2 included in the fixed quantity of CH4 as per specifications of every equipment. It was observed that the excessive amount of H2 prevented graphene from forming, as extra H-atoms and molecules activated the reaction to C-bond of graphene. Secondly, in the experiment for the electron-hole conduction and the Dirac-point of graphene using the chemical doping method, the shift of Dirac-point and the change in the electron-hole conduction were observed for both the N-type (PEI) and the P-type (Diazonium) dopings. The ID-VG results show that, for the N-type (PEI) doped graphene, Dirac-point shifted to the left (-voltage direction) by 90V at an hour and by 130 V at 2 hours respectively, compared to the pristine graphene. Carrier mobility was also reduced by 1,600 cm2/Vs (1 hour) and 1,100 cm2/Vs (2 hours), compared to the maximum hole mobility of the pristine graphene.

• 대한전기학회논문지:전기물성ㆍ응용부문C
• /
• 제49권3호
• /
• pp.156-156
• /
• 2000

The piezoelectric properties and the doping effect for $0.95Pb(Zr_xTi_{l-x})O_3+0.O5Pb(Mn_{1/3}Nb_{2/3})O_3$compositions were studied. Also, the heat generation and the change of electromechanical characteristics, the important problem in practical usage, were investigated under high electric field driving. As a experiment results under low electric field, the value of $k_p$ and ${\varepsilon}_{33}^T$ were maximized, but $Q_m$ was minimized $(k_p=0.57, Q_m=1550)$ in the composition of x=0.51. In order to increase the values of $Q_m$, $Nb_2O_5$ was used as a dopant. As the result of that, the grain size was suppressed and the uniformity of grain was improved. Also, the values of $k_p$ decreased, and the values of $Q_m$ increased with doping concentration of $Nb_2O_5$ . As a experiment results under high electric field driving, when vibration velocity was ower than 0.6[m/s], the temperature increase was 20[℃], and the change ratio of mechanical quality factor was less than 10[%]. So, its electromechanical characteristics was very stable. Conclusively, piezoelectric ceramic composition investigated at this paper is suitable for application to high power piezoelectric devices.

• 전자공학회논문지D
• /
• 제35D권9호
• /
• pp.54-61
• /
• 1998

Deep submicron급 CMOS디바이스에서 래치업 면역특성을 향상시키기 위한 새로운 Triple well구조를 제안하였다. Triple well에서 이온주입 에너지와 도즈량 변화에 따른 최적인 래치업 면역을 위한 공정조건을 확립하고 이것을 기존의 Twin well구조와 비교분석하였다. 공정은 공정시뮬레이터인 ATHENA로 소자를 제작하여 도핑프로파일과 구조를 해석하고 래치업 특성은 소자시뮬레이터인 ATLAS를 사용하였다. Triple well과 Twin well의 구조에서 공정상의 차이가 도핑프로파일에 미치는 영향과 프로파일 형태가 래치업 특성에 미치는 영향을 규명하였다. Triple well구조에서 p-well이온주입에너지 2.5MeV, 도즈량 1×10/sup 14/[cm/sup -2/]일 때 트리거 전류가 2.5[mA/${\mu}{m}$]로 매우 큰 래치업 면역특성을 얻었다.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2009년도 하계학술대회 논문집
• /
• pp.374-374
• /
• 2009

We have fabricated pure YBCO films and $BaZrO_3$ doped ones on $CeO_2$ buffered YSZ single crystal substrates using rf-sputtering method. In this work, pure YBCO and 2 vol% BZO doped YBCO target were used to investigate the flux pinning properties of BZO doped YBCO films compared to undoped ones. BZO nanodots within the superconducting materials was known to comprise the self-assembled columnar defects along the c-axis from the bottom of YBCO films up to the top surface, thus can be a very strong pinning sites in the applied magnetic field parallel to them. We will discuss the possibility of growing self-assembled columnar defects in the rf-sputtering method. It is speculated that BZO and YBCO phases can separate and BZO form nanodots surrounded by YBCO epitaxial layers and continuous phase separation and ordering between these two materials, which was well studied in Pulsed Laser Deposition method. For this purpose, some severe experimental conditions such as on-axis sputtering, shorter target-substrate distance, high rf-power, etc was adopted and their results will be presented.

• Transactions on Electrical and Electronic Materials
• /
• 제12권2호
• /
• pp.64-67
• /
• 2011

The effect of Ta substitution on the crystal structure, ferroelectric, and piezoelectric properties of $Bi_{0.5}(Na_{0.82}K_{0.18})_{0.5}Ti_{1-x}Ta_xO_3$ ceramics has been investigated. The Ta doping resulted in a transition from coexistence of ferroelectric tetragonal and rhombohedral phases to an electrostrictive pseudocubic phase, leading to degradations of the remnant polarization, coercive field, and piezoelectric coefficient $d_{33}$. However, the electricfield-induced strain was significantly enhanced by the Ta substitution-induced phase transition and reached a highest value of $S_{max}/E_{max}$ = 566 pm/V under an applied electric field 6 kV/mm when 2% Ta was substituted on Ti sites. The abnormal enhancement in strain was attributed to the pseudocubic phase with high electrostrictive constants.

