• Steel and Composite Structures
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• v.15 no.2
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• pp.151-162
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• 2013

In this study, an electrolyzing device for the production of metal powders was designed and fabricated. The production of copper powders was performed using a variety of current densities, anode-cathode distances and power removal times. The effect of these parameters on powder particle size and shape was determined. Particle size was measured using a laser diffraction unit while the powder shape was determined by SEM. Experimental results show that an increase in current density leads to a decrease in powder particle size. In addition particle shape changed from globular dendritic to acicular dendritic with increasing the current density. Distance between the cathode and anode also showed a similar influence on powder particle size and shape. An increase in time of powder removal led to an increase in powder particle size, as the shape changed from acicular dendritic to globular dendritic.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.950-955
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• 2001

For the development of an ultra-precision CNC polishing system including on-machine measurement system, we study a corrective polishing algorithm. We analyze and test the unit removal profiles for a ball type polishing tool. Using these results we calculate dwell time distributions and residual errors for a target removal shape. We use the polishing simulation method and feed rate calculation method for the dwell time calculation. We test corrective polishing algorithm with an optical glass. The target removal shape is a sine wave that has amplitude 0.3 micro meters. We find this polishing process has a machining resolution of nanometer order and is effective for sub-micrometer order machining. This result will be used for the software development of the CNC polishing system.

• Proceedings of the KSME Conference
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• 2000.11a
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• pp.486-491
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• 2000

In this study, finite elements addition and removal method by stress range is applied to optimize shapes in structures, without using classical and numerical optimization methods and search methods. The program based on this algorithm is developed and compared to theoritial results with considerable accuracy. Classical methods need mesh generation for finite element analysis for every iteration, the developed method needs updated mesh data such as coordinates of nodes, elements connectivity, and loads on nodes. And other tools of finite element analysis can be in use as a black box to interface with this program.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.1
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• pp.85-90
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• 2003

Removal rate and Within Wafer Non-Uniformity (WIWNU), the most critical issues in Chemical Mechanical Polish (CMP) process, are related to the pressure distribution, wafer shape, slurry flow, mechanical property of pad and etc. Among them, wafer warp generated by other various manufacturing process of wafer may induce the deviation of pressure distribution on the backside of wafer. In the convex shaped wafer the pressure onto the backside of wafer is higher than that of perfectly flat shaped wafer. Besides, such an added pressure is in proportion to the curvature of wafer. That is, the bigger the curvature of wafer becomes the higher the removal rate goes. And the WIWNU is known to be directly related to the pressure distribution on the wafer as well. In other words, the deviation of pressure distribution is in proportion to the WIWNU. In this paper, it is found that the wafer shape may be modified through heating the backside of it and thus properly changed pressure onto the backside of it may improve the WIWNU.

• Journal of Environmental Health Sciences
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• v.27 no.3
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• pp.27-34
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• 2001

This paper discussed the shape effect of ceramic support carrier in order to facilitate biomass immobilization. The shape of ceramic support carrier was modified hollow pipe type into hollow gear type. After seeding, microorganisms were attached in crevices where protection from shear forces or surfaces where easy to contact with support carrier surface. In case of hollow gear type carrier, initial attachment rate was faster than that of hollow pipe type and obtained thick biofilm. Synthetic wastewater(COD:75~880 mg/L, organic loading rate:0.36~4.22 kgCOD/㎥.d) was treated aerobic fixed bed biofilm reactor where 100% of the volume was filled with the ceramic carrier. COD removal efficiency of reactor filled with gear type support carrier was a little high withing 70 days, and then showed similar removal efficiency. It was found that highly loaded operation with up to 4.22 kgCOD/㎥.d was possible in both reactor. Total biomass amounts of pipe type was higher than gear type, however, attached biomass of gear type was higher than that of pipe type.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.359-361
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• 2006

As circuits become increasingly complex and devices sizes shrinks, the demands placed on global planarization of higher level. Chemical Mechanical Polishing (CMP) is an indispensable manufacturing process used to achieve global planarity. In the CMP process, Diamond Disk (DD) plays an important role in the maintenance of removal rate. According to studies, the cause of removal rate decrease in the early or end stage of diamond disk lifetime comes from pad surface change. We also presented pad cutting rate (PCR) as a useful cutting ability index of DD and studied PCR trend about variable parameters that including size, hardness, shape of DD and RPM, pressure of conditioner It has been shown that PCR control ability of pressure and shape is superior to RPM and size. High pressure leads to a decrease of cell open ratio of pad surface because polyurethane of pad is destroyed by pressure. So low pressure high RPM condition is a proper removal rate sustain. By examining correlations between RPM and pressure of conditioner, it has been shown that PCR safe zoneto satisfy proper removal rate has the range 0.06mm/hr to 0.12mm/hr.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.917-921
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• 2002

