• 제목/요약/키워드: Residual silicon

검색결과 170건 처리시간 0.023초

Silicon-on-insulator(SOI) 기판이 3C-SiC/Si 박막 내의 잔류응력에 미치는 영향 (Effects of silicon-on-insulator(SOI) substrates on the residual stress within 3C-SiC/Si thin films)

  • 박주훈;이병택;장성주;송호준;김영만;문찬기
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
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    • pp.151-151
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    • 2003
  • 열화학기상증착법(Thermal-CVD)을 이용하여 SOI(snilicon-on-insulator)기판과 실리콘기판 상에 단결정 3C-SiC 이종박막을 동시에 성장하고, 그 특성을 비교 분석하였다. 결정성 평가로는 X-선 회절(XRD)분석과 Raman 산란 분광분석, 그리고 투과전자현미경을 이용하였고, 잔류 웅력 비교 분석으로는 laser scanning 방법 과 Raman 산란 분광분석의 3C-SiC LO peak의 위치변화, 그리고 X-선 회절분석의 3C-SiC(004) peak의 위치변화를 이용하였다. 그 결과 SOI 기판과 실리콘 기판상에 고품위의 단결정 3C-SiC 박막이 성장됨을 확인하였고, SOI 기판을 사용한 경우 실리콘 기판에 비해 성장된 3C-SiC 이종박막의 잔류 응력이 실제로 감소됨을 확인하였다.

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반응소결법에 의한 SiC/SiC 복합재료의 제조 (Fabrication of SiC/SiC Composites by Reaction Sintering Process)

  • 이상필;윤한기
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 추계학술대회논문집A
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    • pp.27-31
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    • 2001
  • Hi-Nicalon SiC fiber reinforced SiC composites (SiC/SiC) have been fabricated by the reaction sintering process. Braided Hi-Nicalon SiC fiber with double interphases of BN and SiC was used in this composite system. The microstructures and the mechanical properties of reaction sintered SiC/SiC composites were investigated through means of electron microscopies (SEM, TEM, EDS) and bending tests. The matrix morphology of reaction sintered SiC/SiC composites was composed of the SiC phases that the composition of the silicon and the carbon is different. The TEM analysis showed that the residual silicon and the unreacted carbon were finely distributed in the matrix region of reaction sintered SiC/SiC composites. Reaction sintered SiC/SiC composites also represented proper flexural strength and fracture energy, accompanying the noncatastrophic failure behavior.

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비정질 실리콘을 이용한 미세 피치 적외선 이미지 센서 제조 및 특성 (Fabrication and characterization of fine pitch IR image sensor using a-Si)

  • 김경민;김병일;김희연;장원수;김태현;강태영
    • 센서학회지
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    • 제19권2호
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    • pp.130-136
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    • 2010
  • The microbolometer array sensor with fine pitch pixel array has been implemented to the released amorphous silicon layer supported by two contact pads. For the design of focal plane mirror with geometrical flatness, the simple beam test structures were fabricated and characterized. As the beam length decreased, the effect of beam width on the bending was minimized, Mirror deformation of focal plane in a real pixel showed downward curvature by residual stress of a-Si and Ti layer. The mirror tilting was caused by the mis-align effect of contact pad and confirmed by FEA simulation results. The properties of bolometer have been measured as such that the NETD 145 mK, the TCR -2 %/K, and thermal time constant 1.99 ms.

오존과 초음파를 이용한 실리콘 웨이퍼의 Post Sliced Cleaning (Post Sliced Cleaning of Silicon Wafers using Ozone and Ultrasound)

  • 최은석;배소익
    • 한국재료학회지
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    • 제16권2호
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    • pp.75-79
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    • 2006
  • The effect of ozone and/or ultrasound treatments on the efficiency of slurry removal in post sliced cleaning (PSC) of silicon ingot was studied. Efficiency of slurry removal was evaluated as functions of time, temperature and surfactant with DOE (Design of Experiment) method. Residual slurries were observed on the wafer surface in case of cleaning by ozone or ultrasound separately. However, a clean wafer surface was appeared when cleaned with ozone and ultrasound simultaneously. It has found that cleaning time was the main effect among temperature, time and surfactant. Elevated temperature, addition of surfactant and high ozone concentration helped to accelerate efficient removal of slurry. The improvement of removal efficiency seems to be related to the formation of more active OH radicals. The highly cleaned surface was achieved at 10 wt% ozone, 1 min and 10 vol% surfactant with ultrasound. Application of ozone and ultrasound might be a useful method for PSC process in wafer cleaning.

p+ Si 외팔보 구조를 이용한 광학 소자용 마이크로 구동기 (Fabrication of a Micro actuator with p+ Si cantilevers for Optical Devices)

  • 박태규;양상식
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2000년도 하계학술대회 논문집 C
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    • pp.2236-2238
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    • 2000
  • The paper represents the fabrication of an electrostatic micro actuator for optical devices. The micro actuator consists of a plate suspended four p+ silicon cantilevers and an electrode on a glass substrate. The cantilever curls down because of the residual stress gradient in p+ silicon. When input voltage is applied between the p+ cantilevers and the electrode. the cantilevers are pulled toward the electrode by the electrostatic force. The displacement of the plate is measured with a laser displacement meter for various input voltage and frequencies.

