• Journal of the Korean Ceramic Society
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• v.49 no.4
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• pp.308-317
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• 2012

Reactive processing, such as reactive hot pressing (RHP) and reactive spark plasma sintering (R-SPS), is effective densification method to prepare $ZrB_2$-based ultra high temperature ceramics (UHTCs). The present paper reviewed some typical reactive processing of $ZrB_2$-based UHTCs. All the reactions from the starting materials in the reactive processing are thermodynamically favorable, which generate enough energy and driving force for the densification of the final products under a relatively low temperature. Besides, compared with non-reactive processing, anisotropic $ZrB_2$ grains, such as $ZrB_2$ platelets, can only be obtained in the reactive processing, resulting in an improvement of the mechanical properties.

• Journal of the Korean Ceramic Society
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• v.37 no.7
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• pp.645-650
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• 2000

Effects of the chemical composition and sintering atmosphere on the formation of reaction phases and physical properties of reactive hot-pressed TiB2-AlN-BN composites were investigated. At N2 atmosphere, TiN was formed by the reaction between Ti and N2, which inhibited the densification and results in inferior mechanical-and electrical properties of the composites. However, at Ar atmosphere, enhanced densification and physical properties of composites were obtained due to that the TiN formation reaction was excluded. Densification of the composites was also hindered by BN, therefore, inferior mechanical-and electrical properties of composites were obtained with amount of BN in the starting materials. At Ar atmosphere, TiB2-AlN-BN composites having 318 MPa of flexural strength, 3.5 MPa.m1/2 of fracture toughness and 276$\mu$Ω.cm of electrical resistivity were fabricated from mole ratio 1:2:1.6 of Ti-Al-BN mixtures.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.868-869
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• 2006

[ $Cr_2AlC$ ] was synthesized by a reactive hot pressing of $CrC_x(x=0.5)$ and Al powder mixture used as starting materials at the temperature range of $1200^{\circ}C{\sim}1400^{\circ}C$ under 25 MPa in Ar atmosphere. Fully dense $Cr_2AlC$ with high purity was synthesized by hot pressing $CrC_x$ and Al powder mixture at the temperature as low as $1200^{\circ}C$. The average grain size of synthesized bulk $Cr_2AlC$ was varied in the range of $10-100{\mu}m$ depending on hot pressing temperatures. The maximum flexural strength of synthesized bulk $Cr_2AlC$ exceeded 600 MPa.

• Journal of the Korean Ceramic Society
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• v.47 no.6
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• pp.534-539
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• 2010

$HfB_2$-HfC composites were prepared by reactive hot pressing using Hf and $B_4C$ at temperatures of 1800 and $1900^{\circ}C$ for 60 min under 32 MPa in an Ar atmosphere. The reaction sequences of the $HfB_2$-HfC composite were studied through series of pressureless heat treatments ranging from 800 to $1600^{\circ}C$. The effect of size reduction of the starting powders on densification was investigated by vibration milling. Fully dense $HfB_2$-HfC composites were obtained by size reduction of the starting powders via vibration milling. The oxidation behaviour of the $HfB_2$-HfC composites at $1500^{\circ}C$ in air showed formation of a non-protective $HfO_2$ scale with linear mass gain. Examination of the mechanical properties showed that particle size reduction via vibration milling also led to improved flexural strength, hardness and fracture toughness.

• Journal of Adhesion and Interface
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• v.7 no.3
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• pp.16-25
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• 2006

Water vapour permeable and water resistant film was laminated to made footwear woven fabric and non-woven fabrics by screen type with thermosetting reactive hot melt adhesive. Optimum conditions of each process were investigated, and the properties of film laminated fabric with optimum conditions are evaluated. The results are as follows. Thermosetting reactive polyurethane hot melt is retain proper heat resistance differently thermoplastic hot melt. Optimum melting adhesive process conditions are as follows ; drum temperature $95^{\circ}C$, hose temperature $97^{\circ}C$, feeding pipe temperature $100^{\circ}C$, screen temperature $105^{\circ}C$, pressure of opposite roller $1kgf/cm^2$, pressure of laminating roller $3kgf/cm^2$, finishing speed 15 m/min, melting temperature $120^{\circ}C$, cooling time 20 s, pressing temperature $130^{\circ}C$, pressing time 30 s. As the thickness of film was increased, the water vapour permeability was decreased but water resistance was increased, and the effect of film is dominant over all the others in the air permeability.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.25 no.1
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• pp.62-67
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• 2016

This paper presents a silicon nanostructure array embedded in a polymer film. The silicon nanostructure array was fabricated by using basic microelectromechanical systems (MEMS) processes such as photolithography, reactive ion etching, and anisotropic KOH wet etching. The fabricated silicon nanostructure array was transferred into polymer substrates such as polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), and polycarbonate (PC) through the hot-embossing process. In order to determine the transfer conditions under which the silicon nanostructures do not fracture, hot-embossing experiments were performed at various temperatures, pressures, and pressing times. Transfer was successfully achieved with a pressure of 1 MPa and a temperature higher than the transition temperature for the three types of polymer substrates. The transferred silicon nanostructure array was electrically evaluated through measurements with a semiconductor parameter analyzer (SPA).

