• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.50-50
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• 2011

The aluminum nitride films were prepared by RF magnetron sputtering using an AlN ceramic target. The crystallinity, grain size, Al-N bonding and thermal conductivity were investigated in dependence on the plasma power densities (4.93, 7.40, 9.87 W/$cm^2$) during sputtering. High thermal conductivity is important properties of A1N passivation layer for functioning properly in thermal inkjet printhead. The crytallinity, grain size, Al-N bonding formation and chemical composition were observed using X-ray diffraction (XRD), field emission scanning electron microscopy (FESEM), fourier transform infrared (FTIR) and X-ray photoelectron spectroscopy (XPS), respectively. The AlN thin film was changed from amorphous to crystalline as the power density was increased, and the largest grain size appeared at medium power density. The near stoichiometry Al-N bonding ratio was acquired at medium power density. So, we know that the AlN thin film had better thermal conductivity with crystalline phase and near stoichometry Al-N bonding ratio at 7.40 W/$cm^2$ power density.

• Korean Chemical Engineering Research
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• v.46 no.2
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• pp.408-413
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• 2008

In this work, the use of LPRTO (low pressure rapid thermal oxidation) and remote plasma oxidation was evaluated for the preparation of ultra thin silicon oxide layer with less than 5 nm. The silicon oxide thickness grown by LPRTO was rapidly increased and saturated. The maximum thickness could be controlled at about 5 nm. As RF power and oxygen flow rate at a remote plasma oxidation increased, the behavior of oxide growth was almost the same as that of LPRTO. The oxide thickness of 4 nm was the maximum obtained by a remote plasma oxidation in this work. The quality of silicon oxide grown by LPRTO was comparable to the thermally grown conventional oxide.

• Journal of the Korean Ceramic Society
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• v.38 no.11
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• pp.1037-1041
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• 2001

Silicon diosixde thick film using silica optical waveguide cladding was fabricated by Plasma Enhanced Chemical Vapor Deposition (PECVD) method, at a low temperature (32$0^{\circ}C$) and from (SiH$_4$+$N_2$O) gas mixtures. The effects of deposition parameters on properties of SiO$_2$thick films were investigated by variation of $N_2$O/SiH$_4$flow ratio and RF power. As the $N_2$O/SiH$_4$flow ratio decreased, deposition rate increased from 2.9${\mu}{\textrm}{m}$/h to maximum 10.1${\mu}{\textrm}{m}$/h. As the RF power increased from 60 W to 120 W, deposition rate increased (5.2~6.7 ${\mu}{\textrm}{m}$/h) and refractive index approached at thermally grown silicon dioxide (n=1.46).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.3
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• pp.299-304
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• 2004

In recent years, silicon carbide has emerged as an important material for MEMS application. In order to fabricate an SiC film based MEMS structure by using chemical etching method, high operating temperature is required due to high chemical stability Therefore, dry etching using plasma is the best solution. SiC film was deposited by thermal CVD at the temperature of 100$0^{\circ}C$ and pressure of 10 torr. SiC was dry etched with a reactive ion etching (RIE) system, using SF$_{6}$/O$_2$ and CF$_4$/O$_2$ gas mixture. Etch rate has been investigated as a function of oxygen concentration in the gas mixture, rf power, working pressure and gas flow rate. Etch rate was measured by surface profiler and FE-SEM. SF$_{6}$/O$_2$ gas mixture showed higher etch rate than CF$_4$/O$_2$ gas mixture. Maximum etch rate appeared at RF Power of 450W. $O_2$ dilute mixtures resulted in an increasing of etch rate up to 40％, and the superior anisotropic cross section was observe

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.868-871
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• 2003

In recent years, silicon carbide has emerged as an important material for MEMS application. In order to fabricate an SiC film based MEMS structure by using chemical etching method, high operating temperature is required due to high chemical stability. Therefore, dry etching using plasma is the best solution. SiC film was deposited by thermal CVD at the temperature of $1000^{\circ}C$ and pressure of 10 torr. SiC was dry etched with a reactive ion etching (RIE) system, using $SF_6/O_2$ and $CF_4/O_2$ gas mixture. Etch rate have been investigated as a function of oxygen concentration in the gas mixture, RF power, and working pressure. Etch rate was measured by surface profiler and FE-SEM. $SF_6/O_2$ gas mixture has been shown high etch rate than $CF_4/O_2$ gas mixture. Maximum etch rate appeared at 450W of RF power. $O_2$ dilute mixtures resulted in an increasing of etch rate up to 40%, and the superior anisotropic cross section was observed.