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실험적 방법에 의한 파인세라믹스의 연삭성에 관한 연구 (A study on the Grindability of Fine Ceramics by Experimental Method)

  • 김성겸
    • 반도체디스플레이기술학회지
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    • 제10권3호
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    • pp.35-42
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    • 2011
  • This paper describes the characteristics of high speed grinding and the influence of wheel surface speed V and a grindability of the grinding materials. The various fine ceramics pieces was ground by metal and vitrified bonded diamond wheel. The surface roughness of fine ceramics(Zirconia($ZrO_2$), Silicon Carbide(SiC), Silicon Nitride($Si_3N_4$), Alumina($Al_2O_3$)) decreases from $0.05{\mu}m(R_{max})$ to $0.025{\mu}m(R_{max})$ when the wheel speed at grinding point increases the wheel speed. Relation between the temperature at grinding point and surface roughness was linear. Abrasive jet machining(AJM), a specialized from of shot blasting, is considered one of the most helpful micro machining methods for hard and brittle materials such as glasses and ceramics by constant pressure grinding.

반응소결에 의한 $SiC/MoSi_2$ 복합체의 특성 (Properties of $SiC/MoSi_2$ Composites Prepared by Reaction Sintering Method)

  • 한인섭;양준환;서동수
    • 한국세라믹학회지
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    • 제31권4호
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    • pp.399-406
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    • 1994
  • The SiC/MoSi2 composite material was prepared by infiltration with the mixture of metal Si and MoSi2 into the preform of $\alpha$-SiC and graphite under the vacuum atmosphere of 10-1 torr. The mechanical properties, phases and microstructural characteristics have been investigated by employing an universal testing machine, scanning electron microscope and X-ray diffractometer. With the increase of MoSi2/Si mixing content, the quantity of the residual silicon phase was decreased and the hardness and fracture toughness of composite materials were increased. Also, as the infiltration temperature increased, a lot of fine-grained $\beta$-SiC phases, which were produced from the reaction of graphite and liquid silicon melt, were transformed to $\alpha$-SiC phases.

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Free vibration analysis Silicon nanowires surrounded by elastic matrix by nonlocal finite element method

  • Uzun, Busra;Civalek, Omer
    • Advances in nano research
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    • 제7권2호
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    • pp.99-108
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    • 2019
  • Higher-order theories are very important to investigate the mechanical properties and behaviors of nanoscale structures. In this study, a free vibration behavior of SiNW resting on elastic foundation is investigated via Eringen's nonlocal elasticity theory. Silicon Nanowire (SiNW) is modeled as simply supported both ends and clamped-free Euler-Bernoulli beam. Pasternak two-parameter elastic foundation model is used as foundation. Finite element formulation is obtained nonlocal Euler-Bernoulli beam theory. First, shape function of the Euler-Bernoulli beam is gained and then Galerkin weighted residual method is applied to the governing equations to obtain the stiffness and mass matrices including the foundation parameters and small scale parameter. Frequency values of SiNW is examined according to foundation and small scale parameters and the results are given by tables and graphs. The effects of small scale parameter, boundary conditions, foundation parameters on frequencies are investigated.

Optimization of Binder Burnout for Reaction Bonded Si3N4 Substrate Fabrication by Tape Casting Method

  • Park, Ji Sook;Lee, Hwa Jun;Ryu, Sung Soo;Lee, Sung Min;Hwang, Hae Jin;Han, Yoon Soo
    • 한국세라믹학회지
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    • 제52권6호
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    • pp.435-440
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    • 2015
  • It is a challenge from an industrial point of view to fabricate silicon nitride substrates with high thermal conductivity and good mechanical properties for power devices from high-purity Si scrap powder by means of thick film processes such as tape casting. We characterize the residual carbon and oxygen content after the binder burnout followed by nitridation as a function of the temperature in the temperature range of $300^{\circ}C-700^{\circ}C$ and the atmosphere in a green tape sample which consists of high-purity Si powder and polymer binders such as polyvinyl butyral and dioctyl phthalate. The optimum condition of binder burnout is suggested in terms of the binder removal temperature and atmosphere. If considering nitridation, the burnout of the organic binder in air compared to that in a nitrogen atmosphere could offer an advantage when fabricating reaction-bonded $Si_3N_4$ substrates for power devices to enable low carbon and oxygen contents in green tape samples.

탄화규소에 구형입자의 정적압입 및 충격시 부하속도의 영향 (Loading Rate Effects During Static Indentation and Impact on Silicon Carbide with Small Sphere)

  • 신형섭
    • 대한기계학회논문집A
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    • 제20권12호
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    • pp.3847-3855
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    • 1996
  • In order to study the relationship between static and cynamic behaviors of silion caride, both quasi-static indentaiton and impact experiments of spherical particle have been conducted. The difference inmaterial behavior when using the two mehtods suggests a loading rate difference in the damate pattrern and fracture strength of silicon carbide. This investigation showed some difference in damage pattern according to particla property, especially inthe case of particle impact. There was no differences in deformation behaviors according to the loading rate when the crater profiles were compared with each other at the same contact radius. From the result of residual strength evaluation, it was found that the strength degradation began at the initiation of ring crack and its behavior was colsely related to morphologies of the damage developed which was also dependent upon the extent of deformation atthe loaidng point. In the case of static indentation, there didnot exist the particle property effects onthe strength degradation behavior.