• 한국수산과학회지
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• 제20권4호
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• pp.317-327
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• 1987

틸라피아(Tilapia mossambica)에 대한 간흡충의 제2중간정도로서의 역할 여부를 구명하기 위한 일환으로 우선 간흡충 유미유충의 틸라피아 치어에 대한 인공감염실험을 수행하여 그 역할을 할 수 없다는 사실을 천명한 다음 그 방어기전을 규명하기 위하여 그 체표면 점액으로부터 살충성 물질을 순수분리하여 기기분석을 통하여 그 화학적 구조를 확인한 결과를 요약하면 다음과 같다. 1. 입체현미경하에서 틸라피아 치어를 유미유충에 조우를 시도한 바 일반적으로 유미유충은 수분 후에 미부가 체부로부터 분리하기 시작하여 시간이 경과함에 따라 그 수가 증가하여 10여분 후에는 $80\%$에 이르렀으나 극히 소수의 유미유충은 어체표면에 부착한 채 체부만이 어체내로 침입하고 미부는 분리되었다. 2. 틸라피아 치어를 실내수조에서 유미유충에 24시간 노출시킨 바 일부 유미유충은 어체내로 침입하였으나 그 대부분이 피낭한 극소수도 4.2 시간 이내에 거의 모두 사감하였다. 3. 틸라피아의 체표면 점액의 에테르 추출물을 여러 단계의 화학적 처리를 거쳐 제3단계에서 분획한 유백색 상청액을 박막크로마토그라휘하여 얻은 2개의 반점물질을 간흡충의 탈낭유충에 in vitro에서 직접 접촉시켜 살충시험을 수행한 바 그 중에서 제1반점인 Rf. 0.2966 값의 물질이 다른 것에 비교하여 살충성의 월등하게 강력하였다. 4. 틸라피아의 체표면 점액의 에테르 유출물 66.50g으로부터 138mg의 살충성 순수물질이 회수되었으며, 그 수율은 $0.2075\%$, 그 정제도는 71배이었다. 5. 순수하게 분리된 살충성물질에 대하여 적외선, 자외선 및 핵자기공명 분광분석을 이용하여 구조확인을 하였던 바 이 물질은 linoleic acid로 판명되였다. 이상의 실험결과로 미루어 보아 틸라피아는 자연계에 있어서 간흡충의 제2중간숙주 역할을 할 수 없으며, 그 체표면 정액내의 살충성물질인 linoleic acid가 그 방제기전에 관여하고 있다고 생각한다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.77-77
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• 2016

Thin films synthesized by plasma processes have been widely applied in a variety of industrial sectors. The structure control of thin film is one of prime factor in most of these applications. It is well known that the structure of this film is closely associated with plasma parameters and species of plasma which are electrons, ions, radical and neutrals in plasma processes. However the precise control of structure by plasma process is still limited due to inherent complexity, reproducibility and control problems in practical implementation of plasma processing. Therefore the study on the fundamental physical properties that govern the plasmas becomes more crucial for molecular scale control of film structure and corresponding properties for new generation nano scale film materials development and application. The thin films are formed through nucleation and growth stages during thin film depostion. Such stages involve adsorption, surface diffusion, chemical binding and other atomic processes at surfaces. This requires identification, determination and quantification of the surface activity of the species in the plasma. Specifically, the ions and neutrals have kinetic energies ranging from ~ thermal up to tens of eV, which are generated by electron impact of the polyatomic precursor, gas phase reaction, and interactions with the substrate and reactor walls. The present work highlights these aspects for the controlled and low-temperature plasma enhanced chemical vapour disposition (PECVD) of Si-based films like crystalline Si (c-Si), Si-quantum dot, and sputtered crystalline C by the design and control of radicals, plasmas and the deposition energy. Additionally, there is growing demand on the low-temperature deposition process with low hydrogen content by PECVD. The deposition temperature can be reduced significantly by utilizing alternative plasma concepts to lower the reaction activation energy. Evolution in this area continues and has recently produced solutions by increasing the plasma excitation frequency from radio frequency to ultra high frequency (UHF) and in the range of microwave. In this sense, the necessity of dedicated experimental studies, diagnostics and computer modelling of process plasmas to quantify the effect of the unique chemistry and structure of the growing film by radical and plasma control is realized. Different low-temperature PECVD processes using RF, UHF, and RF/UHF hybrid plasmas along with magnetron sputtering plasmas are investigated using numerous diagnostics and film analysis tools. The broad outlook of this work also outlines some of the 'Grand Scientific Challenges' to which significant contributions from plasma nanoscience-related research can be foreseen.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 D
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• pp.1550-1552
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• 1999