In this paper, we made different types of non-thermal plasma reactors such as Metal-particle reactor with $Al_2O_3$ to measure NOx removal characteristic and the dielectric effect for NOx removal. NOx removal rate is not so good when we use just dielectric of $Al_2O_3$ at the Metal-particle reactor, also we just put sludge pellets(100%) without Metal-particle reactor with $Al_2O_3$ and dielectric such as $TiO_2$, $BaTiO_3$ to measure the effect of sludge for NOx removal so that NOx removal rate is almost the same. However NOx removal rate is more than 90% in case of the reactor of composition shape used both dielectric of $Al_2O_3$ and sludge pellets at the same time. In case of the shape of plasma reactor with dielectric, the Metal-particle reactor with $Al_2O_3$, and the metal-particle reactor with both $Al_2O_3$ and dielectric such as $TiO_2$, $BaTiO_3$ at the same time, they are almost the same effect for NOx removal, so we made MNPR(Metal-particle Non-thermal Plasma Reactor with $Al_2O_3$) to reduce these kinds of demerits. Finally, we think MNPR should be much better than other reactors for NOx removal.

• Tribology and Lubricants
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• v.32 no.4
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• pp.119-124
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• 2016

In the sapphire wafering process, lapping is a crucial operation in order to reduce the damaged layer and achieve the target thickness. Many parameters, such as pressure, velocity, abrasive, slurry and plate, affect lapping characteristics. This paper presents an experimental investigation on the effect of the plate groove on the material removal rate and roughness of the wafer. We select the spiral pattern and rectangular type as the groove shapes. We vary the groove density by controlling the groove shape dimension, i.e., the groove width and pitch. As the groove density increases to 0.4, the material removal rate increases and gradually reaches a saturation point. When the groove density is low, the pressing load is mostly supported by the thick film, and only a small amount acts on the abrasives resulting to a low material removal rate. The roughness decreases on increasing the groove density up to 0.3 because thick film makes partial participations of large abrasives which make deep scratches. From these results, we could conclude that the groove affects the contact condition between the wafer and plate. At the same groove density, the pitch has more influence on reducing the film thickness than the groove width. By decreasing the groove density with a smaller pitch and larger groove width, we could achieve a high material removal rate and low roughness. These results would be helpful in understanding the groove effects and determining the appropriate groove design.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.1
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• pp.99-106
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• 2002

For the development of a ultra-precision CNC polishing system including on-machine measurement system, we study a corrective polishing algorithm. We calculated unit removal profiles for various flat type polishing tools and polishing tool positions. Using these results we simulate the corrective polishing process based on dwell time control. We calculate dwell time distributions and residual error of the polishing simulation method and the FFT calculation method. We test corrective polishing algorithm with an optical glass. The target removal shape is a sine wave that has amplitude 0.3 micro meters. We find this polishing process has a machining resolution of nanometer order and is effective for sub-micrometer order machining. This result will be used for the software development of the CNC polishing system.

• Journal of Korean Society of Environmental Engineers
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• v.32 no.1
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• pp.17-22
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• 2010

The aim of this study is to research applicable possibility of DSI (Dry Sorbent Injection) technique in $SO_2$ removal process using lab-scale facility based on 500MW in capacity coal-fired thermal power plant operated by South Korea N. Power Co., Ltd. To increase the $SO_2$ removal efficiency, it is considered the mixing enhancement as different shapes called lobed-plate and stepplate tested ultimately for optimum shape. Also it tested to analysis $SO_2$ removal efficiency by numbers of injection holes. At experimental it showed the $SO_2$ removal efficiency is higher using mixing enhancement than not installed mixing enhancement and case on the step-plate was shown the most $SO_2$ removal efficiency. Also, $SO_2$ removal efficiency was higher recording which will increase the injection holes case on not installed mixing enhancement. But, the $SO_2$ removal efficiency was higher 4 injection holes case on installed mixing enhancement.