• Title/Summary/Keyword: Radio Frequency Integrated Circuit (RFIC)

Search Result 14, Processing Time 0.023 seconds

Research and Development of RFIC Technology in Smart Temperature Information Material

  • Chang, Chih-Yuan;Hung, San-Shan;Chang, Yu-Chueh;Peng, Yu-Fang
    • Journal of Construction Engineering and Project Management
    • /
    • v.1 no.1
    • /
    • pp.18-23
    • /
    • 2011
  • Conservation of energy and fuel is the trend in smart building design. Radio Frequency Integrated Circuit (RFIC) technology is often used in temperature sensing and signal transmission to manage indoor temperature, but it is rarely applied to the shell of the building. Heat retention and poor insulation in building shells are the largest causes of high energy consumption by indoor air conditioning. Through combining RFIC technology with temperature sensors, this study will develop smart temperature information material that can be embedded in concrete. In addition to accurately evaluating the effectiveness of shell insulation material, the already-designed Building Physiology Information System can monitor long-term temperature changes, leading to smarter building health management.

RESEARCH AND DEVELOPMENT OF RFIC TECHNOLOGY IN SMART TEMPERATURE INFORMATION MATERIAL

  • Chih-Yuan Chang;San-Shan Hung;Yu-Chueh Chang;Yu-Fang Peng
    • International conference on construction engineering and project management
    • /
    • 2011.02a
    • /
    • pp.480-486
    • /
    • 2011
  • Conservation of energy and fuel is the trend in smart building design. Radio Frequency Integrated Circuit (RFIC) technology is often used in temperature sensing and signal transmission to manage indoor temperature, but it is rarely applied to the shell of the building. Heat retention and poor insulation in building shells are the largest causes of high energy consumption by indoor air conditioning. Through combining RFIC technology with temperature sensors, this study will develop smart temperature information material that can be embedded in concrete. In addition to accurately evaluating the effectiveness of shell insulation material, the already-designed Building Physiology Information System can monitor long-term temperature changes, leading to smarter building health management.

  • PDF

Highly Miniaturized On-Chip $180^{\circ}$ Hybrid Employing Periodic Ground Strip Structure for Application to Silicon RFIC

  • Yun, Young
    • ETRI Journal
    • /
    • v.33 no.1
    • /
    • pp.13-17
    • /
    • 2011
  • A highly miniaturized on-chip $180^{\circ}$ hybrid employing periodic ground strip structure (PGSS) was realized on a silicon radio frequency integrated circuit. The PGSS was placed at the interface between $SiO_2$ film and silicon substrate, and it was electrically connected to top-side ground planes through the contacts. Owing to the short wavelength characteristic of the transmission line employing the PGSS, the on-chip $180^{\circ}$ hybrid was highly miniaturized. Concretely, the on-chip $180^{\circ}$ hybrid exhibited good radio frequency performances from 37 GHz to 55 GHz, and it was 0.325 $mm^2$, which is 19.3% of a conventional $180^{\circ}$ hybrid. The miniaturization technique proposed in this work can be also used in other fields including compound semiconducting devices, such as high electron mobility transistors, diamond field effect transistors, and light emitting diodes.

Development of Short-Wavelength Transmission Line Employing Periodically Perforated Ground Metal for Application to Miniaturized On-chip Passive Components on Si RFIC (Si RFIC상의 온칩 수동소자에의 응용을 위한 주기적 접지 금속막 선로를 이용한 단파장 전송선로 개발)

  • Joh, Han-Nah;Park, Young-Bae;Yun, Young
    • Journal of Advanced Marine Engineering and Technology
    • /
    • v.32 no.2
    • /
    • pp.330-335
    • /
    • 2008
  • In this study, highly miniaturized short-wavelength transmission line employing periodically perforated ground metal (PPGM) structures were developed for application to miniaturized on-chip passive component on Si RFIC. The transmission line employing PPGM structure showed shorter wavelength and lower characteristic impedance than conventional coplanar-type transmission line. The wavelength of the transmission line employing PPGM structure was 57% of the conventional coplanar-type transmission line on Si Radio Frequency Integrated Circuit (RFIC) substrate. Basic characteristics of the transmission line employing PPGM structure were also investigated in order to evaluate its suitability for application to a development of miniaturized passive on-chip components. According to the results, it was found that the PPGM structure is a promising candidate for application to a development of miniaturized on-chip passive components on Si RFIC.

Study on Equivalent Circuit and Bandwidth of Short Wavelength Thin-film Transmission Line Employing ML/CPW composite structure for Miniaturization of wireless Communication System on RFIC (실리콘 RFIC 상에서 무선 통신 시스템의 소형화를 위한 마이크로스트립/코프레너 복합구조를 가지는 박막필름 전송선로의 등가회로 및 대역폭에 관한 연구)

  • Son, Ki-Jun;Jeong, Jang-Hyeon;Kim, Dong-Il;Yun, Young
    • Journal of Advanced Marine Engineering and Technology
    • /
    • v.39 no.1
    • /
    • pp.45-51
    • /
    • 2015
  • In this paper, we study the RF characteristics of the short wavelength thin-film transmission line employing microstrip line (ML)/coplanar waveguide (CPW) composite structure on silicon substrate for application to RFIC (radio frequency integrated circuit). The thin-film transmission line employing ML/CPW composite structure showed a wavelength shorter than conventional transmission lines. Concretely, at 10 GHz, the wavelength of the transmission line employing ML/CPW composite structure was 6.26 mm, which was 60.5 % of the conventional coplanar waveguide. We also extracted the bandwidth characteristic of the transmission line employing ML/CPW composite structure using equivalent circuit analysis. The S parameter of the equivalent circuit showed a good agreement with measured result. According to the bandwidth extraction result, the cut-off frequency of thin-film transmission line employing ML/CPW composite structure was 377 GHz. Above results indicate that the transmission line employing ML/CPW composite structure can be effectively used for application to broadband and compact RFIC.

