• Proceedings of the Korean Vacuum Society Conference
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• 1995.02a
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• pp.76-76
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• 1995

• Proceedings of the Korean Vacuum Society Conference
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• 1996.06a
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• pp.170-170
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• 1996

• Proceedings of the Korean Vacuum Society Conference
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• 2002.06a
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• pp.177-177
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• 2002

• Proceedings of the Materials Research Society of Korea Conference
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• 2006.05a
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• pp.27.2-27.2
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• 2006

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.8 no.4
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• pp.592-598
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• 1998

AZO(Aluminum doped Zinc Oxide) thin films were fabricated by reactive DC magnetron sputtering method using zinc metal target (Al 2%) and zinc oxide target ($Al_2O_3\;2%$) respectively. The intermediate condition with optimum transmittance and conductivity was obtained by controlling the sputtering parameters. Oxygen gas ratio for this condition was $0.5{\times}10^{-2}~1.0{\times}10^{-2}$ in oxide target and. In case of metal target, this optimum oxygen gas ratio at the applied power of 0.6 kW and 1.0 kW was 0.215~0.227 and 0.305~0.315, respectively. The resistivity of AZO film deposited was obtained $1.2~1.4{\times}10^{-3} {\Omega}{\cdot}$cm as deposited state regardless of target species.

• Korean Chemical Engineering Research
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• v.44 no.5
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• pp.483-488
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• 2006

Etching process of PMMA (Polymethyl Methacrylate) on glass surface was investigated by dry etching technique using remote plasma. To determine the etching characteristics, the remote plasma etching was conducted for various process parameters such as plasma power, reaction gas and distance from plasma generation. As the distance from the plasma generation was increased, the etch rate of PMMA was linearly decreased by radical density in plasma. PMMA has removed by reactive radicals in the plasma. The etch rate increased with plasma power because of more reactive radicals. The etch rate and surface roughness of PMMA increased with $O_2$ concentration in the etchant.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.2
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• pp.101-105
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• 1998

This paper describes anisotropic etching technology of highly doped polysilicon. The main etching gases are $Cl_2$ and $SiCl_4$ for reactive ion etching of polysilicon. The mixed $CHCl_3$ to main etching gas makes polymer on etching side wall, so it prevents side etching of polysilicon. The etch rate of polysilicon is increased with increasing RF power. But the etching rate is decreased as the flow rate of $CHCl_3$ is increased with fixed RF power. The etch selectivity of polysilicon and $SiO_2$ is about 12:1. And that of polysilicon and $Si_3N_4$ is about 19:1. In the main etching gas condition, the slope of polysilicon is same as that of photoresist. But in the mixed $CHCl_3$ condition, the slope of polysilicon is larger than that of photoresist. This represents that the polymer made on side wall by added $CHCl_3$ prevents side etching, so anisotropic etching can be possible by polymer.

• Transactions on Electrical and Electronic Materials
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• v.9 no.1
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• pp.12-15
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• 2008

Hafnium oxynitride films have been deposited onto a silicon substrate by means of radio frequency (RF) reactive sputtering using a hafnium dioxide $(HfO_2)$ target with a variety of nitrogen! argon $(N_2/Ar)$ gas flow ratios. Auger electron spectroscopy (AES)results confirm that $N_2$ was successfully incorporated into the HfON films. An increase in the $N_2/Ar$ gas flow ratio resulted in metal oxynitride formation. The films prepared with a $N_2/Ar$ flow ratio of 20/20 sccm show (222), (530), and (611) directions of $HfO_2N_2$, and the (-111), (311) directions of $HfO_2$. From X-ray reflectometry measurements, it can be concluded that with $N_2$ incorporated into the HfON films, the film density increases. The density increases from 9.8 to $10.1g/cm^3$. XRR also reveals that the surface roughness is related to the $N_2/Ar$ flow ratio.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.244.2-244.2
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• 2014

금속, 플라스틱, 유리 등의 재료 표면에 다양한 색상을 표현하기 위해 일반적으로 습식 도금을 많이 적용하고 있다. 하지만 습식 도금은 공정 수가 많을 뿐만 아니라 위험물질 및 오염물질을 많이 사용하기 때문에 산업사고, 환경오염 등을 야기 시킨다. 따라서 본 연구에서는 친환경적 방법인 물리적기상증착(PVD ; Physical Vapor Deposition) 방식의 한 종류인 스퍼터링(Sputtering)으로 색상을 구현하였다. PVD 방식의 증착은 습식 도금 방식에 비해 친환경적이며, 전처리에서 후처리까지 한 공정으로 가능하다는 점이다. 스퍼터링은 PVD의 다른 방식인 E-beam 방식에 비해 대량생산을 할 수 있다는 장점이 있다. 양산형 스퍼터링 장비(${\Phi}1200mm{\times}H1400mm$)로 실험을 진행하였으며, 증착 물질은 Ti, Al, Cr 을 사용하였고, 반응성 가스(Reactive Gas) 로는 N2, C2H2 가스를 사용하였다. 전처리는 LIS (Linear Ion Source)로 식각(Etching) 하였고, 펄스직류전원공급장치(Pulsed DC Power Supply)를 사용하여 증착 하였으며, 증착시 기판에 bias (-100 V)를 인가 하였다. 그 결과 회색계열, 갈색계열 등 여러가지 색을 구현할 수 있었으며, 증착된 박막의 특성을 알아보기 위하여 색차계, 내마모 시험기, 연필경도 시험기를 사용하였다. 향후 후처리 공정으로 내지문(AF ; anti fingerprint coating) 박막 등과 같은 실용적인 박막을 증착할 계획이다.

• Korean Journal of Materials Research
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• v.4 no.3
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• pp.280-286
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• 1994

As-grown $YBa_2Cu_3O_{7-x}$ films on MgO(100)substrates were prepated by a reactive co-evaporation method, and effects of activated oxygen plasma on the crystallinity and superconductivity at substrate temperature ranging from $450^{\circ}C$ to $590^{\circ}C$ were investigated. The film deposited under the activated oxygen plasma at the substrate temperature of $590^{\circ}C$ had a single crystal phase. Whereas, when films were deposited under only oxygen gas, they were not in perfect single crystal phase but with slight polycrystalline nature. When the substrate temperature was $590^{\circ}C$, $Tc_{zero}$'s were 83K and 80K for films with and without activated oxygen plasma, respectively. The critical temperature, the crystal structure and the surface morphology of as-grown films were found to be insensitive to the activated oxygen plasma which is introduced during deposition instead of oxygen gas, but the crystalline quality was improved somewhat by the introduction by the introduction of actvated oxygen plasma.