• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1998.11a
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• pp.75-76
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• 1998

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2004.05a
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• pp.70-73
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• 2004

The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics (Al$_2$O$_3$-SiO$_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a Cu/Al$_2$O$_3$-SiO$_2$ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.

• Journal of the Korean Ceramic Society
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• v.40 no.8
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• pp.720-724
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• 2003

Aluminum nitride (AlN) powders were synthesized by using a mixture of an aluminum nitrate or sulfate salt and carbon (mole ratio of $Al^{3+}$ to carbon=L : 30). The AlN was obtained by calcining the mixture under a flow of nitrogen in the temperature range 1100-1$600^{\circ}C$ and then burning out the residual carbon. The process of conversion of the salt to AlN was monitored by XRD and $^{27}$ Al magic-angle spinning (MAS) NMR spectroscopy. The salt decomposed to ${\gamma}$-alumina and then converted to AlN without phase transition from ${\gamma}$-to-$\alpha$-alumina. $^{27}$ Al MAS NMR spectroscopy shows that the formation of AlN commenced at 110$0^{\circ}C$. AlN powders obtained from the sulfate salt were superior to those from the nitrate salt in terms of homogeneity and crystallinity. A very small amount of AlN whiskers was obtained by calcining a mixture of an aluminum sulfate salt and carbon at 115$0^{\circ}C$ for 40 h, and the growth of the whiskers is well explained by the particle-to-particle self-assembly mechanism.

• Korean Journal of Materials Research
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• v.31 no.2
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• pp.97-100
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• 2021

We report the effect of Standard Clean-1 (SC-1) cleaning to remove residual Ti layers after silicidation to prevent Al diffusion into Si wafer for Ti Schottky barrier diodes (Ti-SBD). Regardless of SC-1 cleaning, the presence of oxygen atoms is confirmed by Auger electron spectroscopy (AES) depth profile analysis between Al and Ti-silicide layers. Al atoms at the interface of Ti-silicide and Si wafer are detected, when the SC-1 cleaning is not conducted after rapid thermal annealing. On the other hand, Al atoms are not found at the interface of Ti-SBD after executing SC-1 cleaning. Al diffusion into the interface between Ti-silicide and Si wafer may be caused by thermal stress at the Ti-silicide layer. The difference of the thermal expansion coefficients of Ti and Ti-silicide gives rise to thermal stress at the interface during the Al layer deposition and sintering processes. Although a longer sintering time is conducted for Ti-SBD, the Al atoms do not diffuse into the surface of the Si wafer. Therefore, the removal of the Ti layer by the SC-1 cleaning can prevent Al diffusion for Ti-SBD.

• Journal of Sensor Science and Technology
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• v.16 no.6
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• pp.462-466
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• 2007

Aluminum nitride (AlN) thin films were deposited on Si substrates by using polycrystalline (poly) 3C-SiC buffer layers, in which the AlN film was grown by pulsed reactive magnetron sputtering. Characteristics of grown AlN films were investigated experimentally by means of FE-SEM, X-ray diffraction, and FT-IR, respectively. The columnar structure of AlN thin films was observed by FE-SEM. X-ray diffraction pattern proved that the grown AlN film on 3C-SiC layers had highly (002) orientation with low value of FWHM (${\Theta}=1.3^{\circ}$) in the rocking curve around (002) reflections. These results were shown that almost free residual stress existed in the grown AlN film on 3C-SiC buffer layers from the infrared absorbance spectrum. Therefore, the presented results showed that AlN thin films grown on 3C-SiC buffer layers can be used for various piezoelectric fields and M/NEMS applications.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.05a
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• pp.97-100
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• 2002

In this research, the impact behavior of the boundary between MMC-reinforced SiC whisker and Al alloy were studied. It is known that the resultant of the interfacial reaction between SiC whisker and Al alloy has brittle and low toughness property. In this paper, impact behavior of graded MMC & Al alloy shows the interfacial opening at the boundary. Generally this phenomenon is generated by thermal residual stress, brittle interfacial reaction resultant and difference of the deflection. So, these results may be interpreted as a macroscopic method of measuring the interfacial strength between matrix and reinforcement

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.7
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• pp.517-521
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• 1998

