• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.702-702
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• 2013

태양전지에서 SiNX층은 반사방지막 역할과 태양전지 소자 보호 역할 2가지를 동시에 하고 있다. 태양전지에서 반사방지막은 굴절률 1.97, 두께 76 nm가 이론적으로 최적의 상태이다. PECVD장비를 이용하여 SiNx 층을 증착하였다. SiNX층 증착 시에 RF 파워와 혼합 가스를 변화한 후 굴절률을 측정하였다. RF 파워는 100~400 W로 변화시켰고 혼합가스 변화는 SiH4가스와 N2, H2, N2+H2 가스 각각을 같이 넣어 주면서 증착하였다. SiNX 가스 자체에 N2가 80%섞여 있는 가스를 사용하기 때문에 SiH4 가스자체 만으로도 SiNx층을 형성 할 수 있다. RF파워 300 W, SiH4 50 sccm, 기판 온도 $300^{\circ}C$, 공정시간 63초에서 굴절률 1.965, 두께 76 nm를 갖는 SiNx층을 형성 할 수 있었고 개방전압: 0.616 V, 전류밀도: 37.78 mA/$cm^2$, 충실도:76.59%, 효율: 17.82%로 가장 높은 효율을 얻을 수 있었다.

• 전자통신동향분석
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• 제27권1호
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• pp.74-85
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• 2012

차세대 화합물 반도체 플랫폼으로 각광을 받고 있는 GaN 전자소자 글로벌 연구개발 동향에 관하여 기술하고자 한다. GaN 전자소자는 와이드 밴드갭(Eg=3.4eV)과 고온 안정성($700^{\circ}C$) 등 재료적인 특징으로 인하여 고출력 RF 전력증폭기와 고전력용 전력반도체 응용에 큰 장점을 가진다. GaN 전자소자 기술동향에서는 먼저 미국, 유럽, 일본을 중심으로 한 대형 국책 연구프로젝트 분석을 통한 RF 전력증폭기 연구개발 방향을 살펴보고, 후반부에서는 이동통신 기지국, 선박 및 군용 레이더 트랜시버용 고출력 RF 전력증폭기의 응용 분야에 관하여 알아본다. 이러한 총체적인 동향분석을 통하여 차세대 반도체의 신시장 개척과 선진입을 위한 GaN 전자소자의 연구개발 방향과 조기상용화의 중요성을 함께 생각해보고자 한다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 학술회의 논문집 정보 및 제어부문 A
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• pp.339-342
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• 2003

This paper describes an RF/IF module for 2.4GHz wireless video and audio receivers The designed circuits are implemented using a Teflon board of which the size is $53mm\times42mm$. The measured LNA gain is 15dB, and the VCO output levels are around 2dBm. The sensitivity of the receiver is about -80dBm. The manufactured module consumes 140nA from a 8V supply.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1997년도 추계학술대회 논문집
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• pp.173-176
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• 1997

The III-V nitride semiconductor InN thin films which have the direct bandgap in visible light wavelength region have been deposited on Si(100) substrates and AIN/Si(100) substrates by rf reactive sputtering. InN thin films have been investigated on the structural, and electrical properties according to the sputtering parameters such as total pressure, rf power, and substrate temperature. It is found that optimal conditions required for fabricating InN thin films with high crystal Quality, low carrier concentration, high Hall mobility are total pressure 5mTorr, rf power 60W, substrate temperature 6$0^{\circ}C$ . InN thin films deposited on the AIN(60min.)/Si(100) substrates arid AIN(120min.)/Si(100) substrates showed remarkably high crystal quality and electrical properties. It is known that AIN buffer layer is to decrease free energy at interface between InN film and Si substrate, and then promoting lateral growth of InN films.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2001년도 전력전자학술대회 논문집
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• pp.534-537
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• 2001

This paper deals with the active clamp ZVS flyback converter for RF generator. The proposed converter has the characteristics of the low switching noise and high efficient regarding conventional flyback converter. To verify validity of the proposed converter, the 100kHz, 48V, 300W converter are simulation and experimental result. This converter will be apply to the discharge drive circuit for PDP(Plasma Display Panel) TV.