• Nuclear Engineering and Technology
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• v.55 no.9
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• pp.3126-3132
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• 2023

To meet the increasing heating needs of the China Fusion Experimental Tokamak Reactor (CFETR), the output power in each Lower Hybrid Current Drive (LHCD) transmission line should be increased from 250 kW to 500 kW. Therefore, a new high-power water load must be developed for the 4.6 GHz 500 kW LHCD system. This paper aims to report the most recent research progress of the water load: aluminum nitride (AlN) ceramic is used as the media material to isolate the water and vacuum, and the radio frequency (RF) simulation results show that the return loss of the water load is less than -25dB at 4.6 GHz over a wide temperature range. Under 500 kW continuous wave (CW) operation, the maximum temperatures of the ceramic and water are separately 67 ℃ and 62 ℃, resulting in thermal deformation of the ceramic of approximately 0.003 mm. Moreover, the AlN water load was tested on the 4.6 GHz 250 kW high-power test bench and found to work well with low reflected power.

• Applied Science and Convergence Technology
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• v.27 no.1
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• pp.14-18
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• 2018

In order to understand the mechanism of the synthesis of particles using a plasma torch, it is necessary to understand the reaction mechanisms using a computer simulation. In this study, we have developed a simulation method to combine the Lagrangian scheme to follow microparticles and a nodal method to treat nanoparticles categorized with different particle sizes. The Lagrangian scheme includes the Coulomb force which affects the dynamics of larger particles. In contrast, the nodal method is adequate for the nanoparticles because the charge effect is negligible for nanoparticles but the number of nanoparticles is much larger than that of microparticles. This method is helpful to understand the dynamics and growth mechanism of micro- and nano-powder mixture observed in the experiment.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.231.1-231.1
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• 2014

열 플라즈마(thermal plasma) 는 저온 플라즈마(cold plasma)와 달리 이온과 전자와 중성입자들이 충분한 에너지 교환으로 인해 열평형 상태를 가진다. 열 플라즈마를 생성 시킬 때 전극 사이에서 아크방전을 시켜 제트 형태로 플라즈마를 발생시키는 것을 플라즈마 토치(plasma torch)라고 한다. 이러한 플라즈마 토치는 화학 원소 분해, 강판 절단, 유해 기체 분해 등으로 널리 사용되고 있다. 본 연구에서는 플라즈마 토치를 수치적으로 해석하여 플라즈마의 특성을 알아보았다. 수치해석적 접근방법으로 열 플라즈마는 LTE (local thermodynamic equilibrium)을 가정하였으며 one-fluid 이론을 적용하였다. 이때 사용된 코드는 DCPTUN으로서 $C^{+}^{+}$로 작성된 열플라즈마 유동의 특성해석 코드인 동시에 SIMPLE 알고리즘을 이용한 유체 코드이다. 시뮬레이션은 2차원 축대칭이며 정렬격자계 및 비정렬격자계 모두에서 사용이 가능하도록 되어있다. 또한 맥스웰 방정식을 통해 electromagnetic field를 풀도록 하여 RF 시뮬레이션이 가능하도록 하였다. 이와 같은 열 플라즈마 시뮬레이션을 통해서 플라즈마 토치의 특성을 알아보았다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.4
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• pp.373-378
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• 2006

We report on plasma damage free-sputtering technologies for organic light emitting diodes (OLEDs), organic thin film transistor (OTFT) and flexible displays by using a box cathode sputtering (BCS) method. Specially designed BCS system has two facing targets generating high magnetic fields ideally entering and leaving the targets, perpendicularly. This target geometry allows the formation of high-density plasma between targets and enables us to realize plasma damage free sputtering on organic layer without protection layer against plasma. The OLED with Al cathode prepared by BCS shows electrical and optical characteristics comparable to OLED with thermally evaporated Mg-Ag cathode. It was found that OLED with Al cathode layer prepared by BCS has much lower leakage current density ($1{\times}10^{-5}\;mA/cm^2$ at -6 V) than that $(1{\times}10^{-2}{\sim}-10^0\;mA/cm^2)$ of OLED prepared by conventional DC sputtering system. This indicates that BCS technique is a promising electrode deposition method for substituting conventional thermal evaporation and DC/RF sputtering in fabrication process of organic based optoelectronics.

• Journal of Adhesion and Interface
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• v.10 no.1
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• pp.17-22
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• 2009

Polymer thin films were prepared by radio frequency (RF) plasma polymerization of phthalic anhydride (PA). First, monomer vaporization temperature ($100{\sim}160^{\circ}C$) was optimized by evaluating the thermal properties of thin films using differential scanning calorimeter (DSC) and measuring the root-mean-square (RMS) roughness with atomic force microscope (AFM) at the fixed plasma power of 10 W and time of 5 min in a continuous-wave (CW) mode. Plasma power (5~20 W) was then optimized by measuring the film solubility in solvents such as toluene, acetone, dimethylsulfoxide (DMSO) and 1 methylpyrrolidine (NMP). Next, pulsed mode plasma polymerization was also studied by varying the duty cycle of on-time (5, 20%) under optimized conditions of continuous-wave (CW) mode ($120^{\circ}C$, 10 W) in order to increase the anhydride functional groups. Finally, polymer thin films were characterized by Fourier transform infrared spectroscopy (FT-IR), thermogravimetric analyzer (TGA) and ${\alpha}$-step.