• 한국신뢰성학회:학술대회논문집
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• 한국신뢰성학회 2001년도 정기학술대회
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• pp.337-337
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• 2001

High voltage ceramic capacitors are widely applied in power electronic circuits, such as filters, snubbers, and resonant circuits, due to their excellent features of high voltage endurance and low aging. This paper presents a result of failure analysis and reliability evaluation for high voltage ceramic capacitors. The failure nodes and failure mechanisms were identified in order to understand the failure physics in a component. The causes of failure mechanisms for zero resistance phenomena under withstanding voltage test in high voltage ceramic capacitors molded by epoxy resin were studied by establishing an effective closed-loop failure analysis. Also, the condition for dielectric breakdown was investigated. Particular emphasis was placed on breakdown phenomena at the ceramic-epoxy interface. The validity of the results in this study was confirmed by the results of accelerated testing. Thermal shock test as well as pressure cooker test for high voltage ceramic capacitor mounted on a magnetron were implemented. Delamination between ceramic and epoxy, which, might cause electrical short in underlying circuitry, can occur during curing or thermal cycling. The results can be conveniently used to quickly identify defective lots, determine mean time to failure (MTTF) of each lot at the level of Inspection, and detect major changes in the vendors processes.

• 한국안전학회지
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• 제17권3호
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• pp.123-130
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• 2002

본 논문은 사고관리방안 수행에 있어서 발생되는 인적오류의 정량적 평가방법을 개발하여 공동범람 사고관리방안의 예제문제에 적용한 연구결과를 기술하고있다. PSA에서 사용되었던 기존의 인간오류평가 방법론인 THERP, HCR, SLIM-MAUD 방법의 특징을 검토하여 장단점을 기술하였다. 본 연구에서 제시하는 인간오류평가 방법론은 신뢰도물리모델을 이용하는 새로운 HRA 분석방법이다. 불확실성 분석을 위하여 MAAP 코드와 LHS 코드가 사용되었다. 본 연구를 통하여 제안하는 방법은 매우 유연하여 중대사고관리방안과 관련한 다양한 인간오류행위에 대한 평가에 사용될 수 있음을 보여주었다.

• Journal of Welding and Joining
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• 제31권3호
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• pp.84-88
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• 2013

These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product.

• Nuclear Engineering and Technology
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• 제53권5호
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• pp.1658-1663
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• 2021

Research on climate change and global warming on the power generation systems are rapidly increasing because of the Importance of the sustainable energy supply, thus the electricity supply since its growing share, in the end, uses energy supply. However, some researchers conducted this field, but many research gaps are not mentioned and filled in this field's literature since the lack of general statements and the quantitative models and formulation of the issue. In this research, an exergy-based model is implemented to model a set of six power generation technologies (combined cycle, gas turbine, nuclear plant, solar PV, and wind turbine) and use this model to simulate each technology's responses to climate change impacts. Finally, using these responses to define and calculate a formulation for the relationship between the system's energy performance in different environmental situations and a dimensionless index to quantize each power technology's reliability against the climate change impacts called the Pahlev reliability index (P-index) of the power technology. The results have shown that solar and nuclear technologies are the most, and wind turbines are the least reliable power generation technologies.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
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• pp.1550-1551
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• 2006

An L-band linear accelerator system for e-beam sterilization is under design for bio-technology application. The klystron-modulator system as RF microwave source has an important role as major components to offer the system reliability for long time steady state operation. A PFN line type pulse generator with a peak power of 71.5-MW, $7{\mu}s$, 285 pps is required to drive a high-power klystron. The high power pulse transformer has a function of transferring pulse energy from a pulsed power source to a high power load. The pulse transformer producing a pulse with a peak voltage of 275 kV is required to produce 30-MW peak and 60 kW average RF output power at the frequency of 1.3-GHz. We have designed the high power pulse transformer with 1:13 step-up ratio. The peak and average power capability is 71.5-MW (275 kV, 260 A at load side with $7{\mu}s$ pulse width) and 130 kW, respectively. In this paper, we present a system overview and initial design results of the high power pulse transformer.

• Transactions on Electrical and Electronic Materials
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• 제17권4호
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• pp.196-200
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• 2016

We have developed new electrostatic discharge (ESD) protection devices with, bidirectional flip chip transient voltage suppression. The devices differ in their epitaxial (epi) layers, which were grown by reduced pressure chemical vapor deposition (RPCVD). Their ESD properties were characterized using current-voltage (I-V), capacitance-voltage (C-V) measurement, and ESD analysis, including IEC61000-4-2, surge, and transmission line pulse (TLP) methods. Two BD-FCTVS diodes consisting of either a thick (12 μm) or thin (6 μm), n-Si epi layer showed the same reverse voltage of 8 V, very small reverse current level, and symmetric I-V and C-V curves. The damage found near the corner of the metal pads indicates that the size and shape of the radius governs their failure modes. The BD-FCTVS device made with a thin n- epi layer showed better performance than that made with a thick one in terms of enhancement of the features of ESD robustness, reliability, and protection capability. Therefore, this works confirms that the optimization of device parameters in conjunction with the doping concentration and thickness of epi layers be used to achieve high performance ESD properties.

