• Journal of the Korean Ceramic Society
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• v.28 no.8
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• pp.654-660
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• 1991

Stabilized Zirconia (3 mol % Yttria, 3Y-TZP) was joined with intermetallic compound NiTi which has similar thermal expansion coefficient. The optimum bonding condition was determined by the Taguchi Method. Under the optimum bonding condition, the 4-point bending strength was as high as 400 MPa. bonding interfaces were examined by optical microscope, SEM, and TEM; reaction products were identified by XRD and TEM, The relationship between products and strength was examined.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.552-553
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• 2005

In order to improve energy efficiency in the dilute trichloroethylene removal using the nonthermal plasma process, the barrier discharge treatment combined with manganese dioxide was experimentally studied. Reaction kinetics in this process was studied on the basis of final byproducts distribution. Decomposition efficiency was improved to about 99% at the specific energy 40J/L with passing through manganese dioxide. C=C $\pi$ bond cleavage in TCE gave DCAC (single bond, C-C) through oxidation reaction during the barrier discharge plasma treatment. Those DCAC were broken easily in the subsequent catalytic reaction due to the weak bonding energy about 3 ~ 4 eV compared with the double bonding energy in TCE molecules. Oxidation byproducts of DCAC and TCAA from TCE decomposition are generated from the barrier discharge plasma treatment and catalytic surface chemical reaction, respectively. Complete oxidation of TCE into $CO_X$ is required to about 400J/L.

• Journal of the Korean Magnetics Society
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• v.13 no.1
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• pp.6-14
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• 2003

The purpose of this study is to investigate the effect of chemical reaction with a bonding glass on physical and magnetic properties of Fe-Hf-N/SiO$_2$ and Fe-Hf-N/Cr/SiO$_2$ thin films. When the Fe-Hf-N/SiO$_2$ films were reacted with the bonding glass, the soft magnetic properties of them were extremely degraded. At $600^{\circ}C$, the saturation magnetization of the reacted film decreased to 1 kG, and its coercivity increased to 27 Oe, and its effective permeability decreased to 70. It was found that the degradation of soft magnetic properties of the Fe-Hf-N/SiO$_2$ films reacted with the bonding glass were attributed to the oxidation of the Fe-Hf-N layers to HfO$_2$ and Fe$_3$O$_4$. The soft magnetic properties of the Fe-Hf-N/Cr/SiO$_2$ films reacted with the bonding glass were degraded less than those of Fe-Hf-N/SiO$_2$ films. At $600^{\circ}C$, the saturation magnetization of the reacted film decreased to 13.5 kG, and its coercivity increased to 4 Oe, and its effective permeability decreased to 700. It was found that the Cr layer suppressed the oxidation of the Fe-Hf-N layers during the chemical reaction between the Fe-Hf-N layer and bonding glass.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2004.10a
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• pp.215-222
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• 2004

We synthesized a aziridine bonding agent that play an important role in increasing the adhesion property between polymer binders and solid particles. It increases the physical properties of polymer-based propellant. Chemical reaction between two materials increase the interface adhesion. We analyzed and studied the chemical characteristics of the material and physical properties of a liner applied the aziridine bonding agent. We also studied the adhesion property of a liner/propellant applied the aziridine bonding agent. 3M was use as control group. In accordance with US MIS (Missile Interim Specification) we examined the chemical properties. As a result of our study, newly synthesized aziridine bonding agent was as good as quality of 3M HX-868.

• Journal of the Korean Ceramic Society
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• v.33 no.10
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• pp.1109-1116
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• 1996

• Journal of Welding and Joining
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• v.29 no.6
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• pp.65-70
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• 2011

The effect of flip chip bonding parameters on formation of intermetallic compounds (IMCs) between Au stud bumps and Sn-3.5Ag solder was investigated. In this study, flip chip bonding temperature was performed at $260^{\circ}C$ and $300^{\circ}C$ with various bonding times of 5, 10, and 20 sec. AuSn, $AuSn_2$ and $AuSn_4$ IMCs were formed at the interface of joints and (Au, Cu)$_6Sn_5$ IMC was observed near Cu pad side in the joint. At bonding temperature of $260^{\circ}C$, $AuSn_4$ IMC was dominant in the joint compared to other Au-Sn IMCs as bonding time increased. At bonding temperature of $300^{\circ}C$, $AuSn_2$ IMC clusters, which were surrounded by $AuSn_4$ IMC, were observed in the solder joint due to fast diffusivity of Au to molten solder with increased bonding temperature. Bond strength of Au stud bump joined with Sn-3.5Ag solder was about 23 gf/bump and fracture mode of the joint was intergranular fracture between $AuSn_2$ and $AuSn_4$ IMCs regardless bonding conditions.

