• Steel and Composite Structures
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• 제15권2호
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• pp.151-162
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• 2013

In this study, an electrolyzing device for the production of metal powders was designed and fabricated. The production of copper powders was performed using a variety of current densities, anode-cathode distances and power removal times. The effect of these parameters on powder particle size and shape was determined. Particle size was measured using a laser diffraction unit while the powder shape was determined by SEM. Experimental results show that an increase in current density leads to a decrease in powder particle size. In addition particle shape changed from globular dendritic to acicular dendritic with increasing the current density. Distance between the cathode and anode also showed a similar influence on powder particle size and shape. An increase in time of powder removal led to an increase in powder particle size, as the shape changed from acicular dendritic to globular dendritic.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.950-955
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• 2001

For the development of an ultra-precision CNC polishing system including on-machine measurement system, we study a corrective polishing algorithm. We analyze and test the unit removal profiles for a ball type polishing tool. Using these results we calculate dwell time distributions and residual errors for a target removal shape. We use the polishing simulation method and feed rate calculation method for the dwell time calculation. We test corrective polishing algorithm with an optical glass. The target removal shape is a sine wave that has amplitude 0.3 micro meters. We find this polishing process has a machining resolution of nanometer order and is effective for sub-micrometer order machining. This result will be used for the software development of the CNC polishing system.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 추계학술대회논문집A
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• pp.486-491
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• 2000

In this study, finite elements addition and removal method by stress range is applied to optimize shapes in structures, without using classical and numerical optimization methods and search methods. The program based on this algorithm is developed and compared to theoritial results with considerable accuracy. Classical methods need mesh generation for finite element analysis for every iteration, the developed method needs updated mesh data such as coordinates of nodes, elements connectivity, and loads on nodes. And other tools of finite element analysis can be in use as a black box to interface with this program.

• 한국정밀공학회지
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• 제20권1호
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• pp.85-90
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• 2003

Removal rate and Within Wafer Non-Uniformity (WIWNU), the most critical issues in Chemical Mechanical Polish (CMP) process, are related to the pressure distribution, wafer shape, slurry flow, mechanical property of pad and etc. Among them, wafer warp generated by other various manufacturing process of wafer may induce the deviation of pressure distribution on the backside of wafer. In the convex shaped wafer the pressure onto the backside of wafer is higher than that of perfectly flat shaped wafer. Besides, such an added pressure is in proportion to the curvature of wafer. That is, the bigger the curvature of wafer becomes the higher the removal rate goes. And the WIWNU is known to be directly related to the pressure distribution on the wafer as well. In other words, the deviation of pressure distribution is in proportion to the WIWNU. In this paper, it is found that the wafer shape may be modified through heating the backside of it and thus properly changed pressure onto the backside of it may improve the WIWNU.

• 한국환경보건학회지
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• 제27권3호
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• pp.27-34
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• 2001

This paper discussed the shape effect of ceramic support carrier in order to facilitate biomass immobilization. The shape of ceramic support carrier was modified hollow pipe type into hollow gear type. After seeding, microorganisms were attached in crevices where protection from shear forces or surfaces where easy to contact with support carrier surface. In case of hollow gear type carrier, initial attachment rate was faster than that of hollow pipe type and obtained thick biofilm. Synthetic wastewater(COD:75~880 mg/L, organic loading rate:0.36~4.22 kgCOD/㎥.d) was treated aerobic fixed bed biofilm reactor where 100% of the volume was filled with the ceramic carrier. COD removal efficiency of reactor filled with gear type support carrier was a little high withing 70 days, and then showed similar removal efficiency. It was found that highly loaded operation with up to 4.22 kgCOD/㎥.d was possible in both reactor. Total biomass amounts of pipe type was higher than gear type, however, attached biomass of gear type was higher than that of pipe type.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.359-361
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• 2006

As circuits become increasingly complex and devices sizes shrinks, the demands placed on global planarization of higher level. Chemical Mechanical Polishing (CMP) is an indispensable manufacturing process used to achieve global planarity. In the CMP process, Diamond Disk (DD) plays an important role in the maintenance of removal rate. According to studies, the cause of removal rate decrease in the early or end stage of diamond disk lifetime comes from pad surface change. We also presented pad cutting rate (PCR) as a useful cutting ability index of DD and studied PCR trend about variable parameters that including size, hardness, shape of DD and RPM, pressure of conditioner It has been shown that PCR control ability of pressure and shape is superior to RPM and size. High pressure leads to a decrease of cell open ratio of pad surface because polyurethane of pad is destroyed by pressure. So low pressure high RPM condition is a proper removal rate sustain. By examining correlations between RPM and pressure of conditioner, it has been shown that PCR safe zoneto satisfy proper removal rate has the range 0.06mm/hr to 0.12mm/hr.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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• pp.917-921
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• 2002

