• 한국세라믹학회지
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• 제28권8호
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• pp.654-660
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• 1991

Stabilized Zirconia (3 mol % Yttria, 3Y-TZP) was joined with intermetallic compound NiTi which has similar thermal expansion coefficient. The optimum bonding condition was determined by the Taguchi Method. Under the optimum bonding condition, the 4-point bending strength was as high as 400 MPa. bonding interfaces were examined by optical microscope, SEM, and TEM; reaction products were identified by XRD and TEM, The relationship between products and strength was examined.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.552-553
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• 2005

In order to improve energy efficiency in the dilute trichloroethylene removal using the nonthermal plasma process, the barrier discharge treatment combined with manganese dioxide was experimentally studied. Reaction kinetics in this process was studied on the basis of final byproducts distribution. Decomposition efficiency was improved to about 99% at the specific energy 40J/L with passing through manganese dioxide. C=C $\pi$ bond cleavage in TCE gave DCAC (single bond, C-C) through oxidation reaction during the barrier discharge plasma treatment. Those DCAC were broken easily in the subsequent catalytic reaction due to the weak bonding energy about 3 ~ 4 eV compared with the double bonding energy in TCE molecules. Oxidation byproducts of DCAC and TCAA from TCE decomposition are generated from the barrier discharge plasma treatment and catalytic surface chemical reaction, respectively. Complete oxidation of TCE into $CO_X$ is required to about 400J/L.

• 한국자기학회지
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• 제13권1호
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• pp.6-14
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• 2003

열처리 온도에 따라 접합유리와의 화학적 반응이 Fe-Hf-N/SiO$_2$, 및 Fe-Hf-N/Cr/SiO$_2$ 박막의 물리적, 자기적 특성에 미치는 영향을 고찰하였다. 접합유리와 반응된 Fe-Hf-N/SiO$_2$ 박막의 연자기 특설은 온도가 증가함에 따라 크게 떨어졌으며, $600^{\circ}C$에서 포화자화값은 1 kG, 보자력이 27 Oe, 10MHz에서의 유효투자율이 70로 자기적 특성이 급격히 열화되었다. 이는 접합유리와의 화학적 반응에 의해 Fe-Hf-N 박막이 H$_{f}$ O$_2$, Fe$_3$O$_4$ 등으로 산화되기 때문인 것으로 나타났다. Fe-Hf-N/Cr/SiO$_2$ 박막의 경우, $600^{\circ}C$에서 포화자화값 13.5kG, 보자력은 4Oe, 10 MHz에서의 유효 투자율이 700으로 Fe-Hf-N/SiO$_2$ 박막보다 연자기 특성 열화가 덜 일어났다. 이는 Fe-Hf-N/Cr/SiO$_2$ 박막의 Cr 층이 Fe-Hf-N 박막의 산화를 억제하여. 일부에서만 HfO$_2$가 생성되고 나머지는 원래의 $\alpha$-Fe상을 유지하기 때문인 것으로 나타났다.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2004년도 제23회 추계학술대회 논문집
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• pp.215-222
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• 2004

본 논문에서는 고분자의 바인더와 고체불질 사이의 결합력을 증진시켜 물성을 향상시키는 역할과 화학결합에 의한 두 재질간의 접착력을 향상시킬 목적으로 사용되는 Aziridine계 bonding agent를 합성하여 이화학 특성을 분석하고 이를 라이너에 적용하였을 때 불성 및 접착력 특성에 관한 연구를 하였다. 비교 실험을 진행하기 위해 미국 3M사에서 제조한 HX-868을 통일한 조건에서 사용했고 미국규격에 규정된 항목과 각 항목에 대한 표준화된 방법으로 분석하였다. 그 결과 국내기술로 합성한 HX-868이 미국에서 제조된 HX-868과 통일한 품질 수준으로 갖는 것으로 평가되었다.

• 한국세라믹학회지
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• 제33권10호
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• pp.1109-1116
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• 1996

• Journal of Welding and Joining
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• 제29권6호
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• pp.65-70
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• 2011

The effect of flip chip bonding parameters on formation of intermetallic compounds (IMCs) between Au stud bumps and Sn-3.5Ag solder was investigated. In this study, flip chip bonding temperature was performed at $260^{\circ}C$ and $300^{\circ}C$ with various bonding times of 5, 10, and 20 sec. AuSn, $AuSn_2$ and $AuSn_4$ IMCs were formed at the interface of joints and (Au, Cu)$_6Sn_5$ IMC was observed near Cu pad side in the joint. At bonding temperature of $260^{\circ}C$, $AuSn_4$ IMC was dominant in the joint compared to other Au-Sn IMCs as bonding time increased. At bonding temperature of $300^{\circ}C$, $AuSn_2$ IMC clusters, which were surrounded by $AuSn_4$ IMC, were observed in the solder joint due to fast diffusivity of Au to molten solder with increased bonding temperature. Bond strength of Au stud bump joined with Sn-3.5Ag solder was about 23 gf/bump and fracture mode of the joint was intergranular fracture between $AuSn_2$ and $AuSn_4$ IMCs regardless bonding conditions.