• Journal of Welding and Joining
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• v.25 no.3
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• pp.64-71
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• 2007

The dissolution phenomenon of the solid phase powder and base metal by liquid phase insert metal during Transient Liquid Phase bonding using the mixed powder composed of the modified GTD111(base metal) powder and the GNi3 (Ni-l4Cr-9.5Co-3.5Al-2.5B) powder was investigated. In case of the mixed powder contains modified GTD111 powder 50wt%, all of the powder was melted by liquid phase at 1423K. At the temperature between solidus and liquidus of GNi3, liquid phase penetrated into the boundary of the modified GTD111 powder and solid particle separated from powder was melted easily because area of reaction was increased. With increasing mixing ratio of the modified GTD111, it needed the higher temperature to melt all of the modified GTD111 powder. During Transient Liquid Phase bonding using the mixed powder composed of the modified GTD111 50wt% and GNi3 50wt% as insert metal, width of the bonded interlayer was increased with increasing bonding temperature by reaction of the base metal and liquid phase in insert metal. Dissolution of the base metal and modified powder by liquid phase progressed all together and after all of the powder was melted nearly, the dissolution of the base metal occurred quickly.

• Journal of Adhesion and Interface
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• v.1 no.1
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• pp.30-37
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• 2000

This study focused on the direct blending of bonding agents (resorcinol, hexamethylenetetramine, NaOH) into rubber compound to simplify the composite manufacturing process. The mechanism of direct blending system was studied by comparing the following two cases. The one is direct blending of bonding agents into rubber compound and then allows the reaction (Case I). The other is mixing of reactant obtained by reaction of bonding agents (Case II). According to the morphology analysis, the Case II showed the clean interfacial area between bonding agents and matrix rubber, while the Case I created the new interphase under proper processing condition. Also, the optimum adhesion strength between SBR and nylon cord could be obtained with bonding agents whose molar ratios of resprcinol/hexamethylenetetramine was 1.2/1 in the recipes.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.3
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• pp.292-300
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• 2006

In order to improve energy efficiency in the dilute trichloroethylene removal using the nonthermal plasma process, the barrier discharge treatment combined with manganese dioxide was experimentally studied. Reaction kinetics in this process was studied on the basis of final byproducts distribution. Decomposition efficiency was improved to about $99\;\%$ at the specific energy of 40 J/L with passing through manganese dioxide. C=C ${\pi}$ bond cleavage of TCE substances gave DCAC, which has the single bond of C-C through oxidation reaction during the barrier discharge plasma treatment. Those DCAC were broken easily in the subsequent catalytic reaction due to the weak bonding energy about $3{\sim}4\;eV$ compared with the double bonding energy in TCE molecules. Oxidation byproducts of DCAC and TCAA from TCE decomposition are generated from the barrier discharge plasma treatment and catalytic surface chemical reaction, respectively. Complete oxidation of TCE into COx is required to about 400 J/L, but $CO_2$ selectivity remains about $60\;\%$.

• Bulletin of the Korean Chemical Society
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• v.13 no.2
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• pp.122-127
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• 1992

Some perovskites $A($Cu_{1}3}Nb_{2}3}$)O_3(A=$Sr^{2+}$$, $Ba^{2+}$ and $Pb^{2+}$) and their series of mixed perovskites have been prepared by solid state reaction. Single perovskite phase was obtained in Sr or Ba rich samples, but pyrochlore phase was found in Pb rich samples. The stability of perovskite phase is dependent on the ionicity of bonding as well as the tolerance factor. All the obtained perovskites have tetragonal symmetry distorted by Jahn-Teller effect of $Cu^{2+}$. In the case of $Sr(Cu_{1}3}Nb_{2}3})O_3$, some superlattice lines caused by threefold enlarging of fundamental unit cell were observed. And, the symmetry of B site octahedron and the bonding character of B-O bond have been studied by IR, ESR and diffuse reflection spectroscopy. It appeared that the symmetry and the bonding character are influenced by such factors as the size and the basicity of A cation.