• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.218-218
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• 2010

기존의 비휘발성 메모리 소자는 터널 절연막으로 $SiO_2$ 단일 절연막을 이용하였다. 그러나 소자의 축소화와 함께 비휘발성 메모리 소자의 동작 전압을 낮추기 위해서 $SiO_2$ 단일 절연막의 두께도 감소 시켜야만 하였다. 하지만 $SiO_2$ 단일 절연막의 두께 감소에 따라, 메모리의 동작 횟수와 데이터 보존 시간의 감소등의 문제점들로 인해 기술적인 한계점에 이르렀다. 이러한 문제점들을 해결하기 위한 연구가 활발히 진행되고 있는 가운데, 최근 high-k 물질을 기반으로 하는 Tunnel Barrier Engineered (TEB) 기술이 주목 받고 있다. TBE 기술이란, 터널 절연막을 위해 서로 다른 유전율을 갖는 유전체를 적층함으로써 쓰기/지우기 속도의 향상과 함께, 물리적인 두께 증가로 인한 데이터 보존 시간을 향상 시킬 수 있는 기술이다. 따라서, 본 연구에서는 적층된 터널 절연막에 이용되는 $HfO_2$를 FGA (Forming Gas Annealing)와 RTA (Rapid Thermal Annealing) 공정에 의한 열처리 효과를 알아보기 위해, 온도에 따른 전기적인 특성을 MIS-Capacitor 제작을 통하여 분석하였다. 이를 위해 먼저 Si 기판 위에 $SiO_2$를 약 3 nm 성장시킨 후, $HfO_2$를 Atomic Layer Deposition (ALD) 방법으로 약 8 nm를 증착 하였고, Aluminum을 약 150 nm 증착 하여 게이트 전극으로 이용하였다. 이를 C-V와 I-V 특성을 이용하여 분석함으로 써, 열처리 공정을 통한 $HfO_2$의 터널 절연막 특성이 향상됨을 확인 하였다. 특히, $450^{\circ}C$ $H_2/N_2$(98%/2%) 분위기에서 진행한 FGA 공정은 $HfO_2$의 전하 트랩핑 현상을 줄일 뿐 만 아니라, 낮은 전계에서는 낮은 누설 전류를, 높은 전계에서는 높은 터널링 전류가 흐르는 것을 확인 하였다. 이와 같은 전압에 대한 터널링 전류의 민감도의 향상은 비휘발성 메모리 소자의 쓰기/지우기 특성을 개선할 수 있음을 의미한다. 반면 $N_2$ 분위기에서 실시한 RTA 공정에서는, 전하 트랩핑 현상은 감소 하였지만 FGA 공정 후 보다는 전하 트랩핑 현상이 더 크게 나타났다. 따라서, 적층된 터널 절연막은 적절한 열처리 공정을 통하여 비휘발성 메모리 소자의 성능을 향상 시킬 수 있음이 기대된다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.631-634
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• 2004

The method that exists in Photodynamic Therapy uses Photosensibility drug strongly Influencing tumour accumulation together with photochemical laser effect and makes the structure of tumour be localized and become extinct. The intracavity transformation of the Nd :YAP main radiation 1079 nm was Raman converted in barium nitrate crystal and the Stokes frequency (1216 nm) was doubled using KTP or RTA crystals. The LiF or Cr:YAG crystals are used for the Q-switch. The radiation Parameters were obtained at 100 Hz pump repetition frequency. The average power at 608 nm radiation with LiF and KTP was 700 mW at multi-mode generation. The 3-6 single 10-15 ns pulses were generated during one cycle of pumping. The doubling efficiency with RTA was two times more than with KTP. The cells of Ehrlich adenocarcinoma (0.1 ml) were i.m. implanted in hind thighs of ICR white non-imbred mice. The cells were preliminarily diluted in medium 199 in the ratio of 1 to 5. HpD was intravenous administered in a dose of 10 mg/kg. The left clean-shaven hind leg was irradiated with laser light 21-27 hours after the administration of the preparation. The right non-Irradiated leg of each animal served as a control. The animals with the transplanted tumor that were not injected with HpD sewed as a control to estimate the complex effect (HpD+ irradiation). Before the administration of HpD and on 3 and 4 days after irradiation the tumor size was measured and the percent of the tumor growth inhibition was calculated. The results of animal treatments has shown high efficiency of PDT method for cancer treatment by means 0.608 m high power pulse solid state laser.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.28A no.12
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• pp.24-30
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• 1991

As a study to use Ti-silicides as interconnection material, the formation of Ti-silicides and the behavior of dopants were investigated for specimens where dopants are introduced on both single-Si substrate and poly-Si that was deposited on the single-Si. Result showed that stable C54 TiSiS12T formed above $700^{\circ}C$ and the formed TiSiS12T had bad surface roughness. And arsenics were chiefly redistributed in TiSiS12T while boron was accumulated near the interface between TiSiS11T and Si during RTA treatment.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.344-344
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• 2010

A capacitor with engineered tunnel barrier composed of High-k materials has been fabricated. Variable oxide thickness (VARIOT) barrier consisting of thin SiO2/HfO2/Al2O3 (2/1/3 nm) dielectric layers were used as engineered tunneling barrier. We studied the electrical characteristics of multi stacked tunnel layers for various RTA (Rapid Thermal Anneal) and FGA (Forming Gas Anneal) temperature.