• Journal of Electrical Engineering and Technology
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• 제13권4호
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• pp.1638-1643
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• 2018

Multi-layer ceramic capacitors as decoupling capacitor were fabricated by dielectric composition with a high dielectric constant. The fabricated decoupling capacitors were embedded in the PCB of the 10G RF transceiver module and evaluated for the characteristics of electrical noise by the level of AC input voltage. In order to further improve the electrical properties of the $BaTiO_3$ based composite, glass frit, MgO, $Y_2O_3$, $Mn_3O$, $V_2O_5$, $BaCO_3$, $SiO_2$, and $Al_2O_3$ were used as additives. The electrical properties of the composites were determined by various amounts of additives and optimum sintering temperature. As a result of the optimized composite, it was possible to obtain a density of $5.77g/cm^3$, a dielectric constant of 1994, and an insulation resistance of $2.91{\times}10^{12}{\Omega}$ at an additive content of 5wt% and a sintering temperature of $1250^{\circ}C$. After forming a $2.5{\mu}m$ green sheet using the doctor blade method, a total of 77 layers were laminated and sintered at $1180^{\circ}C$. A decoupling capacitor with a size of $0.6mm(W){\times}0.3mm(L){\times}0.3mm(T)$ (width, length and thickness, respectively) and a capacitance of 100 nF was embedded using a PCB process for the 10G RF Transceiver modules. In the range of AC input voltage 400mmV @ 500kHz to 2200mV @ 900kHz, the embedded 10G RF Transceiver modules evaluated that it has better electrical performance than the non-embedded modules.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 추계학술대회 논문집
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• pp.240-243
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• 1999

(Sr$\sub$0.85/Ca$\sub$0.15/)TiO$_3$thin films were deposited on Pt-coated TiO$_2$/SiO$_2$/Si wafer by the rf sputtering method. Experiments were conducted to investigate the electrical properties of SCT thin films with various top electrode. C-F and C-V measurements show that SCT thin films annnealed at 600$^{\circ}C$ have a larger capacitance than SCT thin films deposited at 400$^{\circ}C$ , and there is nearly no difference between top electrodes. I-V measurement show that Pt top electrode have a good leakage current density of < 10nA/$\textrm{cm}^2$,. making them suitable for DRAM application.

• Applied Science and Convergence Technology
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• 제24권3호
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• pp.72-76
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• 2015

Nickel oxide (NiO) thin films were grown on soda-lime glass substrates by RF magnetron sputtering method at room temperature (RT), and they were post-annealed at the temperatures of $100^{\circ}C$, $200^{\circ}C$, $300^{\circ}C$ and $400^{\circ}C$ for 30 minutes in vacuum. The electronic structure, optical and electrical properties of NiO thin films were investigated using X-ray photoelectron spectroscopy (XPS), reflection electron energy spectroscopy (REELS), UV-spectrometer and Hall Effect measurements, respectively. XPS results showed that the NiO thin films grown at RT and post annealed at temperatures below $300^{\circ}C$ had the NiO phase, but, at $400^{\circ}C$, the nickel metal phase became dominant. The band gaps of NiO thin films post annealed at temperatures below $300^{\circ}C$ were about 3.7 eV, but that at $400^{\circ}C$ should not be measured clearly because of the dominance of Ni metal phase. The NiO thin films post-annealed at temperatures below $300^{\circ}C$ showed p-type conductivity with low electrical resistivity and high optical transmittance of 80% in the visible light region, but that post-annealed at $400^{\circ}C$ showed n-type semiconductor properties, and the average transmittance in the visible light region was less than 42%. Our results demonstrate that the post-annealing plays a crucial role in enhancing the electrical and optical properties of NiO thin films.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2003년도 하계종합학술대회 논문집 II
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• pp.1045-1048
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• 2003

In this paper, we studied plasma damage of MIS capacitor with $Al_2$O$_3$ dielectric film. Using capacitor pattern with the same area but different perimeters, we tried to separate etching damage mechanism and to optimize the dry etching process. After etching both metal and dielectric layer by the same condition, leakage current and C-V measurements were carried out for Pt/A1$_2$O$_3$/Si structures. The flatband voltage shift was appeared in the C-V plot, and it was caused by the variation of the fixed interface charge and the interface trapped charge. From I-V measurement, it was found the leakage current along the periphery could not be ignored. Finally, we established the process condition of RF power 300W, 100mTorr, Ar/Cl$_2$ gas 60sccm as an optimal etching condition.

• 한국진공학회지
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• 제7권s1호
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• pp.140-148
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• 1998

We prepared $C_3N_4$ films by rf plasma enhanced chemical vapor deposition(PCVD) and alternating $C_3N_4$/TiN composite films by dc magnetron sputtering. X-ray diffraction (XRD) and transmission electron diffraction (TED) revealed that the structure of the films is amorphous or polycrystalline, depending on deposition conditions and heat treatment. X-ray photoelectron spectroscopy (XPS) and Fourier transform infrared (FTIR) spectroscopy confirmed the presence of $sp_3\; and sp _2$ hybridized C atoms bonded with N atoms in the tetrahedral and hexagonal configurations, respectively. Graphite-free $C_3N_4$ films were obtained by PCVD under optimal conditions. To prepare well crystallized $C_3N_4$ films by magnetron sputtering, we introduced negatively biased gratings in the sputtering system. CN films deposited at grating voltages (Vg) lower than 400V are amorphous. Crystallites of cubic and $\beta$-$C_3N_4$ were formed at increased voltages.