• 전자공학회논문지D
• /
• 제35D권8호
• /
• pp.8-14
• /
• 1998

A new process is developed to improve the electrical characteristics of high .beta. and low saturation voltage power transistor for lamp solenoid driver application. To prevent punch-through breakdown, appropriate combination of base doping and base width is necessary in the range of operating voltage of the circuit. The optimum values of base doping and sheet resistance are $Q_{D}$= $1.5{\times}10^{14}$atoms/$\textrm{cm}^2$ and $R_{s}$= 350 $\Omega/\square$ base wodtj $W_{B}$= $2.5{\mu}m$respectively. Under this condition it is possible to control $\beta$ of the transistor to 1500, maintaining $VB_{CBO}$ =200V. To reduce scattered distribution of .beta. of the devices on the wafer, it is necessary to improve emittter predeposition process. As a result, scattered distribution of .beta. of the devices on the wafer was reduced to 1/6 by using the new process. To improve collector to emitter forward voltage drop, $V_{ECF}$ of damper diode, an additional silicon etching process is used, which resulted in improving the value of $V_{eCF}$ from 2.8 V to 1.8V. With the suggested process superior device performance and higher yield are achieved.

• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2001년도 춘계학술발표회 초록집
• /
• pp.13-13
• /
• 2001

현재 초고속 가공 공구의 국내 시장은 150억원이며 향후 3년 내에 1500억원으로 급성 장활 전망이다. 무윤활 초고속 가공을 실현하기 위해서는 윤활특성이 우수한 초고경도 코팅의 개발이 필요하며 이를 통해 기계설비의 수명향상과 폐유문제 해결을 기대할 수 있다. 기존의 고체윤활 코팅은 초고경도 코팅의 상부에 $MoS_2$, Graphite 등 윤활성 박막을 합성하였으나, 이들은 Hexagonal 구조의 연질 박막이며 수분이 존재하는 대기중에서는 윤활 및 내마모 특성이 급격히 저하된다. 환경친화 대체소재 개발의 일원으로 TiN, ZrN 박막 등이 이미 개발되었고 기계적 특성이 우수하여 널리 응용되고 있으나 아직 경도(약 20GPa 내외) 및 윤활성의 한계 (마찰계수 $\mu=O.6$)를 극복하지 못하고 있다. TiN박막 위의 Cu의 첨가는 TiN의 구조와 성질을 크게 변화시키는 것으로 알려져 있다. 따라서 본 연구에서는 TiN 기지 위에 Cu를 도핑함으로써 경도의 상승을 통환 내구력의 향상과 마찰계수의 감소를 통한 윤활성의 향상을 보고자하였다. TiN합성의 안정화를 위하여 magnetron sputtering과 arc ion pIatingd을 병용한 hybrid 공정을 이용하였다. Cu첨가에 따른 결정 성장 거동의 변화를 보기 위해 XRD 분석을 실행하였고, EDS 분석을 통해 Cu target 전류밀도에 의한 기지내의 Cu의 함량변화를 고찰하였으며, 경도 및 윤활특성을 고찰하기 위해서 경도 시험과 마모 시험(ball-on disc type test)를 하였다.

• 한국세라믹학회지
• /
• 제40권8호
• /
• pp.725-729
• /
• 2003

The fluorine doping along with heavy metal oxides remarkably raised the $^3$H$_4$ lifetime and the quantum efficiency in Tm$^{3+}$-doped silicate glasses. 29 mol% of fluorine substitution for oxygen in 70SiO$_2$-15Pbo-12ZnO-3KO$_{1}$2/ glass raised $^3$H$_4$ lifetime to 193 $mutextrm{s}$. Refractive indices were raised by heavy metal oxide substitution, but hardly changed by fluorine substitution. The fluorine doping changed the local structure around Tm$^{3+}$ions, then low energy vibrations related to fluorine are considered to largely reduce the multi-phonon relaxation rates in the oxyfluoride silicate glasses. The $^3$H$_4$ lifetimes and absorption and emission spectra of Tm$^{3+}$doped silicate and oxyfluoride silicate glasses are reported, and Judd-Ofelt calculation results are discussed in this paper.

• 한국정보통신학회:학술대회논문집
• /
• 한국해양정보통신학회 2000년도 춘계종합학술대회
• /
• pp.470-473
• /
• 2000

지난 10여 년 동안 MOSFET는 전력감소, 도핑농도 증가, 캐리어 속도 증가를 위해서 많은 변화를 가져왔다. 이러한 변화를 받아들이기 위해서, 채널의 길이와 공급되어지는 전압이 감소해야만했으며, 그것으로 인해 소자가 더욱 작아지게 되었다. 그러므로 본 논문은 이러한 변화를 위해 채널의 길이와 전압에 의한 MOSFET 구조에서의 변화를 관찰하고, 드레인과 게이트 사이에서의 임팩트 이온화의 변화를 관찰하였다. 본 논문은 세 가지의 모델 즉, conventional MOSFET와 LDD(lightly doped drain) MOSFET, EPI MOSFET을 제시하였다. 게이트 길이는 0.15um, 0.075um을 사용하였고, 스케일링계수는 λ = 2를 사용하였다 스케일링방법은 Constant-Voltage 스케일링으로 하였고, TCAD를 사용하여, 스케일링에 의한 MOSFET의 특성과 임팩트 이온화, 전계를 비교 분석하였으며, 최적의 채널과 도필 농도에 대하여 분석하였다.