• Korean Journal of Materials Research
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• v.30 no.7
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• pp.350-358
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• 2020

A variety of composite powders having different aluminum and carbon contents are prepared using various organic solvents having different amounts of carbon atoms in unit volume as ball milling agents for titanium and aluminum ball milling. The effects of substrate temperature and post-heat treatment on the texture and hardness of the coating are investigated by spraying with this reduced pressure plasma spray. The aluminum part of the composite powder evaporates during spraying, so that the film aluminum content is 30.9 mass%~37.4 mass% and the carbon content is 0.64 mass%~1.69 mass%. The main constituent phase of the coating formed on the water-cooled substrate is a non-planar α₂ phase, obtained by supersaturated carbon regardless of the alloy composition. When these films are heat-treated at 1123 K, the main constituent phase becomes γ phase, and fine Ti₂AlC precipitates to increase the film hardness. However, when heat treatment is performed at a higher temperature, the hardness is lowered. The main constitutional phase of the coating formed on the preheated substrate is an equilibrium gamma phase, and fine Ti₂AlC precipitates. The hardness of this coating is much higher than the hardness of the coating in the sprayed state formed on the water-cooled substrate. When hot pressing is applied to the coating, the porosity decreases but hardness also decreases because Ti₂AlC grows. The amount of Ti₂AlC in the hot-pressed film is 4.9 vol% to 15.3 vol%, depending on the carbon content of the film.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.8
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• pp.707-711
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• 2006

ZnO was doped up to 0.3 wt% for improving the electrical properties of lead-free $[Li_{0.04}(Na_{0.44}Ko_{0.52})-(Nb_{0.86}\;Ta_{0.10}\;Sb_{0.04})]O_3$ piezoelectric ceramics. The ceramics were fabricated with the conventional sintering processes. Crystal structure of the samples was tetragonal phase regardless of ZnO amount. However, the piezoelectric properties were varied with the ZnO amount. The electro-mechanical coupling factor $(k_p)$ was with the ZnO amount up to 0.2 wt% but decreased with the further addition. the maximum value of $k_p$ was 0.475. Density, piezoelectric charge constant and relative dielectric constant was also showed maximum value at 0.2 wt%. The maximum values are $4.75g/cm^3$, 275 pC/N, 1403, respectively. In contrast, the mechanical quality factor $(Q_m)$ was not varied with increasing the ZnO addition up to 0.2 wt% but rapidly increased at 0.3 wt%.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.48-48
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• 2008

현재 압전재료로써 사용되고 있는 PZT계 세라믹스는 우수한 압전 및 유전특성으로 초음파 센서, 압전변압기, 액츄에이터, 필터, 레조네이터와 같은 여러 응용분야에 널리 사용되어지고 있다. 그러나 납을 60%이상 포함하므로 환경오염에 의하여 그 사용에 대한 규제가 강화되고 있어 최근에는 납을 함유하지 않은 무연 환경친화형 압전세라믹스가 주목받고 있다. 현재 무연 조성 세라믹스에는 텅스텐-브론즈 형, 비스머스 레이어형, 페로브스카이트 형 등이 이으며, 그 중 페로보스카이트 혈을 제외하고는 보통 소성법 조제시 낮은 압전특성을 갖는다. 그러므로 압전특성을 증가시키기 위하여 Hot pressing, Hot forging, RTGG(Reactive Template Grain Growth), SPS(Spark Plasma Sintering), 그러나 이는 무연 세라믹스의 대량생산 과정에서 어려운 문제를 가지고 있고, 저가격 관점에서 볼 때 보통소성법이 보다 바람직하다. 그래서 보통소성법으로 NKN세라믹스의 소결성을 향상 시키고 비교적 높은 압전특성을 얻기 위해서 $LiSbO_3$, $LiNbO_3$, $LiTaO_3$, alkaline-earth(Mg, Ca, Sr, Ba) 등을 첨가한 논문들이 보고되고 있으며, 이러한 재료들의 kp는 대략 0.3-0.4를 나타내고 있다. 따라서, 본 연구에서는 소결온도를 낮추고자 $Ag_2O$를 소결조제로 사용하였고 유전 및 압전특성을 높이고자 소결시간 변화시켜 시편을 제작하여 NKN 세라믹스의 유전 및 압전특성을 조사하였다.

• Journal of the Korean Society for Heat Treatment
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• v.31 no.4
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• pp.171-179
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• 2018

Copper powder dispersed with 4 vol.% of $Cr_2O_3$ was successfully produced by a simple milling at 210 K with a mixture of $Cu_2O$, Cu and Cr elemental powders, followed by Hot Pressing (HP) at 1123 K and 50 MPa for 2h to consolidate the milled powder. The microstructure of the HPed material was characterized by standard metallographic techniques such as XRD (X-ray Diffraction), TEM and STEM-EDS. The results of STEMEDS analysis showed that the HPed materials comprised a mixture of nanocrystalline Cu matrix and $Cr_2O_3$ dispersoid with a homogeneous bimodal size distribution. The mechanical properties of the HPed materials were characterized by micro Vickers hardness test at room temperature. The thermodynamic considerations on the heat of formation, the incubation time to ignite MSR (Mechanically induced Self-sustaining Reaction), and the adiabatic temperature for the heat of displacement reaction between the oxide-metal are made for the delayed formation of $Cr_2O_3$ dispersoid in terms of MSR suppression. The results of TEM observation and hardness test indicated that the relatively large dispersoids in the HPed materials are attributed to the significant coarsening for the high temperature consolidation; this leads to the low Vickers hardness value. Based on the thermodynamic calculation for the operating processes with a limited number of parameters, the formation kinetics and coarsening of the $Cr_2O_3$ dispersoid are discussed.