SOP Package Modeling for RFIC (SOP RFIC 패키지 모델링)

  • 이동훈;어영선
    • Journal of the Korean Institute of Telematics and Electronics C
    • /
    • v.36C no.11
    • /
    • pp.18-28
    • /
    • 1999
  • A new equivalent circuit model of package (SOP, Small Outline Package) is presented for designing radio frequency integrated circuits (RFIC). In the RF region, the paddle of a package does not work as an ideal ground. Further parasitics due to both coupling and loss have a substantial effect on MMIC. The equivalent circuit model and parameter extraction methodology for the electrical characteristics of the package are described by illustrating the SOP type packages. The accuracy of the model is evaluated by comparing the s-parameters of the commercial full-wave solver and those of HSPICE simulation with the circuit model. The proposed model shows an excellent agreement with full-wave analysis up to about 8GHz.

  • PDF

A Miniaturized Broadband Impedance Transformer Employing Periodic Ground Structure for Application to Silicon RFIC (주기적 접지구조를 이용한 실리콘 RFIC용 광대역 소형 임피던스 변환기)

  • Young, Yun
    • Journal of Advanced Marine Engineering and Technology
    • /
    • v.35 no.4
    • /
    • pp.483-490
    • /
    • 2011
  • Using a coplanar waveguide employing periodic ground structure (PGS) on silicon substrate, a highly miniaturized and broadband impedance transformer was developed for application to low impedance matching in broadband. Concretely, the multi-section transformer was designed using Chebyshev polynomials design technique for ultra broadband operation. Its size was 0.026 $m^2$ on silicon substrate, which was 8.7 % of the one fabricated by conventional coplanar waveguide on silicon substrate. The transformer showed a good RF performance over a ultra broadband from 8 - 49.5 GHz.

A Development of Ultra-compact Passive Components Employing Periodic Ground Structure for Silicon RFIC (주기적 접지구조를 이용한 실리콘 RFIC용 초소형 수동소자의 개발)

  • Yun, Young;Kim, Se-Ho
    • Journal of Advanced Marine Engineering and Technology
    • /
    • v.33 no.4
    • /
    • pp.562-568
    • /
    • 2009
  • In this paper, using the periodic ground structure (PGS), highly miniaturized branch-line coupler and impedance transformer were realized on Si radio frequency integrated circuit (RFIC). The branch-line couple exhibited good RF performance from 41.75 to 50 GHz, and its size was $0.46{\times}0.55mm^2$, which is 37 % of conventional one. The impedance transformer exhibited good RF performance from 1 to 40GHz, and its size was $0.01mm^2$, which is 6.99 % of conventional one.

A study on the Field Solver Based pad effect deembedding technique of on-chip Inductor (온칩 인덕터의 필드 솔버 기반의 패드 효과 디임베딩 방법 연구)

  • Yoo, Young-Kil;Lee, Han-Young
    • Journal of the Institute of Electronics Engineers of Korea TC
    • /
    • v.44 no.7 s.361
    • /
    • pp.96-104
    • /
    • 2007
  • In this paper, the field solver based deembedding technique for the on-chip inductors to deembed the pad and surrounding ground effect was described, and the results from field solver based deembedding techniques and measurement based matrix calculation method were compared. In addition, LNA circuit is designed by using deembedded inductors and fabricated by using standard $0.25{\mu}m$ CMOS process, in the range over the 2.5GHz it shows the good agreements between measurement and simulation results when the proper deembedding was adapted. Supposed deembedding techniques can be used to get the pure on-chip devices's values and adapted to design accurate RFIC circuit design.

A Study on Basic Characteristics of a Coplanar-type Transmission Line Employing Periodic Structure on Si RFIC (Si RFIC상에서 주기적 구조를 이용한 코프레너형 전송선로의 기본특성연구)

  • Joh, Han-Nah;Park, Young-Bae;Yun, Young
    • Journal of Advanced Marine Engineering and Technology
    • /
    • v.32 no.6
    • /
    • pp.964-973
    • /
    • 2008
  • In this study, a short-wavelength coplanar-type transmission line employing periodic ground structure (PGS) was developed for application to miniaturized on-chip passive component on Si Radio Frequency Integrated Circuit (RFIC). The transmission line employing PGS showed shorter wavelength and lower characteristic impedance than conventional coplanar-type transmission line. The wavelength of the transmission line employing PGS structure was 57 % of the conventional coplanar-type transmission line on Si substrate. Using the theoretical analysis. basic characteristics of the transmission line employing PGS (e.g., bandwidth. loss, impedance, and resonance characteristics) were also investigated in order to evaluate its suitability for application to a development of miniaturized passive on-chip components on silicon RFIC. According to the results. the bandwidth of the transmission line employing PGS was more than 895 GHz as long as T is less than 20${\mu}m$, and the resonance characteristic was observed in 1239 GHz, which indicates that the PPGM structure is a promising candidate for application to a development of miniaturized on-chip passive components on Si RFIC.