In this study, (Ba,Sr)$TiO_3$ thin films were etched with a magnetically enhanced inductively coupled plasma (MEICP) as a function $CF_4$/Ar gas mixing ratio. Experimental was done by varying the etching parameters such as rf power, dc bias and chamber pressure. The maximum etch rate of the BST films was $1700{\AA}$/min under $CF_4/(CF_4+Ar)$ of 0.1, 600W/350V and 5 mTorr. The selectivity of BST to Pt and PR was 0.6, 0.7, respectively. X-ray photoelectron spectroscopy (XPS) studies shows that there are surface reaction between Ba, Sr, Ti and C, F radicals during the (Ba,Sr)$TiO_3$ etching. To analysis the composition of surface residue remaining after the etching, films etched with different $CF_4$/Ar gas mixing ratio were investigated using XPS.

• ETRI Journal
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• 제34권6호
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• pp.885-891
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• 2012

This paper proposes a high-efficiency power amplifier (PA) with uneven bias. The proposed amplifier consists of a driver amplifier, power stages of the main amplifier with class AB bias, and an auxiliary amplifier with class C bias. Unlike other CMOS PAs, the amplifier adopts a current-mode transformer-based combiner to reduce the output stage loss and size. As a result, the amplifier can improve the efficiency and reduce the quiescent current. The fully integrated CMOS PA is implemented using the commercial Taiwan Semiconductor Manufacturing Company 0.18-${\mu}m$ RF-CMOS process with a supply voltage of 3.3 V. The measured gain, $P_{1dB}$, and efficiency at $P_{1dB}$ are 29 dB, 28.1 dBm, and 37.9%, respectively. When the PA is tested with 54 Mbps of an 802.11g WLAN orthogonal frequency division multiplexing signal, a 25-dB error vector magnitude compliant output power of 22 dBm and a 21.5% efficiency can be obtained.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.165-165
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• 2012

비정질의 Tantalum-indium-zinc oxide (TIZO) 박막 트랜지스터는 RF-sputtering 방법으로 증착되었으며 소결된 단일 타겟을 사용하였다. 증착당시 반응 가스는 알곤과 산소를 95 : 5로 섞어 반응성 스퍼터링을 진행하였으며, 1 mtorr에서 5 mtorr까지 다양한 공정압력에서 증착한 이 후 Furnace system을 통하여 $350^{\circ}C$의 온도로 1시간 동안 후열처리 공정을 진행하였다. 비정질 TIZO 박막을 활성 층으로 사용하여 제작한 박막 트랜지스터는 공정압력이 낮아짐에 따라 높은 이동도와 낮은 subthrehsold gate swing 보였다. 이러한 현상의 원인을 규명하고자 물리적, 전기적, 광학적 분석을 통하여 공정압력의 변화가 박막 트랜지스터 구동에 미치는 영향을 해석하였다. 우선 공정압력에 따른 TIZO 박막의 Ta, In, Zn, O 각각의 조성을 분석하기 위하여 Rutherford back scattering (RBS) 분석을 실시하였다. 또한 X-선 회절(X-ray diffraction)분석을 통해 열처리된 TIZO 박막은 공정압력에 따라 물리적 구조의 변화를 일으키지 않으며 모든 박막은 비정질상을 보이는 것을 확인하였다. 3.3eV의 광학적 밴드 갭은 기존에 보고되었던 비정질 산화물 반도체(InGaZnO, HfInZnO 등)와도 유사한 밴드갭을 가지고 있음을 확인하였다. 또한, spectroscopic ellipsometry (SE)분석을 통하여 전도대 이하 밴드 갭 내에 존재하는 결함상태 및 전도대에서 결함상태까지의 에너지 준위 그리고 공정압력에 따라 결함의 양과 발생되는 에너지 준위가 변화하는 현상을 관측하였다. 박막을 제조 할 때의 공정압력은 박막 내의 결함의 양 및 발생되는 에너지 준위의 변화를 야기하고 변화된 결함의 양과 발생된 에너지 준위에 따라 박막트랜지스터의 전기적 특성을 변화시킨다는 결과를 도출하였다.

• 한국전기전자재료학회논문지
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• 제23권9호
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• pp.685-690
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• 2010

ZnO with the wide band gap near 3.37 eV is typically an n-type semiconductor in which deviation from stoichiometry is electrically active. It was known that the films with a resistivity of the order of $10^{-4}{\Omega}cm$ is not easy to obtain. In order to improve electrical characteristic of ZnO, we added 1, 3, 5 wt% Ga element in ZnO. The Ga-doped ZnO (GZO) was grown on a glass substrate by radio frequency (RF) magnetron sputtering at the temperature range from 100 to $500^{\circ}C$. X-ray diffraction (XRD) patterns of GZO films showed preferable crystal orientation of (002) plane. The lowest resistivity of the GZO films was $8.9{\times}10^{-4}{\Omega}cm$. GZO films significantly influenced by the working temperature. The average transmittance of the films was over 80% in the visible ranges.