• Journal of Welding and Joining
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• 제25권3호
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• pp.64-71
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• 2007

The dissolution phenomenon of the solid phase powder and base metal by liquid phase insert metal during Transient Liquid Phase bonding using the mixed powder composed of the modified GTD111(base metal) powder and the GNi3 (Ni-l4Cr-9.5Co-3.5Al-2.5B) powder was investigated. In case of the mixed powder contains modified GTD111 powder 50wt%, all of the powder was melted by liquid phase at 1423K. At the temperature between solidus and liquidus of GNi3, liquid phase penetrated into the boundary of the modified GTD111 powder and solid particle separated from powder was melted easily because area of reaction was increased. With increasing mixing ratio of the modified GTD111, it needed the higher temperature to melt all of the modified GTD111 powder. During Transient Liquid Phase bonding using the mixed powder composed of the modified GTD111 50wt% and GNi3 50wt% as insert metal, width of the bonded interlayer was increased with increasing bonding temperature by reaction of the base metal and liquid phase in insert metal. Dissolution of the base metal and modified powder by liquid phase progressed all together and after all of the powder was melted nearly, the dissolution of the base metal occurred quickly.

• 접착 및 계면
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• 제1권1호
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• pp.30-37
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• 2000

고무-섬유로 이루어진 고무복합체 제조공정을 단순화하기 위한 직접블렌딩 기술을 본 연구에서 제시하였다. 직접블렌딩 방법은 레소시놀, 헥사메틸테트라민, NaOH로 이루어진 결합체를 고무혼합물 배합공정에 직접 혼합하여 보강섬율의 접착제 처리공정을 생략할 수 있는 방법이다. 이러한 직접블렌딩 메커니즘을 규명하기 위해 결합체를 직접 고무혼합물에 블렌딩한 경우와(Case I) 결합체를 수용액 상에서 반응시켜 경화물을 얻은 후 이를 분쇄하여 고무혼합물에 배합하는 경우를(Case II) 비교하였다. 모폴로지 분석결과에 의하면 Case II의 경우 결합체와 매트릭스 고무 사이에 뚜렷한 계면이 발생하였지만, Case I의 경우 적절한 가공조건 아래서 결합제와 매트릭스 고무 사이의 반응에 의해 새로운 상이 생성됨을 알 수 있었다. 또한, SBR-나일론 고무복합체의 최적 성능을 위한 결합제의 최적 조성은 레소시놀과 헥사메틸렌테트라민의 mole비가 1.2:1인, 즉 레소시놀과 포름알데히드의 mole비가 1:5인 조성이었다.

• 한국전기전자재료학회논문지
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• 제19권3호
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• pp.292-300
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• 2006

In order to improve energy efficiency in the dilute trichloroethylene removal using the nonthermal plasma process, the barrier discharge treatment combined with manganese dioxide was experimentally studied. Reaction kinetics in this process was studied on the basis of final byproducts distribution. Decomposition efficiency was improved to about $99\;\%$ at the specific energy of 40 J/L with passing through manganese dioxide. C=C ${\pi}$ bond cleavage of TCE substances gave DCAC, which has the single bond of C-C through oxidation reaction during the barrier discharge plasma treatment. Those DCAC were broken easily in the subsequent catalytic reaction due to the weak bonding energy about $3{\sim}4\;eV$ compared with the double bonding energy in TCE molecules. Oxidation byproducts of DCAC and TCAA from TCE decomposition are generated from the barrier discharge plasma treatment and catalytic surface chemical reaction, respectively. Complete oxidation of TCE into COx is required to about 400 J/L, but $CO_2$ selectivity remains about $60\;\%$.

• Bulletin of the Korean Chemical Society
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• 제13권2호
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• pp.122-127
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• 1992

Some perovskites $A($Cu_{1}3}Nb_{2}3}$)O_3(A=$Sr^{2+}$$, $Ba^{2+}$ and $Pb^{2+}$) and their series of mixed perovskites have been prepared by solid state reaction. Single perovskite phase was obtained in Sr or Ba rich samples, but pyrochlore phase was found in Pb rich samples. The stability of perovskite phase is dependent on the ionicity of bonding as well as the tolerance factor. All the obtained perovskites have tetragonal symmetry distorted by Jahn-Teller effect of $Cu^{2+}$. In the case of $Sr(Cu_{1}3}Nb_{2}3})O_3$, some superlattice lines caused by threefold enlarging of fundamental unit cell were observed. And, the symmetry of B site octahedron and the bonding character of B-O bond have been studied by IR, ESR and diffuse reflection spectroscopy. It appeared that the symmetry and the bonding character are influenced by such factors as the size and the basicity of A cation.