After etching Al-Cu alloy films using $SiCl_4/Cl_2/He/CHF_3$ plasma, a corrosion phenomenon on the metal surface has been studied with XPS(X-ray pheotoelectron spectroscopy) and SEM (Scanning electron microscopy). In Al-Cu alloy system, the corrosion occurs rapidly on the etched surface by residual chlorine atoms. To prevent the corrosion, $CHF_3$ plasma treatment subsequent to the etch has been carried put. A passivation layer is formed by fluorine-related compounds on the etched Al-Cu surface after $CHF_3$ treatment, and the layer suppresses effectively the corrosion on the surface as the $CHF_3$treatment in the pressure of 300m Torr.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.06a
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• pp.383-386
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• 1998

After etching Al-Cu alloy films using SiC1$_4$/Cl$_2$/He/CHF$_3$ plasma, a corrosion phenomenon on the metal surface has been studied with XPS (X-ray photoelectron spectroscopy) and SEM (Scanning electron microscopy). In Al-Cu alloy system, the corrosion occurs rapidly on the etched surface by residual chlorine atoms. To prevent the corrosion, CHF$_3$ plasma treatment subsequent to the etched has been carried out. A passivation layer is formed by fluorine-related compounds on the etched Al-Cu surface after CHF$_3$ and SF$_{6}$ treatment, and the layer supresses effectively the corrosion on the surface as the CHF$_3$ and SF$_{6}$ treatment pressure increases. The corrosion could be suppressed successfully with CHF$_3$ and SF6 treatment in the pressure of 300mTorr.orr.

• Earthquakes and Structures
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• v.2 no.3
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• pp.233-256
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• 2011

This paper investigates the applicability of newly developed Cu-Al-Mn shape memory alloy (SMA) bars to retrofitting of historical masonry constructions by performing quasi-static tests of half-scale brick walls subjected to cyclic out-of-plane flexure. Problems associated with conventional steel reinforcing bars lie in pinching, or degradation of stiffness and strength under cyclic loading, and in their inability to restrain residual deformations in structures during and after intense earthquakes. This paper attempts to resolve the problems by applying newly developed Cu-Al-Mn SMA bars, characterized by large recovery strain, low material cost, and high machinability, as partial replacements for steel bars. Three types of brick wall specimens, unreinforced, steel reinforced, and SMA reinforced specimens are prepared. The specimens are subjected to quasi-static cyclic loading up to rotation angle enough to cause yielding of reinforcing bars. Corresponding nonlinear finite element models are developed to simulate the experimental observations. It was found from the experimental and numerical results that both the steel reinforced and SMA reinforced specimens showed substantial increment in strength and ductility as compared to the unreinforced specimen. The steel reinforced specimen showed pinching and significant residual elongation in reinforcing bars while the SMA reinforced specimen did not. Both the experimental and numerical observations demonstrate the superiority of Cu-Al-Mn SMA bars to conventional steel reinforcing bars in retrofitting historical masonry constructions.

• Korean Journal of Materials Research
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• v.15 no.3
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• pp.166-171
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• 2005

Fe-6Al-9Si(N) alloy powders were synthesized by hybrid process of chemical nitrification and mechanical milling. The nitriding treatment on Fe-6Al-9Si alloy powders formed $\gamma'-Fe_4N$ phase on the powders surface. The nitriding-treated powders were pulverized by horizontal high-energy ball milling machine. The longer ball milling time tended to reduce the size of alloy powders. In ball milling for 36h, extremely fine powders with about $7\~9wt\%$ nitrogen were obtained. Through X-ray diffraction analysis on the powders, it was found out that the longer milling time caused a disappearance of the crystallinity of $\alpha-Fe$ in the powders. TEM study confirmed that the powders is comprised of a few tens nano-meter sized crystals, including $\alpha-Fe$ phase with partially $\gamma'-Fe_4N$ phase. Hysteresis curves of the synthesized powders measured by VSM revealed lower saturation magnetization and higher coercivity, which seemed to be attributed to nitrogen-impregnation and severe residual stress developed during the high energy milling. Microstructure observation on the powder annealed at 873 K for 1 h showed 10 to 20 nm sized $\alpha-Fe$ crystal. Such a enhanced crystallinity significantly increased the magnetization and decreased the coercivity, which was attributed to not only the crystallinity but also residual stress relaxation.