• 한국진공학회지
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• 제20권3호
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• pp.200-204
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• 2011

이 논문에서는 반도체의 기판으로 사용되는 Si(silicon)기판과 금속배선 물질인 Cu(copper)의 확산을 효과적으로 방지하기 위한 W(Tungsten)-C(Carbon)-N(Nitrogen) 확산방지막을 제시하였고, 시료 증착을 위하여 rf magnetron sputter를 사용하여 동일한 증착조건에서 질소(N)의 비율을 다르게 증착한 후 시료의 열적 안정성 측정을 위하여 상온에서 $800^{\circ}C$까지 각각 질소 분위기에서 30분간 열처리 과정을 실시하여 열적 손상을 인가하였다. 이후 Nanoindentation 기법을 이용하여 총 16 points에서 Elastic modulus와 Weibull distribution을 측정하였다. 그 결과 질화물질이 고온에서 물성변화가 적게 나타나는 것을 알 수 있었고, 온도변화에 따른 박막의 균일도와 결정성 또한 질화물질에서 더 안정적이었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.256-256
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• 2012

Oxide semiconductors such as zinc tin oxide (ZTO) or indium gallium zinc oxide (IGZO) have attracted a lot of research interest owing to their high potential for application as thin film transistors (TFTs) [1,2]. However, the instability of oxide TFTs remains as an obstacle to overcome for practical applications to electronic devices. Several studies have reported that the electrical characteristics of ZnO-based transistors are very sensitive to oxygen, hydrogen, and water [3,4,5]. To improve the reliability issue for the amorphous InGaZnO (a-IGZO) thin-film transistor, back channel passivation layer is essential for the long term bias stability. In this study, we investigated the instability of amorphous indium-gallium-zinc-oxide (IGZO) thin film transistors (TFTs) by the back channel contaminations. The effect of back channel contaminations (humidity or oxygen) on oxide transistor is of importance because it might affect the transistor performance. To remove this environmental condition, we performed vacuum seasoning before the deposition of hybrid passivation layer and acquired improved stability. It was found that vacuum seasoning can remove the back channel contamination if a-IGZO film. Therefore, to achieve highly stable oxide TFTs we suggest that adsorbed chemical gas molecules have to be eliminated from the back-channel prior to forming the passivation layers.

• Current Photovoltaic Research
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• 제2권2호
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• pp.63-68
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• 2014

In recent years, discoloration defects, called as snail trail, have been observed at many crystalline photovoltaic modules after a period of time ranging from several months to several years after initial installation. It has been reported that this phenomenon doesn't impact on the performance of photovoltaic modules, but it can be detected through simple visual inspection. The origin and detailed mechanism for the formation have not been identified. In this study, non-destructive analysis by Raman spectroscopy has been carried out to investigate the origin of this phenomenon. In parallel, destructive analysis by scanning electron microscopt and transmission electron microscopy was also performed in order to confirm the results from non-destructive method. Through the extensive analysis, it was found that the main cause for discoloration is the formations of $Ag_2CO_3$ and $AgC_2H_3O_2$. Detailed mechanism for the formation of these particles was indentified through systematic studies.

• 대한금속재료학회지
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• 제46권2호
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• pp.80-87
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• 2008

Many researches related to the reliability of Pb-free solder joints with PCB (printed circuit board) surface finish under thermal or vibration stresses are in progress, because the electronics is operating in hash environment. Therefore, it is necessary to assess Pb-free solder joints life with PCB surface finish under thermal and mechanical stresses. We have investigated 4-points bending fatigue lifetime of Pb-free solder joints with OSP (organic solderability preservative) and ENIG (electroless nickel and immersion gold) surface finish. To predict the bending fatigue life of Sn-3.0Ag-0.5Cu solder joints, we use the test coupons mounted 192 BGA (ball grid array) package to be added the thermal stress by conducting thermal shock test, 500, 1,000, 1,500 and 2,000 cycles, respectively. An 4-point bending test is performed in force controlling mode. It is considered that as a failure when the resistance of daisy-chain circuit of test coupons reaches more than $1,000{\Omega}$. Finally, we obtained the solder joints fatigue life with OSP and ENIG surface finish using by Weibull probability distribution.