• Journal of Plant Biotechnology
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• v.42 no.3
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• pp.154-160
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• 2015

The plant breeding technology was developed with genetic engineering. Many researchers and breeders have turned from traditional breeding to molecular breeding. Genetically modified organisms (GMO) were developed via molecular breeding technology. Currently, molecular breeding technologies facilitate efficient plant breeding without introducing foreign genes, in virtue by of gene editing technology. Gene targeting (GT) via homologous recombination (HR) is one of the best gene editing methods available to modify specific DNA sequences in genomes. GT utilizes DNA repair pathways. Thus, DNA repair systems are controlled to enhance HR processing. Engineered sequence specific endonucleases were applied to improve GT efficiency. Engineered sequence specific endonucleases like the zinc finger nuclease (ZFN), TAL effector nuclease (TALEN), and CRISPR-Cas9 create DNA double-strand breaks (DSB) that can stimulate HR at a target site. RecQl4, Exo1 and Rad51 are effectors that enhance DSB repair via the HR pathway. This review focuses on recent developments in engineered sequence specific endonucleases and ways to improve the efficiency of GT via HR effectors in plants.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.59.2-59.2
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• 2012

Polymer solar cells utilize bulk heterojunction (BHJ) type photo-active layer in which the electron donating polymer and electron accepting $C_{60}$ derivatives are blended. We found there is significant charge recombination at the interface between the BHJ active layer and electrode. The charge recombination at the interface was effectively reduced by inserting wide band gap inorganic interfacial layer, which resulted in efficiency and stability enhancement of BHJ polymer solar cell.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.230.1-230.1
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• 2016

본 연구에서는 Host-Dopant system 기반 적색 인광 OLED의 Emitting layer(EML)에서 doping 위치에 따른 특성 변화를 분석하였다. EML은 host 물질로 60 nm 두께의 CBP를 사용하고, 적색 발광을 위해 10 %의 $Ir(btp)_2$를 CBP의 Front, Middle, Back side에 각각 20 nm씩 doping하였다. 본 구조의 적색 인광 OLED는 current density, luminance, efficiency, EL spectrum 등을 통해 전기적, 광학적 특성 변화를 확인하였다. Front, Back side에 doping으로 인한 CBP의 Energy level이 3.6 eV에서 1.9 eV로 감소하여 각각 HTL/EML, EML/HBL의 경계에 carrier direct injection이 활성화 되었고, 이로 인한 charge balance의 저하를 확인하였다. EL spectrum결과 각 소자는 CBP의 618 nm 파장 외에도, 추가적으로 TPBi의 398 nm, NPB의 456 nm의 파장을 보였다. 이를 통해 doping 위치에 따라 exciton이 형성되는 recombination zone이 이동하고 있음을 확인하였고, Front side는 6 V의 인가전압에서는 발광 파장이 398 nm에서 높은 값을 보이나 8 V, 10 V, 12 V에서 618 nm에서 높은 값을 보이는 것으로 인가전압에 의해 recombination zone이 HTL쪽으로 이동되는 것 또한 확인하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.305-306
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• 2009

In this study, we have invastigated the recombination zone in the blue phosphorescent organic light-emitting devices with various partially doped structures. The basic device structure of the blue PHOLED was anode / hole injection layer (HIL) / hole transport layer (HTL) / emittingvastigated the recombination zone in the blue layer (EML) / hole blocking layer (HBL) / electron transport layer (ETL) / electron injection layer (EIL) / cathode. After the preparation of the blue PHOLED, the current density (J) - voltage (V) - luminance (L) and current efficiency characteristics were measured.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.91.1-91.1
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• 2010

There are some methods for increasing efficiency of crystalline silicon solar cells. Among them, It is important to reduce the recombination loss of surface for high efficiency. In order to reduce recombination loss is a way to use the BSF(Back Surface Field). The BSF on the back of the p-type wafer forms a p+layer. so, it is prevented to act electrons of the p-area for the rear recombination. As a result, the leakage current is reduced and the rear-contact has a good Ohmic contact. therefore, open-circuit-voltage and Fill factor(FF) of solar cells are increased. This paper investigates the formation of rear contact process comparing Aluminum-paste(Al-paste) with Aluminum-Metal(99.9%). It is shown that the Aluminum-Metal provides high conductivity and low contact resistance of $21.35m{\Omega}cm$ using the Vacuum evaporation process but, it is difficult to apply the standard industrial process because high Vacuum is needed and it costs a tremendous amount more than Al-paste. On the other hand, using the Al-paste process by screen printing is simple for formation of metal contact and it is possible to produce the standard industrial process. however, it is lower than Aluminum-Metal(99.9) of conductivity because of including mass glass frit. In this study, contact resistances were measured by 4-point prove. each of contact resistances is $21.35m{\Omega}cm$ of Aluminum-Metal and $0.69m{\Omega}cm$ of Al-paste. and then rear contact have been analyzed by Scanning Electron Microscopy(SEM).