• Electrical & Electronic Materials
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• v.10 no.9
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• pp.881-888
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• 1997

This study demonstrats the profiles of phosphorus ions in silicon by MeV implantation(1∼3 MeV). Implanted profiles could be measured by SIMS(Cameca 4f) and compared with simulation results(TRIM program and analytical description method only using on Pearson function). The experimental result in the peak concentration region has a little bit deviation from simulation data. By RBS and Channeling measurements the defect distribution of implanted samples could be measured and spectrum are calibrated depth with RUMP simulation By XTEM measurement the thickness of defect zone also could be measured. Finally thermal annealing for the electrical activation of implanted ions carried out by RTA(rapid thermal annealing). The concentration-depth profiles after heat treatment was measured by SR(spreading resistance)-method.

• Journal of the Korean institute of surface engineering
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• v.32 no.4
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• pp.503-512
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• 1999

The crystal structure and the microstructure of the intermetallic compounds formed in the interface between In solder and Au/Ni/Ti thin films have been investigated by XRD, SEM, and TEM. Indium solder was deposited on the Au/Ni/Ti thin films/Si substrate by evaporation. The heat treatments simulated the flip chip solder joining were performed in RTA system or in furnace. $Auln_2$ phase is formed in all specimens.$ In_{27}$ $Ni_{10}$ and/or $In_{X}$ $Ni_{Y}$ phase are formed in the interface between $Auln_2$ and Ni depending the heat treatment conditions.

• Journal of the Korean Institute of Telematics and Electronics
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• v.25 no.9
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• pp.1060-1067
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• 1988

In this paper, we have investigated the effects of rapid thermal process on the electrical and structural properties of silicon films. It was shown that required times and temperature for the successful activation of dopants (Boron, Phosphorus:5E15atoms/cm\ulcorner were above 1000\ulcorner, 10sec, respectively. The typical resistivities of films deposited below 600\ulcorner were in the range of 1.0 E-3ohm-cm which was 20-30% lower than that of initially polycrystalline silicon depositd above 600\ulcorner. After rapid thermal process at high temperature above 1000\ulcorner, the films did not reveal any change in resistivity due to the dopant segregation, and better electrical conductivity could be obtained by increasing the process time. The grain growth by RTA treatment was more salient in the case of the doped amorphous than that of initially polycrystalline. The surface of the films also preserved the higher structural perfection and surface smoothness.

• Korean Journal of Materials Research
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• v.13 no.3
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• pp.174-179
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• 2003

Thin copper films were grown by electrodeposition on copper seed layers which were grown by sputtering of an ultra-pure copper target on tantalum nitride-coated silicon wafers and subsequently, cleaned in ECR plasma. The copper films were then subjected to ⅰ) vacuum annealing, ⅱ) rapid thermal annealing (RTA) and ⅲ) rapid thermal nitriding (RTN) at various temperatures over different periods of time. XRD, SEM, AFM and resistivity measurements were done to ascertain the optimum heat treatment condition for obtaining film with minimum resistivity, predominantly (111)-oriented and smoother surface morphology. The as-deposited film has a resistivity of ∼6.3 $\mu$$\Omega$-cm and a relatively small intensity ratio of (111) and (200) peaks. With heat treatment, the resistivity decreases and the (111) peak becomes dominant, along with improved smoothness of the copper film. The optimum condition (with a resistivity of 1.98 $\mu$$\Omega$-cm) is suggested as the rapid thermal nitriding at 400oC for 120 sec.

• Journal of the Korean Ceramic Society
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• v.37 no.8
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• pp.731-738
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• 2000

KLN(K3Li2Nb5O15) has attracted a great deal of attention for their potential usefulness in piezoelectric, electro-optic, nonlinear optic, and pyroelectirc devices. Especially, the KLN single crystal has been studied in the field of optics and electronics. However it is hard to produce good quality single crystals due to the crack propagation during crystal growing. One of the solutions of this problem is prepartion of thin film. But the intensive study has not been conducted so far. In this study, after the KLN thin film were prepared by R.F. magnetron Sputtering method on SiO2/Si substrate, the post-annealing methods of RTA(rapid thermal annealin) and IPA(insitu post annealing) were employed. The deposition condition of KLN thin film was RF power(100 W), Working pressure(100 mtorr). The commonness of both RAT and IPA was that the higher were deposition and post annealing temperature, the higher was the intensity of XRD but the less surface roughness. The difference of post-annealing methods affected XRD phase and surface condition very much. And in IPA process, the influence of O2 had much effect on the formation of KLN phase.

• Journal of the Semiconductor & Display Technology
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• v.9 no.1
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• pp.41-47
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• 2010

The effects of thermal treatment on CNTs, which were coated with a-$CN_x$ thin film, were investigated and related to variations of chemical bonding and morphologies of CNTs and also properties of field emission induced by thermal treatment. CNTs were directly grown on nano-sized conical-type tungsten tips via the inductively coupled plasma-chemical vapor deposition (ICP-CVD) system, and a-$CN_x$ films were coated on the CNTs using an RF magnetron sputtering system. Thermal treatment on a-$CN_x$ coated CNT-emitters was performed using a rapid thermal annealing (RTA) system by varying temperature ($300-700^{\circ}C$). Morphologies and microstructures of a-$CN_x$/CNTs hetero-structured emitters were analyzed by FESEM and HRTEM. Chemical composition and atomic bonding structures were analyzed by EDX, Raman spectroscopy, and XPS. The field emission properties of the a-$CN_x$/CNTs hetero-structured emitters were measured using a high vacuum (below $10^{-7}$ Torr) field-emission measurement system. For characterization of emission stability, the fluctuation and degradation of the emission current were monitored in terms of operation time. The results were compared with a-$CN_x$ coated CNT-emitters that were not thermally heated as well as with the conventional non-coated CNT-emitters.