• Transactions on Electrical and Electronic Materials
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• 제4권3호
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• pp.1-4
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• 2003

The etching of Au thin films has been performed in an inductively coupled $CF_4 / Cl_2 / Ar$ plasma. The etch properties including etch rate and selectivity were examined as $CF_4$ content adds from o to $30\%$ to $Cl_2/Ar$ plasma. The $Cl_2/(Cl_2 + Ar)$ gas mixing ratio was fixed at $20\%$. Other parameters were fixed at an rf power of 700 W, a dc bias voltage of -150 V, a chamber pressure of 15 mTorr, and a substrate temperature of $30^{\circ}C$. The highest etch rate of the Au thin film was 370 nm/min at a $10\%$ additive $CF_4$ into $Cl_2/Ar$ gas mixture. The surface reaction of the etched Au thin films was investigated using x-ray photoelectron spectroscopy (XPS) analysis. The XPS analysis shows that the intensities of Ail peaks are changed, indicating that there is a chemical reaction between Cl and Au. Au-Cl is hard to remove on the surface because of its high melting point. However, etching products can be sputtered by Ar ion bombardment.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 추계학술대회 논문집 학회본부 C
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• pp.740-742
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• 1998

In this paper, we described the effect of rapid thermal annealing on the electrical properties of interfacial layer between various top electrodes and $(Ba_{0.5}Sr_{0.5})TiO_3$ thin films. BST thin films were fabricated on Pt/TiN/$SiO_2$/Si substrate by RF magnetron sputtering technique. AI, Ag, and Cu films for the formation of top electrode were deposited on BST thin films by thermal evaporator. Top electrodes/BST/Pt capacitor annealed with rapid thermal annealing at various temperature. In $(Ba_{0.5}Sr_{0.5})TiO_3$ thin films with Cu top electrode annealed at $500^{\circ}C$, the dielectric constant was measured to the value of 366 at 1.2 [kHz] and the leakage current was obtained to the value of $5.85{\times}10^{-7}\;[A/cm^2}$ at the forward bias of 2 [V].

• 한국전기전자재료학회논문지
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• 제15권11호
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• pp.933-938
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• 2002

(Ba,Sr)TiO$_{4}$ (BST) thin films on Pt/Ti/SiO$_{2}$/Si substrates were deposited by a sol-gel method and the etch characteristics of BST thin films have been investigated as a function of gas mixing ratio. The maximum etch rate of the BST films was 440 $AA$/min under such conditions as: CF$_{4}$(CF$_{4}$＋Ar) of 0.2, RF-power of 700 W, DC-bias voltage of -200 V, pressure of 15 mTorr and substrate temperature of 30 $^{circ}C$. The selectivities of BST to Pt, SiO$_{2}$ and PR were 0.38, 0.25 and 0.09, respectively. In the XPS (X-ray photoelectron spectroscopy) analysis, Barium (Ba) and Strontium (Sr) component in BST thin films formed low volatile compounds such as BaFx, SrFx, which are forms by the chemical reaction with F atoms and is removed by Ar ion bombardment. Titanium (Ti) is removed by chemical reaction such as TiF with ease. The result of secondary ion mass spectrometry (SIMS) analysis confirmed the existence of the BaFx, SrFK, TiFx.

• JSTS:Journal of Semiconductor Technology and Science
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• 제16권1호
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• pp.39-43
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• 2016

The structural, electrical properties of Ga doped MgZnO transparent conductive oxide (TCO) films by ratio-frequency(RF) magnetron sputtering were investigated. Ga doped MgZnO TCO films were deposited on the sapphire substrates at $200^{\circ}C$ varying growth thickness 200 to 600 nm. The optical properties of Ga doped MgZnO TCO films were showed above 85% transmittance from 300 to 1000 nm region. In addition, the current density ($J_{SC}$) of $Cu(In,Ga)Se_2$ (CIGS) solar cells was improved by using the MgZnO:Ga films of 500 nm thickness because of outstanding electrical properties. The $Cu(In,Ga)Se_2$ solar cells with MgZnO:Ga transparent conducing layer yielded an efficiency of 9.8% with current density ($31.8mA/cm^2$), open circuit voltage (540.2 V) and fill factor (62.2) under AM 1.5 illumination.