• Progress in Medical Physics
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• v.31 no.4
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• pp.145-152
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• 2020

Purpose: In ionization-chamber dosimetry for high-dose-rate electron beams-above 20 mGy/pulse-the ion-recombination correction methods recommended by the International Atomic Energy Agency (IAEA) and the American Association of Physicists in Medicine (AAPM) are not appropriate, because they overestimate the correction factor. In this study, we suggest a practical ion-recombination correction method, based on Boag's improved model, and apply it to reference dosimetry for electron beams of about 100 mGy/pulse generated from an electron linear accelerator (LINAC). Methods: This study employed a theoretical model of the ion-collection efficiency developed by Boag and physical parameters used by Laitano et al. We recalculated the ion-recombination correction factors using two-voltage analysis and obtained an empirical fitting formula to represent the results. Next, we compared the calculated correction factors with published results for the same calculation conditions. Additionally, we performed dosimetry for electron beams from a 6 MeV electron LINAC using an Advanced Markus^® ionization chamber to determine the reference dose in water at the source-to-surface distance (SSD)=100 cm, using the correction factors obtained in this study. Results: The values of the correction factors obtained in this work are in good agreement with the published data. The measured dose-per-pulse for electron beams at the depth of maximum dose for SSD=100 cm was 115 mGy/pulse, with a standard uncertainty of 2.4%. In contrast, the k_s values determined using the IAEA and AAPM methods are, respectively, 8.9% and 8.2% higher than our results. Conclusions: The new method based on Boag's improved model provides a practical method of determining the ion-recombination correction factors for high dose-per-pulse radiation beams up to about 120 mGy/pulse. This method can be applied to electron beams with even higher dose-per-pulse, subject to independent verification.

• 한국신재생에너지학회:학술대회논문집
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• 2010.11a
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• pp.43.1-43.1
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• 2010

In the crystalline silicon solar cells, the full area aluminum_back surface field(BSF) is routinely achieved through the screen-printing of aluminum paste and rapid firing. It is widely used in the industrial solar cell because of the simple and cost-effective process to suppress the overall recombination at the back surface. However, it still has limitations such as the relatively higher recombination rate and the low-to-moderate reflectance. In addition, it is difficult to apply it to thinner substrate due to wafer bowing. In the recent years, the dielectric back-passivated cell with local back contacts has been developed and implemented to overcome its disadvantages. Although it is successful to gain a lower value of surface recombination velocity(SRV), the series resistance($R_{series}$) becomes even more important than the conventional solar cell. That is, it is a trade off relationship between the SRV and the $R_{series}$ as a function of the contact size, the contact spacing and the geometry of the opening. Therefore it is essential to find the best compromise between them for the high efficiency solar cell. We have investigated the optimal design for the local back contact by using PC1D simulation.

• 한국신재생에너지학회:학술대회논문집
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• 2010.11a
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• pp.50.1-50.1
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• 2010

결정질 실리콘 태양전지의 원가에서 Wafer는 60~70%의 매우 높은 비중을 차지하고 있다. 많은 연구들이 원가 절감을 위하여 Wafer의 두께를 감소시키는 것에 집중하고 있다. 그러나 Wafer 두께의 감소는 태양전지의 효율 감소와 공정 진행 중에 파손율이 상승하는 등의 문제가 발생한다. 이에 본 논문에서는 결정질 태양전지 구조 중에서 24.7% 이상의 최고 변환 효율을 갖는 PERL(Passivated Emitter, Rear Locally diffuse) 구조를 대상으로 wafer 두께 감소에 따른 변환 효율 감소의 원인과 해결 방안을 제시하고자 한다. Simulation으로 확인한 결과 370 um 두께의 wafer에서 24.2 %의 효율은 50 um 두께의 wafer에서는 20.8 %로 감소함을 확인할 수 있었다. 얇아진 wafer에서 감소한 효율을 개선하기 위하여 후면 recombination velocity, 후면 fixed charge density, 후면 산화막 두께 등을 다양화하여, 각각의 경우에 대한 cell의 효율 변화를 살펴보았다. 그 결과 후면 recombination velocity, 후면 fixed charge density, 후면 산화막 두께를 최적화 하여, 각각 2.8 %p, 1.5 %p, 2.8 %p의 효율 개선 효과를 얻었다. 위 세 가지 효과를 동시에 적용하면 50 um wafer에서 370 um wafer 효율의 결과와 근접한 24.2 %의 효율을 얻을 수 있었다. 향후에는 위의 결과를 바탕으로 실제 실험을 통하여 확인할 계획이다.

• Korean Journal of Materials Research
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• v.25 no.9
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• pp.487-491
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• 2015

In photovoltaic power generation where minority carrier generation via light absorption is competing against minority carrier recombination, the substrate thickness and material quality are interdependent, and appropriate combination of the two variables is important in obtaining the maximum output power generation. Medici, a two-dimensional semiconductor device simulation tool, is used to investigate the interdependency in relation to the maximum power output in front-lit Si solar cells. Qualitatively, the results indicate that a high quality substrate must be thick and that a low quality substrate must be thin in order to achieve the maximum power generation in the respective materials. The dividing point is $70{\mu}m/5{\times}10^{-6}sec$. That is, for materials with a minority carrier recombination lifetime longer than $5{\times}10^{-6}sec$, the substrate must be thicker than $70{\mu}m$, while for materials with a lifetime shorter than $5{\times}10^{-6}sec$, the substrate must be thinner than $70{\mu}m$. In substrate fabrication, the thinner the wafer, the lower the cost of material, but the higher the cost of wafer fabrication. Thus, the optimum thickness/lifetime combinations are defined in this study along with the substrate cost considerations as part of the factors to be considered in material selection.

• Journal of Information Display
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• v.7 no.2
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• pp.26-30
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• 2006

Insertion of a thin lithium fluoride (TLF) layer between an emitting layer (EML) and an electron transporting layer has resumed in the developement of a highly efficient and bright organic light-emitting diode (OLED). Comparing with the performance of the device as a function of position with the TLF layer in tris-(8-hydroxyquinoline) aluminum $(Alq_{3})$, we propose the optimal position for the TLF layer in the stacked structure. The fabricated OLED shows a luminance efficiency of more than 20 cd/A, a power efficiency of 12 Im/W (at 20 mA/$cm^{2}$), and a luminance of more than 22 000 cd/$m^{2}$ (at 100 mA/$cm^{2}$), respectively. We suggest that the enhanced performance of the OLED is probably attributed to the improvement of carrier balance to achieve a high level of recombination efficiency in an EML.