In this paper, we made different types of non-thermal plasma reactors such as Metal-particle reactor with $Al_2O_3$ to measure NOx removal characteristic and the dielectric effect for NOx removal. NOx removal rate is not so good when we use just dielectric of $Al_2O_3$ at the Metal-particle reactor, also we just put sludge pellets(100%) without Metal-particle reactor with $Al_2O_3$ and dielectric such as $TiO_2$, $BaTiO_3$ to measure the effect of sludge for NOx removal so that NOx removal rate is almost the same. However NOx removal rate is more than 90% in case of the reactor of composition shape used both dielectric of $Al_2O_3$ and sludge pellets at the same time. In case of the shape of plasma reactor with dielectric, the Metal-particle reactor with $Al_2O_3$, and the metal-particle reactor with both $Al_2O_3$ and dielectric such as $TiO_2$, $BaTiO_3$ at the same time, they are almost the same effect for NOx removal, so we made MNPR(Metal-particle Non-thermal Plasma Reactor with $Al_2O_3$) to reduce these kinds of demerits. Finally, we think MNPR should be much better than other reactors for NOx removal.

• Tribology and Lubricants
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• 제32권4호
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• pp.119-124
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• 2016

In the sapphire wafering process, lapping is a crucial operation in order to reduce the damaged layer and achieve the target thickness. Many parameters, such as pressure, velocity, abrasive, slurry and plate, affect lapping characteristics. This paper presents an experimental investigation on the effect of the plate groove on the material removal rate and roughness of the wafer. We select the spiral pattern and rectangular type as the groove shapes. We vary the groove density by controlling the groove shape dimension, i.e., the groove width and pitch. As the groove density increases to 0.4, the material removal rate increases and gradually reaches a saturation point. When the groove density is low, the pressing load is mostly supported by the thick film, and only a small amount acts on the abrasives resulting to a low material removal rate. The roughness decreases on increasing the groove density up to 0.3 because thick film makes partial participations of large abrasives which make deep scratches. From these results, we could conclude that the groove affects the contact condition between the wafer and plate. At the same groove density, the pitch has more influence on reducing the film thickness than the groove width. By decreasing the groove density with a smaller pitch and larger groove width, we could achieve a high material removal rate and low roughness. These results would be helpful in understanding the groove effects and determining the appropriate groove design.

• 한국정밀공학회지
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• 제19권1호
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• pp.99-106
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• 2002

For the development of a ultra-precision CNC polishing system including on-machine measurement system, we study a corrective polishing algorithm. We calculated unit removal profiles for various flat type polishing tools and polishing tool positions. Using these results we simulate the corrective polishing process based on dwell time control. We calculate dwell time distributions and residual error of the polishing simulation method and the FFT calculation method. We test corrective polishing algorithm with an optical glass. The target removal shape is a sine wave that has amplitude 0.3 micro meters. We find this polishing process has a machining resolution of nanometer order and is effective for sub-micrometer order machining. This result will be used for the software development of the CNC polishing system.

• 대한환경공학회지
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• 제32권1호
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• pp.17-22
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• 2010

본 연구의 목적은 대형 석탄 화력 발전소에 DSI (Dry Sorbent Injection)공정을 실제 적용 할 경우에 실현 가능성에 대한 연구로서 N 발전(주)의 S 화력발전본부에서 운용중인 500MW급 석탄화력 발전시설의 보일러 후단에서 전기 집진기 전 단까지를 모델로 삼아 Lab-scale 실험장치를 제작하여 탈황효율을 높이기 위한 실험을 수행하였다. 이를 위하여 Lobedplate와 Step-plate라는 혼합촉진장치를 고안하고 각각 형상을 달리하여 궁극적으로 탈황효율을 높이기 위한 혼합촉진장치의 최적 형상도출을 위한 실험을 수행하였으며 부수적으로 탈황제의 분사구의 개수에 따른 탈황효율 또한 분석하였다. 그 결과 혼합촉진장치가 설치된 경우가 더 높은 탈황 효율을 나타내었고 형상에서는 계단형상일 경우 가장 높은 탈황효율을 보였다. 또한, 탈황제의 분사구의 개수에 따른 탈황효율은 혼합 촉진 장치가 설치되지 않은 경우, 분사구의 개수가 증가할수록 높은 탈황 효율을 보였으나 혼합촉진장치가 설치된 경우는 분사구의 개수가 4개일 경우가 이론적 결과와 같이 가장 높은 탈황효율을 나타내었다.